Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1992
12/09/1992EP0517430A1 Plasma based soldering
12/09/1992EP0517400A1 Process for the manufacture of printed circuits using electrophoretically deposited organic resists
12/09/1992EP0517399A1 Process for manufacturing printed circuit employing selective provision of solderable coating
12/09/1992EP0517349A1 Method and apparatus for charging and discharging platelike products in and from a electrplaiting plant.
12/09/1992EP0517306A2 Heat actuated fuse apparatus with solder link
12/09/1992EP0517264A1 Electronic circuits and their fabrication
12/09/1992EP0517198A2 Thin film magnetic head structure and method of fabricating the same
12/09/1992EP0516866A1 Modular multilayer interwiring structure
12/09/1992EP0516819A1 Direct bonding of copper to aluminum nitride substrates.
12/09/1992EP0457841A4 Apparatus and method for dispensing solution to prevent smear in the manufacture of printed circuit boards
12/09/1992EP0385995B1 Embossing foil, in particular heat embossing foil, for producing conductive tracks on a substrate
12/09/1992EP0213205B1 Method of stacking printed circuit boards
12/09/1992CN1019369B Process and apparatus for producing copper-coated laminate
12/09/1992CN1019360B Method and apparatus for treating plate article by tiquid
12/08/1992WO1992021790A1 Fabricating metal articles from printed images
12/08/1992US5170326 Electronic module assembly
12/08/1992US5170245 Semiconductor device having metallic interconnects formed by grit blasting
12/08/1992US5170181 Laser scanning apparatus
12/08/1992US5170032 Radiation manufacturing apparatus and amendment
12/08/1992US5169692 Displacement plating; adding complexing agent
12/08/1992US5169493 Method of manufacturing a thick film resistor element
12/08/1992US5169477 Conveyor, solvent pump, nozzles for high pressure spraying, rinsing device; uniformity
12/08/1992US5169471 Auto electrical connecting circuit board assembly
12/08/1992US5169057 Impacting selected portion of gold plated surface with nickel containing abrasive particles prior to soldering
12/08/1992US5168624 Method of manufacturing printed wiring board
12/08/1992CA2102405A1 Fabricating metal articles from printed images
12/08/1992CA1311210C Production of copper-clad dielectric boards
12/06/1992CA2067710A1 Process for manufacturing printed circuits employing selective provision of solderable coating
12/03/1992DE4117851A1 Contact pin for multipoint engagement - has tip section shaped to provide four edge contacts pressed into contact hole in circuit board
12/03/1992DE4117486A1 Drill bit for long small dia. holes - has angled tip with second and third cutting angles and set groove angle
12/03/1992DE4117328A1 Protection of connectors against penetration of flux during soldering - by applying a foil of an adhesive to the underside of the connector and then melting the adhesive to seal gaps between pins and housing
12/02/1992EP0516579A1 Interface connection through an insulating part
12/02/1992EP0516482A1 Water-soluble flux for cored solder
12/02/1992EP0516402A1 Substrate provided with electric lines and its manufacturing method
12/02/1992EP0516344A1 Method to fill a cavity in a substrate
12/02/1992EP0516317A2 Method of locating work in automatic exposing apparatus
12/02/1992EP0516170A2 Semiconductor chip mounted circuit board assembly and method for manufacturing the same
12/02/1992EP0516096A2 Semiconductor device unit having holder and method of mounting semiconductor devices using holder
12/02/1992EP0515861A2 Ink composition for printing
12/02/1992EP0515775A2 Setting means for preselection of desired physical values
12/02/1992EP0515605A1 Process for producing through hole plated or multilayer printed circuit boards
12/02/1992EP0515472A1 Method and device for applying of pastes and adhesives.
12/01/1992US5168527 Miniature speaker variable standoff mount
12/01/1992US5168454 Formation of high quality patterns for substrates and apparatus therefor
12/01/1992US5168432 Adapter for connection of an integrated circuit package to a circuit board
12/01/1992US5168430 Flexible printed circuit connecting means for at least one hybrid circuit structure and a printed circuit board
12/01/1992US5168384 Miniature liquid crystal display device
12/01/1992US5168346 Method and apparatus for isolation of flux materials in flip-chip manufacturing
12/01/1992US5168302 Apparatus for permeating irradiated light
12/01/1992US5167997 Protected conductive foil assemblage and procedure for preparing same using static electrical forces
12/01/1992US5167992 Selective electroless plating process for metal conductors
12/01/1992US5167989 Process for coating surfaces made tacky beforehand
12/01/1992US5167913 Sintering without forming metal oxide
12/01/1992US5167779 Uniform plating of through-holes in printed circuits
12/01/1992US5167747 Apparatus for manufacturing interconnects with fine lines and fine spacing
12/01/1992US5167723 Thermocouple with overlapped dissimilar conductors
12/01/1992US5167513 Load limited pin for an electrical connector
12/01/1992US5167512 Multi-chip module connector element and system
12/01/1992US5167511 High density interconnect apparatus
12/01/1992US5167361 Method and apparatus for two sided solder cladded surface mounted printed circuit boards
12/01/1992CA1311064C Orbital wave soldering of printed circuit boards
11/1992
11/26/1992WO1992021223A1 Heat sink and electromagnetic interference shield assembly
11/26/1992WO1992021222A1 Device for producing an electric circuit, especially for a measuring probe, and a measuring probe
11/26/1992WO1992021167A1 Conductive elastomeric element electronic connector assembly
11/26/1992WO1992021051A1 Liquid crystal module
11/26/1992WO1992020984A1 Vacuum drying apparatus
11/26/1992WO1992020489A1 Methods and systems of preparing extended length flexible harnesses
11/26/1992WO1992013981A3 Selective process for printed circuit board manufacturing
11/26/1992DE4126877C1 Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds
11/26/1992DE4116543A1 Pressing multilayer circuit board without creasing copper@ foil - separating packets of layers for lamination between sheets of steel undergoing comparable thermal expansion
11/25/1992EP0515113A1 Process for apparatus for localized soldering to a ceramic substrate
11/25/1992EP0515090A1 Electrical connector having board retention means
11/25/1992EP0514770A1 Paste feeding apparatus
11/25/1992EP0514723A1 Electronic parts loaded module
11/25/1992EP0514630A1 Radiation crosslinkable coating and its use
11/24/1992US5166867 Bus bar for a circuit board
11/24/1992US5166864 Protected circuit card assembly and process
11/24/1992US5166774 Selectively releasing conductive runner and substrate assembly having non-planar areas
11/24/1992US5166753 Method for inspecting electronic devices mounted on a circuit board
11/24/1992US5166700 Thermal print head
11/24/1992US5166570 Electronic component
11/24/1992US5166493 Apparatus and method of boring using laser
11/24/1992US5166308 Condensation of tetracarboxylic acid and aromatic diamine, mixing, casting and extrusion with heating
11/24/1992US5166108 Low temperature-sintering porcelain components
11/24/1992US5166037 Applying a photoresist, exposure and development, copper plating
11/24/1992US5165987 Adapting frequency band of oscillating circuit made from a metal-plastic-metal sandwich foil and sandwich foil for implementing the process
11/24/1992US5165984 Stepped multilayer interconnection apparatus and method of making the same
11/24/1992US5165971 Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition
11/24/1992US5165962 Masking film composition and method of masking an article using same
11/24/1992EP0527740A4 Azeotropic composition of perfluoro-1,2-dimethylcyclobutane with 1,1-dichloro-1-fluoroethane.
11/24/1992CA1310781C High temperature release sheet for printed circuit boards
11/19/1992EP0514097A1 Pressure foot insert changer
11/19/1992EP0514074A2 Method of producing copper-clad laminated board
11/19/1992EP0514066A1 Electrical connector with improved retention feature
11/19/1992EP0513965A1 Exposure apparatus for forming pattern on printed-wiring board
11/19/1992EP0513831A1 Method for use of preflux, printed wiring board, and method for production thereof
11/19/1992EP0513821A2 Method of producing metallic thin film
11/19/1992EP0513743A2 Semiconductor package for surface mounting
11/19/1992EP0513555A1 Device for baking printed substrates
11/19/1992EP0513522A2 Process and apparatus for welding components on printed circuit plates by means of a solder bath