| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/29/1992 | CA2070046A1 Metal foil with improved bonding to substrates and method for making said foil |
| 12/29/1992 | CA1312146C Printed circuit board with pin receiving portion |
| 12/29/1992 | CA1312040C Conformal coatings cured with actinic radiation |
| 12/27/1992 | CA2071662A1 Integrated socket-type package for flip-chip semiconductor devices and circuits |
| 12/24/1992 | DE4217811A1 Laser beam cutting device for cutting PCB holes - has reflector arrangement ensuring uniform beam distribution over mask surface |
| 12/24/1992 | DE4217076A1 Ceramic-filled fluoro:polymer for PCB use - contg. specified volume of filler coated with fluorinated and/or non-fluorinated silane, having improved flow properties |
| 12/24/1992 | DE4217075A1 Ceramic-filled fluoro:polymer composite for circuit board use - contains specific vol. of filler coated with zirconate or titanate to improve flow properties and chemical resistance at high pH |
| 12/24/1992 | DE4120723A1 Verfahren zur oberflaechenbehandlung von polyamid-formkoerpern und danach erhaltene formkoerper A method for the surface finishing of polyamide-formkoerpern and then obtained formkoerper |
| 12/24/1992 | DE4120076A1 Multilayered wiring prodn. - involves applying adhesive layer on substrate and structuring, and providing redn. in the amt. of steps needed |
| 12/23/1992 | WO1992022996A1 Electrical device with at least one contact pin and conductor track sheet |
| 12/23/1992 | WO1992022995A1 A circuit board having a lateral conductive pattern and shielded regions as well as a method of manufacturing such a board |
| 12/23/1992 | WO1992022941A1 Electrical connectors |
| 12/23/1992 | WO1992022684A1 Methods for manufacture of multilayer circuit boards |
| 12/23/1992 | WO1992022678A1 A composition and a process for removing rosin solder flux with terpene and hydrocarbons |
| 12/23/1992 | WO1992022430A1 A method and a system for layer-wise and pattern-wise controlled application of particulate material onto a receiving unit |
| 12/23/1992 | WO1992014346A3 Drilling printed circuit boards and entry and backing boards therefor |
| 12/23/1992 | EP0519767A2 A circuit board assembly |
| 12/23/1992 | EP0519676A2 Process of producing multiple layer glass-ceramic circuit board |
| 12/23/1992 | EP0519631A2 Both-side roughened copper foil with protection film |
| 12/23/1992 | EP0519432A2 Azeotrope-like mixture of 2-propanol and 1H-perfluorohexane |
| 12/23/1992 | EP0519431A2 Azeotrope-like mixture of methanol and 1H-perfluorohexane |
| 12/23/1992 | EP0519430A2 Process for curing thermosetting prepolymers |
| 12/23/1992 | EP0519262A1 Apparatus for electrophoretically painting platelike articles |
| 12/23/1992 | EP0519202A1 Electric device with at least one contact pin and one flexible printed circuit |
| 12/23/1992 | EP0519200A1 Connection of LLCCC structural elements for the space electronics |
| 12/23/1992 | EP0519177A2 A thermosetting adhesive film and a process for applying the same |
| 12/23/1992 | EP0519175A2 Method for making multilayer electronic circuits |
| 12/23/1992 | EP0236404B1 Manufacture of electrical circuits |
| 12/22/1992 | US5173844 Integrated circuit device having a metal substrate |
| 12/22/1992 | US5173843 Fan control and diode interlock for electric heaters |
| 12/22/1992 | US5173842 Electrical assembly with deformable bridge printed circuit board |
| 12/22/1992 | US5173840 Molded ic card |
| 12/22/1992 | US5173839 Heat-dissipating method and device for led display |
| 12/22/1992 | US5173574 Soldering connector and method for manufacturing an electric circuit with this soldering connector |
| 12/22/1992 | US5173542 Bistriazene compounds and polymeric compositions crosslinked therewith |
| 12/22/1992 | US5173457 Paste compositions |
| 12/22/1992 | US5173451 Soft bond for semiconductor dies |
| 12/22/1992 | US5173442 Masking, etching insulation; copper-polyimide substrate |
| 12/22/1992 | US5173441 Laser ablation deposition process for semiconductor manufacture |
| 12/22/1992 | US5173392 Forming a pattern on a substrate |
| 12/22/1992 | US5173369 For simplified connecting on inner leads of integrated circuits |
| 12/22/1992 | US5173354 Non-beading, thin-film, metal-coated ceramic substrate |
| 12/22/1992 | US5173330 Patterning composition and method for patterning on a substrate |
| 12/22/1992 | US5173269 Exposing residue in container to radiation to cure remaining acrylate |
| 12/22/1992 | US5173150 Process for producing printed circuit board |
| 12/22/1992 | US5173130 Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating |
| 12/22/1992 | US5173109 High speed plating, circuit boards |
| 12/22/1992 | US5173055 Area array connector |
| 12/22/1992 | US5172853 Method for applying solder to printed wiring boards and printed wiring board to which solder has been applied |
| 12/22/1992 | US5172852 Soldering method |
| 12/22/1992 | US5172755 Cooling apparatus for a heat generating device |
| 12/22/1992 | US5172473 Method of making cone electrical contact |
| 12/22/1992 | US5172472 Multi-layer rigid prototype printed circuit board fabrication method |
| 12/22/1992 | CA2071665A1 Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces |
| 12/22/1992 | CA2018496C Method of attaching electronic components |
| 12/22/1992 | CA1311854C Apparatus and method for high density interconnection substrates using stacked modules |
| 12/22/1992 | CA1311816C Contact member for electrical conductors |
| 12/22/1992 | CA1311808C Autoregulating multi contact induction heater |
| 12/22/1992 | CA1311642C Thin film peeling apparatus |
| 12/20/1992 | CA2071154A1 Surface roughening of resin molded articles for metallizing |
| 12/18/1992 | CA2066069A1 Method for making multilayer electronic circuits |
| 12/17/1992 | DE4119427A1 Compact circuit board for computer - has main board with pair of parallel slots to receive connectors for pair of expansion board connectors coupled to main board pins |
| 12/17/1992 | DE4119400A1 Viscous medium printing system on circuit carrier with circuit pattern - has printing template held by pivoting frame and observation device with semi-transparent mirror |
| 12/16/1992 | EP0518453A1 A method of making electrical circuit traces |
| 12/16/1992 | EP0518422A2 Method of selectively metallizing a pattern of a material other than glass on a glass substrate by electroless metallization |
| 12/16/1992 | EP0518317A1 Surface roughening of resin molded articles for metallizing |
| 12/16/1992 | EP0518142A1 Heat stable acrylamide polysiloxane composition |
| 12/16/1992 | EP0518005A2 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
| 12/16/1992 | EP0517767A1 A device for applying a solder paste, a glue or the like in patches on a substrate. |
| 12/16/1992 | EP0321510B1 Arrangement for holding a printed circuit board fixed to a frame |
| 12/16/1992 | CN1067138A Electronic detail mounting module |
| 12/15/1992 | US5172304 Capacitor-containing wiring board and method of manufacturing the same |
| 12/15/1992 | US5172301 Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same |
| 12/15/1992 | US5171964 High accuracy, high flexibility, energy beam machining system |
| 12/15/1992 | US5171902 Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions |
| 12/15/1992 | US5171826 Heat resistant adhesive composition and bonding method using the same |
| 12/15/1992 | US5171760 UV curable polymer formulation |
| 12/15/1992 | US5171709 Laser methods for circuit repair on integrated circuits and substrates |
| 12/15/1992 | US5171650 Having dynamic release layer, imaging radiation-ablative topcoat; laser induced; for color proofing/printing, rapid, sensitive |
| 12/15/1992 | US5171642 Multilayered intermetallic connection for semiconductor devices |
| 12/15/1992 | US5171608 Method of pattern transfer in photolithography using laser induced metallization |
| 12/15/1992 | US5170931 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| 12/15/1992 | US5170930 Liquid metal paste for thermal and electrical connections |
| 12/15/1992 | CA2071153A1 Surface roughening of resin molded articles for metallizing |
| 12/13/1992 | CA2067921A1 Method of making electrical circuit traces |
| 12/10/1992 | WO1992022192A1 Method of manufacturing a multilayer printed wire board |
| 12/10/1992 | WO1992022191A1 Printed wire boards and method of making same |
| 12/10/1992 | WO1992022090A1 Thermally conductive electronic assembly |
| 12/10/1992 | WO1992021481A1 Pressure foot for perforating machine for printed board |
| 12/10/1992 | WO1992021451A1 Printed circuit board cleaner |
| 12/10/1992 | WO1992017903A3 Three-dimensional multichip module systems and methods of fabrication |
| 12/10/1992 | WO1992014505A3 Piston-based ventilator design and operation |
| 12/10/1992 | DE4118974A1 Circuit board with projecting contact pins - uses preassembled holder fitted with contact pins subsequently soldered to circuit board conductor paths |
| 12/10/1992 | DE4118935A1 Elektrisches geraet mit wenigstens einem kontaktstift und einer leiterbahnfolie Electric geraet with at least one contact pin and a conductor track foil |
| 12/10/1992 | DE4118308A1 Circuit board structure with surface mounted devices - has main and auxiliary boards adhered together via electrically insulating adhesive |
| 12/10/1992 | CA2110679A1 Method of manufacturing a multilayer printed wire board |
| 12/10/1992 | CA2110678A1 Printed wire boards and method of making same |
| 12/09/1992 | EP0517641A1 Mask shock absorber pad |
| 12/09/1992 | EP0517560A2 Method of manufacturing a superconducting microwave component substrate |
| 12/09/1992 | EP0517445A1 Improved uniformity of copper etching in the fabrication of multilayer printed circuit boards |