| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/02/1993 | CA1313426C Adapter for electronic testing equipment for circuit boards and similar |
| 02/02/1993 | CA1313425C Automatic routing method using prioritized routability indices |
| 01/28/1993 | DE4224567A1 Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin |
| 01/28/1993 | DE4224070A1 Adhesive for circuit board - comprises cured resin powder in uncured resin matrix, with both resin being heat resistant and insol. in acid or oxidant |
| 01/28/1993 | DE4125018A1 Elektrische verbindung, insbesondere durchkontaktierung bei einer leiterplatte Electrical connection, in particular through connection with a circuit board |
| 01/28/1993 | DE4124699A1 Deposition of copper@-contg. layer on substrate - carried out by decomposition of new substd. cyclopentadienyl copper alkyl- or aryl-isonitrile cpd. |
| 01/28/1993 | DE4124455A1 Multilayer circuit board assembly for HF signal transmission - has two modules consisting of circuit boards with signal and reference tracks separated by insulating boards |
| 01/28/1993 | DE4124246A1 Reinigungsmittel fuer elektronische und elektrische baugruppen Cleaning agents for electronic and electrical assemblies |
| 01/27/1993 | EP0524812A2 Method and apparatus for connecting a device to a printed circuit board |
| 01/27/1993 | EP0524761A1 Plastic pin grid array package |
| 01/27/1993 | EP0524430A1 Device for mounting an LC-Display on a circuit board |
| 01/27/1993 | EP0524422A2 Tin lead treatment |
| 01/27/1993 | EP0524331A1 Soldering procedure |
| 01/27/1993 | EP0524250A1 Resist material for use in thick film resists |
| 01/27/1993 | EP0524248A1 Solder-bearing lead |
| 01/27/1993 | EP0497871A4 Method of manufacturing a multilayered circuit board |
| 01/27/1993 | EP0471034A4 Twisted wire jumper electrical interconnector |
| 01/27/1993 | EP0429451B1 Azeotropähnliche bestandteile von dichlortrifluoräthan, methanol und nitromethan |
| 01/26/1993 | US5182700 Method and apparatus for connecting a device to a printed circuit board |
| 01/26/1993 | US5182421 Printed wiring board with test pattern for through holes |
| 01/26/1993 | US5182230 Laser methods for circuit repair on integrated circuits and substrates |
| 01/26/1993 | US5182188 Method of developing a self-developing resist |
| 01/26/1993 | US5182135 Process for improving the adherency of metallic coatings deposited without current on plastic surfaces |
| 01/26/1993 | US5182121 Hot press |
| 01/26/1993 | US5182078 Metal treatment |
| 01/26/1993 | US5182042 Removing flux from printed circuit boards |
| 01/26/1993 | US5181984 Production of solder masked electric circuit boards |
| 01/26/1993 | US5181854 Press-contact type electric connector for a flat, flexible cable |
| 01/26/1993 | US5181853 Fluid pressure actuated electrical connector |
| 01/26/1993 | US5181770 Electrodeposition of copper metals from sulfuric acid solution |
| 01/26/1993 | US5181648 Method and apparatus for vapor phase soldering and cleaning products |
| 01/26/1993 | US5181317 Method of making an engineering change to a printed wiring board |
| 01/26/1993 | CA1313118C Laminator |
| 01/23/1993 | CA2074233A1 Method and apparatus for connecting a device to a printed circuit board |
| 01/21/1993 | WO1993001701A1 Circuit card assembly conduction converter and method |
| 01/21/1993 | WO1993001699A1 Method for cleaning printed circuit boards and apparatus for use by the method |
| 01/21/1993 | WO1993001634A2 Electrical connection system |
| 01/21/1993 | WO1993001248A1 Anisotropic conductive adhesive film |
| 01/21/1993 | DE4223280A1 Switching circuit carrier component - comprising appts. arranged between electrodes of two carriers |
| 01/21/1993 | DE4124053A1 Verfahren zum herstellen einer haftverbindung zwischen wenigstens einem bauteil und einem metallischen substrat A method for producing an adhesive connection between at least one component and a metallic substrate |
| 01/21/1993 | DE4123987A1 Lead connection system for circuit board surface mounted device - uses preheating of soldering paste, conductor paths and component lead wires |
| 01/21/1993 | DE4123985A1 Circuit board electrolytic treatment appts. - has contact brushes protected against electrodeposition |
| 01/21/1993 | DE4123870A1 Monitoring electronic assemblies with components on base carrier - measuring temp. at widely different points on carrier from variation in voltage applied to thermo-wires to detect burn through of components or conductor paths in module |
| 01/21/1993 | DE4123562A1 Circuit board conductor path repair system - uses conductive wire or band attached to carrier strip with lower melting point |
| 01/21/1993 | DE4123407A1 Compact HF current supply, esp. for lap top computer or fax machine - has components mounted on foldable circuit board halves which, when folded, cause components to face each other |
| 01/21/1993 | DE4123370A1 Method for producing electrical circuits based on flexible conductor plates - has rear side of copper@ laminated flexible basic material connected to mechanically stable auxiliary carrier with low heat expansion |
| 01/21/1993 | CA2113090A1 Anisotropic conductive adhesive film |
| 01/20/1993 | EP0523981A1 Method of making electronic packages and smart structures formed by thermal spray deposition |
| 01/20/1993 | EP0523945A1 Photosensitive elastomer polymer composition for flexographic printing plates |
| 01/20/1993 | EP0523892A1 Cleaning compositions |
| 01/20/1993 | EP0523791A2 Method of providing a copper pattern on a dielectric substrate |
| 01/20/1993 | EP0523598A1 Ceramics circuit board |
| 01/20/1993 | EP0523479A2 Method for fabricating metal core layers for a multi-layer circuit board |
| 01/20/1993 | EP0523270A1 Method to control a positioning system |
| 01/20/1993 | EP0494913A4 Electro-active cradle circuits for the detection of access or penetration |
| 01/20/1993 | CN1068155A Metal foil with improved bonding to substrates and method for making said foil |
| 01/20/1993 | CN1068154A Metal foil with improved peel strength and method for making said foil |
| 01/19/1993 | US5181065 Flexible printed board for use in cameras |
| 01/19/1993 | US5180888 Conductive bonding agent and a conductive connecting method |
| 01/19/1993 | US5180639 Nitration, Ammonolysis |
| 01/19/1993 | US5180627 Heat resistant adhesive composition |
| 01/19/1993 | US5180625 Ceramic aluminum laminate and thermally conductive adhesive therefor |
| 01/19/1993 | US5180611 Dry film solder masking technique |
| 01/19/1993 | US5180523 Polymer carriers, fillers, mixing and agglomeration to form powder particles |
| 01/19/1993 | US5180513 Shielded plastic enclosure to house electronic equipment |
| 01/19/1993 | US5180465 Etching method of forming microcircuit patterns on a printed circuit board |
| 01/19/1993 | US5180440 Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes |
| 01/19/1993 | US5180311 Resilient interconnection bridge |
| 01/19/1993 | US5180097 Method of mounting an electronic part onto a printed circuit board |
| 01/19/1993 | US5180096 Method and apparatus for reflow-soldering of printed circuit boards |
| 01/19/1993 | US5179777 Method of making multilayer printed wiring boards |
| 01/19/1993 | CA2073733A1 Cleaning compositions |
| 01/19/1993 | CA1312912C Apparatus for protecting electrical lines in a distributor of a telecommunication installation |
| 01/17/1993 | CA2073155A1 Dual curing composition and use thereof |
| 01/16/1993 | CA2073787A1 Electronic packages and smart structures formed by thermal spray deposition and method of making same |
| 01/16/1993 | CA2073156A1 Photosensitive elastomer polymer compositions for flexographic printing plates |
| 01/14/1993 | DE4221689A1 Elektronikmodul-sockel mit federnd nachgiebigem verriegelungsglied Electronics module with socket of resilient locking member |
| 01/14/1993 | DE4121304A1 Cleaning agent for removing pastes from thick layer hybrid technology substrates - comprising water, limonene and surface active additives, is non-toxic and allows use of ultrasound |
| 01/13/1993 | EP0522633A2 Electric lamp having a cap of synthetic resin |
| 01/13/1993 | EP0522622A1 Composite green ceramic layer |
| 01/13/1993 | EP0522600A2 Chip type capacitor |
| 01/13/1993 | EP0522593A1 Method of mounting electronic part on circuit substrate and circuit substrate including electronic parts mounted thereon |
| 01/13/1993 | EP0522026A1 Solder delivery system. |
| 01/13/1993 | EP0521982A1 Method for producing a printed circuit board. |
| 01/13/1993 | EP0521935A1 Coating material with negative effect, which can be developed in water, precipitated by electrophoresis and hardened by light, and its use to manufacture conductive tracks |
| 01/13/1993 | EP0521904A1 Modification of polymer surfaces |
| 01/13/1993 | EP0476065A4 Method for improving the insulation resistance of printed circuits |
| 01/13/1993 | CN1068007A Making method fo multi-layer electronic circuit |
| 01/13/1993 | CN1067846A Copper and resin bonding method |
| 01/13/1993 | CA2072702A1 Aqueous photosensitive resin composition and print obtained by using the same |
| 01/12/1993 | US5179601 Method of manufacturing circuit structure by insert molding of electric and/or optical transmission medium |
| 01/12/1993 | US5179501 Laminated electronic module assembly |
| 01/12/1993 | US5179366 End terminated high power chip resistor assembly |
| 01/12/1993 | US5179171 Ethylene-Fused Cycloolefin Graft Polymer |
| 01/12/1993 | US5178988 Photoimageable permanent resist |
| 01/12/1993 | US5178976 Technique for preparing a photo-mask for imaging three-dimensional objects |
| 01/12/1993 | US5178965 Copper printed circuit coated with tin-lead solder |
| 01/12/1993 | US5178962 Copper on polyimide with good adhesion and forming functional groups on surface films |
| 01/12/1993 | US5178957 Noble metal-polymer composites and flexible thin-film conductors prepared therefrom |
| 01/12/1993 | US5178956 Pretreatment process for electroless plating of polyimides |