| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/12/1993 | US5178934 Multilayer ceramic made by applying metal layer to ceramic substrate, applying over metal /1/green ceramic tape, layer of organic plasticizer-glass ceramic particle mixture, ceramic or glass/ceramic composite and /2/layer of hollow microspheres |
| 01/12/1993 | US5178914 Electroless metal deposition |
| 01/12/1993 | US5178802 Surface treatment of polyolefin objects |
| 01/12/1993 | US5178725 Method for working ceramic material |
| 01/12/1993 | US5178564 Electrical connector with solder mask |
| 01/12/1993 | US5178318 Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same |
| 01/12/1993 | US5178315 Soldering device for electronic elements |
| 01/12/1993 | US5178051 Magnetic punch die retention for HTCC/LTCC fabrication |
| 01/12/1993 | US5177863 Method of forming integrated leadouts for a chip carrier |
| 01/12/1993 | US5177841 Method of manufacturing ceramic layered product |
| 01/12/1993 | CA2030865C Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board |
| 01/12/1993 | CA1312678C Multilayer printed circuit board |
| 01/12/1993 | CA1312660C Electrical connection arrangement for flat cable |
| 01/07/1993 | WO1993000713A1 Process for producing a self-supporting thick film structure |
| 01/07/1993 | WO1993000707A1 Electronic package and method for lead forming |
| 01/07/1993 | WO1993000705A1 Package structure of semiconductor device and manufacturing method therefor |
| 01/07/1993 | WO1993000691A1 Bobbin for an electrical winding and method of manufacture thereof |
| 01/07/1993 | WO1993000456A1 Mildly basic accelerating solutions for direct electroplating |
| 01/07/1993 | WO1993000392A1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained |
| 01/07/1993 | EP0521738A2 Bath and method for the electroless plating of tin and tin-lead alloy |
| 01/07/1993 | EP0521720A1 Heat-dissipating multi-layer circuit board |
| 01/07/1993 | EP0521701A2 Through board connector having integral solder mask |
| 01/07/1993 | EP0521672A1 Integrated circuit interconnection technique |
| 01/07/1993 | EP0521649A2 Method of making patterns |
| 01/07/1993 | EP0521483A2 Printed circuit board and semiconductor chip carrier sheet |
| 01/07/1993 | EP0521343A1 Electronic device and its production method |
| 01/07/1993 | EP0521338A1 Method and arrangement for soldering surface mounted components on printed circuit boards |
| 01/07/1993 | EP0521144A1 Manufacturing multilayer ceramic substrate |
| 01/07/1993 | EP0411036B1 Ceramic plate (substrate) coated on at least one side with metal |
| 01/07/1993 | DE4217224A1 Film aus mit partikeln gefuelltem verbundmaterial und verfahren zu seiner herstellung Film with particles were full composite material and process for its manufacture |
| 01/07/1993 | DE4210400C1 Local copper@ deposition from organo:metallic film on substrate - by forming film from mixt. of copper acetate and copper formate in specified ratio and depositing film by laser irradiation |
| 01/07/1993 | DE4124226A1 Impregnating fabric with fluid e.g. resin for e.g. laminated PCB - by passing fabric into vacuum channel, for degassing, in the impregnating fluid, preventing bubbles |
| 01/07/1993 | DE4122327A1 Automatically mounting and soldering components on PCB - supplying components underneath board and soldering from above simultaneously |
| 01/07/1993 | DE4121390A1 Verfahren zum herstellen einer freitragenden dickschichtstruktur A method of manufacturing a cantilever thick layer structure |
| 01/06/1993 | CN2126536Y Insulative sealing arrangement of electronic circuit-board on domestic appliances |
| 01/05/1993 | US5177596 Electronic component mounting structures for fpc tape carrier and methods of separation and application |
| 01/05/1993 | US5177458 Dielectric filter construction having notched mounting surface |
| 01/05/1993 | US5177326 Lead wire array for a leadless chip carrier |
| 01/05/1993 | US5177324 In situ RF shield for printed circuit board |
| 01/05/1993 | US5177134 Tacking agent |
| 01/05/1993 | US5176852 Adhesive compositions |
| 01/05/1993 | US5176811 Electrodeposition, ammonium ion to reduce adhesion loss |
| 01/05/1993 | US5176784 Apparatus for bonding continuous thin film to discrete base plates and film cutting apparatus therefor |
| 01/05/1993 | US5176780 Method of bonding polyimide films and printed circuit boards incorporating the same |
| 01/05/1993 | US5176773 Method of manufacturing a ceramic carrier |
| 01/05/1993 | US5176772 Green tape with conductive paste is laminated on sintered ceramic substrate |
| 01/05/1993 | US5176759 Paste solder with minimized residue |
| 01/05/1993 | US5176757 1,1,2,2,3,3-hexafluorocyclopentane and use thereof in compositions and processes for cleaning |
| 01/05/1993 | US5176749 Preflux coating composition for copper |
| 01/05/1993 | US5176744 Crystallization inhibition |
| 01/05/1993 | US5176743 Organopalladium compounds, solvents, polyurethane elastomers |
| 01/05/1993 | US5176530 Miniature multiple conductor electrical connector |
| 01/05/1993 | US5176524 IC socket structure |
| 01/05/1993 | US5176349 Post retention arrangement |
| 01/05/1993 | US5176312 Selective flow soldering apparatus |
| 01/05/1993 | US5176309 Oxidation to form copper-cuprous oxide eutectic alloy interface layer; bonding and peel strength |
| 01/05/1993 | US5176307 Wave soldering in a protective atmosphere enclosure over a solder pot |
| 01/05/1993 | US5176254 Terminal support system |
| 01/05/1993 | US5176158 Apparatus and method for transporting materials which are to be chemically treated |
| 01/05/1993 | US5176078 Screen printing machine |
| 01/05/1993 | US5176076 Screen printer |
| 01/05/1993 | CA1312387C Hybrid printed circuit board |
| 01/03/1993 | CA2072817A1 Multi-layer circuit board |
| 12/30/1992 | EP0520841A1 Composite flip chip semi-conductor device and method for making and burning-in the same |
| 12/30/1992 | EP0520740A1 Electrically connectable module |
| 12/30/1992 | EP0520682A1 Personal data card fabricated from a polymer thick-film circuit |
| 12/30/1992 | EP0520640A1 Metal foil with improved peel strength and method for making said foil |
| 12/30/1992 | EP0520490A1 Integrated circuit device having improved post for surface-mount package |
| 12/30/1992 | EP0520437A1 Method of printing an image on a substrate particularly useful for producing printed circuit boards |
| 12/30/1992 | EP0520434A1 Integrated socket-type package for flip chip semiconductor devices and circuits |
| 12/30/1992 | EP0520421A2 Immersion tin/lead alloy plating bath |
| 12/30/1992 | EP0520324A1 Apparatus for treating panel-type objects, especially circuit boards |
| 12/30/1992 | EP0520323A1 Apparatus for treating panel-type objects |
| 12/30/1992 | EP0520318A1 surface roughening of resin molded articles for metallizing |
| 12/30/1992 | EP0520195A2 Electroplating process and composition |
| 12/30/1992 | EP0520065A1 High temperature flashpoint, stable cleaning composition |
| 12/30/1992 | EP0519935A1 Ternary azeotropic compositions of dichloropentafluoropropane and trans-1,2-dichloroethylene with methanol or ethanol or isopropanol. |
| 12/30/1992 | CA2072530A1 Method of making patterns |
| 12/29/1992 | US5175668 Circuit board for a component requiring heat sinkage |
| 12/29/1992 | US5175612 Heat sink for semiconductor device assembly |
| 12/29/1992 | US5175609 Structure and method for corrosion and stress-resistant interconnecting metallurgy |
| 12/29/1992 | US5175532 Optical drill collar position verifier |
| 12/29/1992 | US5175504 Method and apparatus for automatically inspecting and repairing a simple matrix circuit panel |
| 12/29/1992 | US5175491 Integrated circuit testing fixture |
| 12/29/1992 | US5175410 IC package hold-down fixture |
| 12/29/1992 | US5175409 Self-soldering flexible circuit connector |
| 12/29/1992 | US5175399 Copper conductor laminated to substrate which also has organic dielectric, heat and chemical resistance |
| 12/29/1992 | US5175240 Aromatic homopolyimide or copolyimide films having low water absorption and high thermal durability |
| 12/29/1992 | US5175060 Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same |
| 12/29/1992 | US5175047 Prepregs having smooth flat surface layers of copper bonded to cut-out glass fiber-epoxy resin layer which is covered by flexible polyimide layer, for photoresists, accuracy |
| 12/29/1992 | US5175044 Sheet-like ceramic substrate for tip parts |
| 12/29/1992 | US5175024 Removal of oxide layers by treatment with an amine and reduction with catechol compound |
| 12/29/1992 | US5175023 Method for forming insulating coating material for electronic circuit board |
| 12/29/1992 | US5174886 High-throw acid copper plating using inert electrolyte |
| 12/29/1992 | US5174847 Process for the production of a circuit arrangement on a support film |
| 12/29/1992 | US5174842 Method for laminating ceramic green sheets |
| 12/29/1992 | US5174766 Electrical connecting member and electric circuit member |
| 12/29/1992 | US5174020 Remelting process for printed circuit boards |
| 12/29/1992 | CA2072521A1 Miniature hearing aid to be worn on the head, and a method for the manufacture thereof |
| 12/29/1992 | CA2070047A1 Metal foil with improved peel strength and method for making said foil |