Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/1993
02/23/1993US5189261 Electrical and/or thermal interconnections and methods for obtaining such
02/23/1993US5188723 Selective electro-deposition and circuit patterning technique
02/23/1993US5188669 Circuit board coating apparatus with inverting pallet shuttle
02/23/1993US5188282 Vapor phase flash fusing of printed wiring boards
02/23/1993US5188280 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
02/23/1993CA1313913C Apparatus for inspecting printed circuit boards with surface mounted components
02/20/1993CA2076273A1 Coating composition for parts
02/18/1993WO1993003593A1 Electrical connection, especially through contacts on a printed circuit board
02/18/1993WO1993003592A1 Connector for printed circuit boards
02/18/1993WO1993003197A1 Improved method and solution for direct copper writing
02/18/1993WO1993002831A1 Solder plate reflow method for forming a solder bump on a circuit trace
02/18/1993DE4132252C1 Pin-shaped contact element for mounting electronic components on PCB - has predetermined break point above or at same height of fastening edge, breaking under twisting or shearing moment
02/18/1993DE4127441A1 Use of amino:carboxylate(s) and betaine(s) - as additives for drilling milk used to punch printed circuit boards
02/18/1993DE4127009A1 Testing photopolymer masks on glass-reinforced epoxide PCB - by applying needle of dial gauge with recording instrument to spots on surface and measuring movements when they are suitably heated
02/18/1993DE4126574A1 Contact pin for printed circuit board or SMD technology - has cross=section formed in pressing operation to provide contact points on multiple sides
02/17/1993EP0527616A1 Improvements in or relating to dies
02/17/1993EP0527522A1 Soldering device with shield of gas substantially excluding oxygen
02/17/1993EP0527472A1 Structure for welding electrical connecting portions to each other using laser light beam
02/17/1993EP0527352A1 Screen-printable thick film paste composition
02/17/1993CN1069157A Method for forming vias in multilayer circuits
02/17/1993CA2049384A1 Multiple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing tg's
02/16/1993US5187241 Reaction of hydrolyzed polyimide surface (polyamic acids) with an acyl chloride to produce polyisoimides
02/16/1993US5187119 Depositing conductor layer on substrate, coating with resist, patterning, etching
02/16/1993US5187020 Compliant contact pad
02/16/1993US5186982 Adjustable dispenser having internal conduit connected to reservoir, for high speed automatic application of small amounts of viscous liquids or pastes to substrates
02/16/1993US5186811 Method of manufacturing printed wiring boards
02/16/1993US5186638 Transportation protection and insertion device for multi-conductor cables
02/16/1993US5186634 Electrical contact having spring-biased tabs for mounting to a circuit board
02/16/1993US5186632 Electronic device elastomeric mounting and interconnection technology
02/16/1993US5186383 Low and high melting alloys, cooling, resolidifying
02/16/1993CA1313611C Bath solution and process for the removal of lead/tin, lead or tin coatings from copper or nickel surfaces
02/11/1993DE4126597A1 Heat treatment of units with mounted electrical and electronics - having components on conveyor moved through successive heating and cooling units
02/11/1993DE4126514A1 Cleaning appts. for printed circuit board - feeds board by roller pairs through spray generated by nozzles, with fluid collected in container
02/10/1993EP0526992A2 Multilayer carrier for mounting an integrated circuit and method of making the same
02/10/1993EP0526847A1 Novel imidazole-silane compounds, process for producing the same, and metal surface finishing agent containing the same
02/10/1993EP0526821A1 Electrical control apparatus comprising electrical conductors plated on a insulating housing
02/10/1993EP0526707A1 Low temperature co-fired ceramic structure containing buried capacitors
02/10/1993EP0526490A1 Temperature and solvent-resistant ink for the ink-jet printing process.
02/10/1993EP0526455A1 Process for applying a protective plastic film, and a device for carrying out the process.
02/10/1993EP0526450A1 Multilayer thin film wiring process featuring self-alignment of vias
02/10/1993EP0228454B1 Compositions and methods for printed circuit board and/or printed wiring board cleaning and soldermask testing
02/09/1993US5185690 High dielectric constant sheet material
02/09/1993US5185638 Computer controlled, multiple angle illumination system
02/09/1993US5185625 Exposure apparatus for forming pattern on printed-wiring board
02/09/1993US5185502 High power, high density interconnect apparatus for integrated circuits
02/09/1993US5185185 Process of pretreatment of metal-plating resin molded articles
02/09/1993US5185073 Method of fabricating nendritic materials
02/09/1993US5185055 Method of forming a pattern on a surface
02/09/1993US5185042 Generic solar cell array using a printed circuit substrate
02/09/1993US5185040 Apparatus for forming electrode on electronic component
02/09/1993US5184768 Solder interconnection verification
02/09/1993US5184767 Non-wicking solder preform
02/09/1993US5184536 Swash plate type piston pump/motor
02/09/1993US5184400 Method for manufacturing a twisted wire jumper electrical interconnector
02/09/1993US5184399 Method of manufacturing circuit board
02/09/1993CA2075026A1 Method and apparatus for patterning an imaging member
02/09/1993CA2033227C Voltage-controlled oscillator mounted on laminated printed circuit board
02/09/1993CA2021285C Ceramic multilayer wiring substrate
02/04/1993WO1993002538A1 Process for making an adhesive joint between at least one component and a metallic substrate
02/04/1993WO1993002487A1 Contact having a mass of reflowable solderable material thereon
02/04/1993WO1993002485A1 Microstrip line and manufacturing method therefor
02/04/1993WO1993002395A1 Photocurable compositions
02/04/1993WO1993002226A1 Aqueous electronic circuit assembly cleaner and method
02/04/1993WO1993002173A1 Cleaning agent for electronic and electrical assemblies
02/04/1993WO1993002126A1 Oligoorganosilasesquioxanes
02/04/1993DE4223576A1 Mounting and contacting device on circuit board by silver@ bonding - using two component adhesive of resin contg. microencapsulated hardener and accelerator, useful for non-metallic circuit boards, conductive films, etc.
02/04/1993CA2114110A1 Cleaning agent for electronic and electrical assemblies
02/03/1993EP0526243A1 Via hole structure and process
02/03/1993EP0526133A2 Polyimide multilayer wiring substrate and method for manufacturing the same
02/03/1993EP0526107A1 Stepped multilayer interconnection apparatus and method of making the same
02/03/1993EP0525956A2 Metal foil with improved bonding to substrates and method for making said foil
02/03/1993EP0525901A2 Compositions containing a fluoroether and use thereof
02/03/1993EP0525820A2 Joined ceramic-metal composite substrate and method for production thereof
02/03/1993EP0525718A1 Automatic soldering apparatus for printed wiring boards
02/03/1993EP0525692A1 Apparatus for separating and peeling a foil of a laminated carrier material
02/03/1993EP0525497A1 Method for forming vias in multilayer circuits
02/03/1993EP0525355A1 Hearing aid, particularly on-the-head miniature hearing aid, and production method
02/03/1993EP0525282A2 Controlled electroless plating
02/03/1993EP0525266A1 Composition based on n-perfluorobutyl-ethylene for cleaning solid surfaces
02/03/1993EP0525060A1 Miniature multiple conductor electrical connector.
02/03/1993EP0524923A1 Process for applying a composite insulative coating to a substrate
02/03/1993EP0478562A4 Snap fit contact assembly
02/03/1993CN1068696A Making method of electric heating applique paper and application
02/02/1993WO1993002847A1 Process for metallizing substrates using starved-reaction metal-oxide reduction
02/02/1993US5184285 Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
02/02/1993US5184284 Method and apparatus for implementing engineering changes for integrated circuit module
02/02/1993US5184283 Power device assembly and method
02/02/1993US5184209 Ic card and manufacturing method therefor
02/02/1993US5184111 Circuit arrangement on a support film
02/02/1993US5183973 Polyimide substrate; layer of titanium; plurality of gold conductors; thin film; no organic adhesives
02/02/1993US5183972 Matching thermal coefficients of expansion of substrate and dielectric layer; high density, high performance circuits
02/02/1993US5183969 Epoxy resin which changes color on curing; opeining to visualize change
02/02/1993US5183692 Polyimide coating having electroless metal plate
02/02/1993US5183611 Dissolving polymer and metal salt in common solvent; forming; reducing
02/02/1993US5183593 Electrically conductive cement
02/02/1993US5183553 Method of forming a high temperature resistant copper coating on an inorganic dielectric
02/02/1993US5183552 Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces
02/02/1993US5183508 Apparatus for patch coating printed circuit boards
02/02/1993US5183500 Electroless plating bath composition and method for production thereof
02/02/1993US5183067 Cleaning and drying of electronic assemblies