Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1991
12/04/1991EP0459876A1 Terminal adaptor as connector device
12/04/1991EP0459831A2 Method and device for mounting components on a printed circuit board
12/04/1991EP0459809A1 Polyimidosiloxane resin and composition thereof and method of applying same
12/04/1991EP0459745A2 Curing agent for epoxy resin
12/04/1991EP0459665A1 Manufacturing method for a multilayer wiring board
12/04/1991EP0459614A2 Epoxy resin composition
12/04/1991EP0459608A2 Photo-curable composition
12/04/1991EP0459452A2 Aromatic polyimide film laminated with metal foil
12/04/1991EP0459400A1 Electrical connector for electrically interconnecting two parallel substrates
12/04/1991EP0459054A1 Isothermal termination block having a multi-layer thermal conductor
12/04/1991EP0459024A2 Flux removal method
12/04/1991EP0458948A1 Peroxide composition for removing flux residue and method of using same.
12/04/1991EP0458916A1 Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil.
12/04/1991EP0458871A1 Composite solder article
12/04/1991EP0458863A1 Method and apparatus for manufacturing interconnects with fine lines and spacing
12/04/1991CN1056793A Method for producing printed circuit board
12/04/1991CN1015038B Electrical connector
12/04/1991CN1015005B Production of metallic structures on nonconductors
12/03/1991US5070529 Apparatus for sequential interconnection of electrical circuit boards
12/03/1991US5070046 Multilayer electronic circuits
12/03/1991US5070002 Photoimageable permanent resist
12/03/1991US5070000 Diacetoneacrylamide as essential monomer
12/03/1991US5069979 Plated copper alloy material
12/03/1991US5069954 Offset printing pad, heat activated adhesive, for decoration o f ceramics
12/03/1991US5069745 Process for preparing a combined wiring substrate
12/03/1991US5069730 Water-soluble soldering paste
12/03/1991US5069640 Miniature bulb assembly and method of producing the same
12/03/1991US5069628 Flexible electrical cable connector with double sided dots
12/03/1991US5069626 Plated plastic castellated interconnect for electrical components
12/03/1991US5069213 Oximeter sensor assembly with integral cable and encoder
12/03/1991US5069195 Apparatus for automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits
12/03/1991US5068958 Method and apparatus for changing tools in an automated machine tool
12/01/1991CA2040628A1 Epoxy resin composition
12/01/1991CA2037077A1 Photo-curable composition
11/1991
11/28/1991WO1991018491A1 Process for the production of a multilayer printed circuit board
11/28/1991WO1991018490A1 Process and device for positionally precise soldering of parts to be soldered on a supporting plate
11/28/1991WO1991018489A1 Gtab manufacturing process and the product produced thereby
11/28/1991WO1991018416A1 Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction
11/28/1991WO1991018415A1 Circuit board for mounting ic and mounting method thereof
11/28/1991WO1991018071A1 Dispersion-based heat-seal coating
11/28/1991WO1991017840A1 Process for making fine conductor lines
11/28/1991DE4115160A1 Light and compact display-frame for lap-top computer - uses ribbon-cables across gap between circuit-board and display
11/28/1991DE4034690A1 Direct pressure connector esp. for flexible circuit boards - exerts strong retentive force from eccentric lever onto overlapped ends mutually aligned by clamping strip
11/28/1991DE4016992A1 Printing screen for electric elements on irregular boards - is shaped by inelastic imprint from rubber overlay for fitting to areas between crossing structures
11/28/1991DE4016953A1 Electronic device with electromagnetic screening - using insulating and conductive pref. epoxy¨ resin layers
11/28/1991DE4016696A1 Vorrichtung und verfahren zum positionsgenauen loeten von loetteilen auf einen traeger Apparatus and method for precise positioning soldering soldering parts onto a traeger
11/27/1991EP0458740A1 Adhesion of foils of polyimides, adhesives and printed circuits
11/27/1991EP0458471A2 Low leaching UV curable sealant and encapsulant with post cure mechanism
11/27/1991EP0458458A1 High density planar interconnect
11/27/1991EP0458293A1 Multilayer wiring board and method for manufacturing the same
11/27/1991EP0458279A2 Cleaning solvent
11/27/1991EP0458163A2 Method and apparatus for reflow-soldering of electronic devices on a circuit board
11/27/1991EP0458092A2 Curved array ultrasonic transducer assembly and its method of manufacture
11/27/1991EP0457985A1 Microwave semiconductor device
11/27/1991EP0457984A1 Pin-holding device for use in connecting a pin
11/27/1991EP0457920A1 Method of manufacturing minute metallic balls uniform in size
11/27/1991EP0457841A1 Apparatus and method for dispensing solution to prevent smear in the manufacture of printed circuit boards
11/26/1991US5068712 Semiconductor device
11/26/1991US5068509 High frequency thermode driven device employing one-turn-secondary transformers
11/26/1991US5068307 Polyamideimides containing 3,4'-diamino-diphenylether as diamine component and process for preparing the same
11/26/1991US5068263 Resin composition curable with an active energy ray containing graft copolymerized polymer with trunk chain containing dicyclopentenyl group
11/26/1991US5068262 A resin curable with ultraviolet radiation or electron beams capable of forming patterns on copper coated laminates for use as a printed board
11/26/1991US5068260 A resin curable with ultraviolet radiation or electron beams capable of forming patterns on copper coated laminates for use as a printed board
11/26/1991US5068259 Resin composition curbable with an active energy ray containing epoxy resin and monomer with ethylenically unsaturated bond
11/26/1991US5068258 A resin curable with ultraviolet radiation or electron beams capable of forming patterns on copper coated laminates for use as a printed board
11/26/1991US5068257 A resin curable with ultraviolet radiation or electron beams capable of forming patterns on copper coated laminates for use as a printed board
11/26/1991US5068040 Cleaning a substrate by exposing to ultraviolet radiation to produce a photochemical reaction to remove undesirable material
11/26/1991US5068013 Electroplating composition and process
11/26/1991US5067983 Immersion of a vessel containing an objest to be cleaned into a tank to prevent combustion
11/26/1991US5067917 Component mounting frame
11/26/1991US5067905 Electric connection box
11/26/1991US5067859 Method for drilling small holes in printed circuit boards
11/26/1991US5067648 Apparatus for holding printed circuit boards during wave soldering and processing
11/26/1991US5067433 Apparatus and method for applying solder to an electrical component
11/26/1991US5067229 Cutting device for use in manufacturing electronic components
11/26/1991CA1292473C Copolymerisable dibenzalacetone palladium complexes and the use thereof
11/26/1991CA1292409C Thin-film coating method and apparatus therefor
11/24/1991CA2042153A1 Bonding of polymide films, and printed circuit boards
11/23/1991CA2036728A1 Sticking apparatus
11/21/1991EP0457722A2 Compositions of epoxide resins and polyamide-polyimide blockcopolymers
11/21/1991EP0457583A2 Multilayer interconnection substrate
11/21/1991EP0457501A2 Method of manufacturing a multilayer wiring board
11/21/1991EP0457346A1 Method for dip-soldering printed circuit boards
11/21/1991EP0457339A2 Method and apparatus for the production of circuit boards
11/21/1991EP0457338A1 IC card
11/21/1991EP0457253A2 Cantilever stylus for use in an atomic force microscope and method of making same
11/21/1991EP0457180A2 Process for metallising a through-hole board
11/21/1991EP0457071A2 Process for generating fine conductor lines
11/21/1991EP0456972A1 Surface modification of a polyimide
11/21/1991EP0456908A1 Process for activating substrate surfaces for electroless plating
11/21/1991EP0456887A2 Electrical circuit
11/21/1991EP0456883A1 Process and apparatus for coating and continuous lamination
11/21/1991EP0456870A1 Device for chemical treatment and/or cleaning of materials, especially of printed circuit boards with holes and procedure of this treatment
11/21/1991EP0456791A1 Methods of plating into holes and products produced thereby
11/21/1991DE4115883A1 Simplified casing process for embedded electrode assembly - using separable web to support electrodes and support pins to hold assembly while melted plastic is cast
11/21/1991DE4115738A1 Metal clamp for electrically connecting circuit track - connects two separate tracks on opposite sides of circuit board
11/21/1991DE4016089A1 Device for removing dust from substrate surface for PCB mfr. - blows dust away by compressed air jets and removes by suction
11/21/1991DE4016088A1 Drilling holes in multilayer circuit boards - using drill with several drill bits connected to each other but independently controllable for adaption to position of layers
11/21/1991DE4015943A1 Device for connecting film to circuit board - has film held in electrical and mechanical connection with board by block and clamp
11/21/1991DE4015941A1 Increased contrast, auto visual controlled chip mounting - using fluorescent liquid on chip legs to enable camera to accurately control positioning of chips on high density circuit board
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