| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/19/1992 | EP0513376A1 Cubic molded article with built-in cubic conductor circuit and production method thereof |
| 11/19/1992 | EP0513366A1 Device for soldering |
| 11/19/1992 | EP0513218A1 Improved method and means for producing photomasks |
| 11/19/1992 | EP0513034A1 Gas curtain additives and zoned tunnel for soldering. |
| 11/19/1992 | EP0288507B1 Process for preparing multilayer printed circuit boards |
| 11/19/1992 | DE4132996A1 Contact pin with solder tag for circuit board - has slit in underside of tag with varying width for reception and retention of liq. solder |
| 11/18/1992 | CN1066361A Mfg. method for foil type electric heating element |
| 11/18/1992 | CN1066289A Composition based on 1,1-dichloro-1-fluoroethane, 1,1,1,3,3-pentafluorobutane and methanol for cleaning and/or drying solid surface |
| 11/18/1992 | CN1066288A Composition based on 1,1,1,3,3-pentafluorobutane and methane for cleaning and/or drying solid surface |
| 11/18/1992 | CN1019121B Method for treating surface of molded polyacetal resin product |
| 11/17/1992 | US5165056 Transformer winding form with an insertion-type leader frame |
| 11/17/1992 | US5164994 Solder joint locator |
| 11/17/1992 | US5164916 High-density double-sided multi-string memory module with resistor for insertion detection |
| 11/17/1992 | US5164907 Computer aided design system capable of placing functional blocks with a circuit constraint satisfied |
| 11/17/1992 | US5164818 Removable vlsi assembly |
| 11/17/1992 | US5164816 Polyamides, polyimides |
| 11/17/1992 | US5164699 Resistor structure in a cofired unitized multilayer circuit structure |
| 11/17/1992 | US5164692 Triplet plated-through double layered transmission line |
| 11/17/1992 | US5164566 Method and apparatus for fluxless solder reflow |
| 11/17/1992 | US5164565 Repair system for microcircuits |
| 11/17/1992 | US5164284 Lamination of multilayer photoresist containing sheet to printed circuit with irregular surface |
| 11/17/1992 | US5164246 For semiconductors, aluminum nitride ceramics, electroconduc-tive coating, metal nitride, tungsten and molybdenum |
| 11/17/1992 | US5164235 Treating copper with chromium and zinc ions |
| 11/17/1992 | US5164141 Of thermoplastic polymers, reinforcement fibers, metals, pressing endless sheets at temperature above melting point |
| 11/17/1992 | US5164033 Electro-chemical etch device |
| 11/17/1992 | US5164022 Dispenser with heater for vaporizing flux |
| 11/17/1992 | US5163836 Integrated connector module with conductive elastomeric contacts |
| 11/17/1992 | US5163835 Contact assembly with grounding conductor support |
| 11/17/1992 | US5163834 High density connector |
| 11/17/1992 | US5163605 Method for mounting components to a circuit board |
| 11/17/1992 | US5163599 Reflow soldering apparatus |
| 11/17/1992 | US5163363 Device for multiple-point application of equal forces |
| 11/17/1992 | US5163220 Method of enhancing the electrical conductivity of indium-tin-oxide electrode stripes |
| 11/17/1992 | CA1310175C Process for making an electrically conductive pattern on insulating surface of complex form |
| 11/12/1992 | WO1992020204A1 Means for the selective formation of a thin oxidising layer |
| 11/12/1992 | WO1992020203A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 11/12/1992 | WO1992020100A1 A ceramic substrate having a protective coating and method of protection |
| 11/12/1992 | WO1992020097A1 Semiconductor device and manufacturing method therefor |
| 11/12/1992 | WO1992019462A1 Process for the manufacture of an interconnect circuit |
| 11/12/1992 | WO1992019416A1 Solder leveller |
| 11/12/1992 | DE4114701A1 Electrical connector laminate for flat components, e.g. PCB and LCD - using metal- or graphite-coated hard mineral particles to provide conductivity perpendicular to it plane |
| 11/12/1992 | CA2102626A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 11/11/1992 | EP0512885A1 Composition based on 1,1,1,3,3-pentafluorobutane and methanol for cleaning and/or drying of hard surfaces |
| 11/11/1992 | EP0512884A1 Composition based on 1,1-dichloro-1-fluoroethane, 1,1,1,3,3-pentafluorobutane and methanol used for cleaning and/or drying of hard surfaces |
| 11/11/1992 | EP0512546A1 Anisotropically conductive material and method for connecting integrated circuits by using the same |
| 11/11/1992 | EP0512386A1 High adhesion performance roll sputtered strike layer |
| 11/11/1992 | EP0512296A1 Method of depositing conductors in high aspect ratio apertures under high temperature conditions |
| 11/11/1992 | EP0288491B1 Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein |
| 11/11/1992 | EP0280700B1 Circuit package attachment apparatus and method |
| 11/11/1992 | CN2121792U Internally heating blade |
| 11/10/1992 | US5163005 Method of cloning printed wiring boards |
| 11/10/1992 | US5162979 Personal computer processor card interconnect system |
| 11/10/1992 | US5162975 Integrated circuit demountable TAB apparatus |
| 11/10/1992 | US5162971 High-density circuit module and process for producing same |
| 11/10/1992 | US5162729 Embedded testing circuit and method for fabricating same |
| 11/10/1992 | US5162613 Integrated circuit interconnection technique |
| 11/10/1992 | US5162439 Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents |
| 11/10/1992 | US5162438 Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents |
| 11/10/1992 | US5162260 Stacked solid via formation in integrated circuit systems |
| 11/10/1992 | US5162257 Forming intermetallic between solder bump and contact pad |
| 11/10/1992 | US5162240 Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate |
| 11/10/1992 | US5162194 Method of providing a printed circuit board with a cover coat |
| 11/10/1992 | US5162191 Print heads |
| 11/10/1992 | US5162144 Process for metallizing substrates using starved-reaction metal-oxide reduction |
| 11/10/1992 | US5162140 Flexible printed circuit board and coverlay film and manufacture methods therefor |
| 11/10/1992 | US5162087 Acrylic-Maleimide Interpolymer, Metallic Layer Particles |
| 11/10/1992 | US5162071 Adjustable film cutoff unit |
| 11/10/1992 | US5162062 Method for making multilayer electronic circuits |
| 11/10/1992 | US5161986 Low inductance circuit apparatus with controlled impedance cross-unders and connector for connecting to backpanels |
| 11/10/1992 | US5161981 Foldable stacking connector |
| 11/10/1992 | US5161728 Coating on the ceramic a layer of metallizing composition, assembling metal with coated ceramic, heating to melt and cause reactions between composition ingredients and ceramic, keeping molten to allow liquid diffusion; dense, defect-free |
| 11/10/1992 | US5161727 Device for providing a non-oxidizing atmosphere above a soldering bath of a machine for wave soldering |
| 11/10/1992 | US5161403 Method and apparatus for forming coplanar contact projections on flexible circuits |
| 11/10/1992 | US5161305 Preparing aluminum nitride sintered body substrate, removing part of body by directing water jet to substrate surface |
| 11/10/1992 | US5161304 Method for packaging an electronic circuit device |
| 11/10/1992 | CA1310155C Process for the amionic polymerisation of acrylic monomers, and eventually of vinylic comonomers |
| 11/10/1992 | CA1310138C Surface mount technology breakaway self regulating temperature heater |
| 11/10/1992 | CA1310137C Self regulating temperature heater with thermally conductive extensions |
| 11/10/1992 | CA1309847C Tag and method of making same |
| 11/05/1992 | DE4114391A1 Oberflaechenmontierbares elektronisches bauelement und verfahren zu seiner herstellung Oberflaechenmontierbares electronic component and method for its preparation |
| 11/05/1992 | DE4114284A1 Workpiece handling arrangement esp. for PCB, etc. - aligns workpieces in trays before they reach processing station using camera and alignment arrangement |
| 11/05/1992 | DE4113653A1 Combined catalyst and fixing bath for prodn. of poly:pyrrole layers - comprises aq. soln. contg. pyrrole (deriv.) and phosphoric acid, buffered with N-mthyl-pyrrolidone and/or borax or citrate |
| 11/04/1992 | WO1992020207A1 Electrical interconnect apparatus |
| 11/04/1992 | WO1992020079A1 Coil former and process for procucing it |
| 11/04/1992 | EP0511813A2 Heat-resistant adhesive and method of adhesion by using adhesive |
| 11/04/1992 | EP0511691A2 Wet etching of chemically cured polyimide |
| 11/04/1992 | EP0511474A1 Electric connection for an electric motor |
| 11/04/1992 | EP0511334A1 Solder or conductive paste printing device. |
| 11/04/1992 | EP0511305A1 Method, system and composition for soldering by induction heating |
| 11/04/1992 | EP0511281A1 High density and multiple insertion connector. |
| 11/04/1992 | EP0509992A4 Electrical connectors |
| 11/04/1992 | CN1065953A Dielectric filter and mounting bracket assembly |
| 11/04/1992 | CN1065888A Method of depositing conductors in high aspect ratio apertures |
| 11/04/1992 | CN1065876A Encapulant composition |
| 11/04/1992 | CN1018962B Anisotropically conductive polymeric matrix |
| 11/04/1992 | CA2086669A1 Coil former and method of producing it |
| 11/04/1992 | CA2083278A1 Electrical interconnect apparatus |
| 11/03/1992 | US5161202 Method of and device for inspecting pattern of printed circuit board |
| 11/03/1992 | US5161093 Electronics |
| 11/03/1992 | US5161092 Circuit card assembly conduction converter |