Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1993
03/16/1993US5193738 Methods and apparatus for soldering without using flux
03/16/1993US5193734 Jet solder bath
03/16/1993US5193732 Apparatus and methods for making simultaneous electrical connections
03/16/1993US5193668 Touch-sensitive panel and display apparatus using the touch-sensitive panel
03/16/1993US5193270 Method for joining a conductor track foil to an electrical component
03/16/1993CA1314591C Contact structure employing an elastomeric connector
03/14/1993CA2077161A1 Method of establishing soldered connections
03/11/1993DE4230330A1 Tape carrier package for soldering multipin chip to substrate by hf heating - comprises base film with device hose, leads having lead sections extending outwardly for bonding to substrate and lead sections extending into device hole
03/11/1993DE4228253A1 Contact points for mounting semiconductor casing on circuit board - has points arranged on circuit board in zigzag fashion in two adjacent rows.
03/11/1993DE4129983A1 Producing plug contact connection between crossed-coil indicator instrument and flexible circuit board - providing cylindrical thickenings in housing wall with through holes holding bolt pins forming plug-in pins
03/11/1993DE4129835A1 Leistungselektroniksubstrat und verfahren zu dessen herstellung Power electronics substrate and method for its production
03/11/1993CA2072727A1 Copper-based paste containing copper aluminate, for microstructural and shrinkage control of copper-filled vias
03/10/1993EP0531185A1 Supporting structure, especially for signalling lights of motor vehicles, and its manufacturing process
03/10/1993EP0531126A1 Pattern structure of a printed circuit board
03/10/1993EP0530922A2 Method and apparatus for object inspection
03/10/1993EP0530840A1 Electric circuit board module and method for producing electric circuit board module
03/10/1993EP0530780A1 Electric joint forming sheet or tape and method for joint formation using the same
03/10/1993EP0530656A1 Printed circuit with surface mounted plug connector
03/10/1993EP0530568A2 Electrolytic copper plating using a reducing agent
03/10/1993EP0530564A1 Method for producing circuit boards
03/10/1993EP0530450A1 Continuous production of resin impregnated sheetings
03/10/1993EP0530191A1 Process and device for positionally precise soldering of parts to be soldered on a supporting plate.
03/10/1993EP0519935A4 Ternary azeotropic compositions of dichloropentafluoropropane and trans-1,2-dichloroethylene with methanol or ethanol or isopropanol
03/10/1993EP0333722B1 Sheet material coated with pressure-sensitive adhesive
03/10/1993EP0309593B1 Ceramic base and process for its production
03/10/1993CN1069829A 可网版印刷的厚膜浆料组合物 Screen printable thick film paste composition
03/09/1993US5192937 Resistance unit for motor speed control
03/09/1993US5192619 Flexible copper-applied substrates
03/09/1993US5192590 Coating metal on poly(aryl ether ketone) surfaces
03/09/1993US5192582 Procedure for processing joints to be soldered
03/09/1993US5192581 Multilayer element with protective coating, irradiation with laser and etching
03/09/1993US5192477 Surface treatment of polyamide moldings
03/09/1993US5192394 Fluid treatment apparatus and method
03/09/1993US5192368 Screen printing machine provided with a compressed air cleaner
03/09/1993US5192360 Water-soluble flux for cored solder
03/09/1993US5192214 Planar interconnect with electrical alignment indicator
03/09/1993US5191709 Method of forming through-holes in printed wiring board
03/09/1993US5191708 Manufacturing method of a probe head for semiconductor LSI inspection apparatus
03/09/1993CA1314313C Low-loss electrical interconnects
03/09/1993CA1314197C Process for removing contaminant
03/07/1993WO1993005634A1 SURFACE MOUNT ASSEMBLY OF DEVICES USING AdCon INTERCONNECTIONS
03/04/1993WO1993004571A1 Component of printed circuit boards
03/04/1993WO1993004219A1 Azeotrope-like compositions of 2-trifluoromethyl-1,1,1,2-tetrafluorobutane and methanol, ethanol or isopropanol
03/04/1993WO1993003928A1 Infra-red direct write imaging media
03/04/1993WO1993003924A1 Reciprocally shuttled double sided screener with tiltable print squeegee
03/04/1993WO1993003886A1 Equipment for working printed circuit board
03/04/1993WO1993003884A1 Lead-based solder alloy and its use in soft soldering
03/04/1993DE4222262A1 Appts. for laminating plastics prods. e.g. PVC films esp. in PCB mfr. - has vacuum chamber comprising 2 opposing movable platens, each having pressure mat backed by heating mats for receiving prod connected by thin polyester band
03/04/1993DE4131065A1 Mfg. PCB having etch-resistant layer on metal layer on insulation material substrate - selectively removing etch-resistant layer by e.m. radiation and forming conductive path pattern on structured metal layer so exposed
03/04/1993DE4129056A1 Printed circuit board mounting for LED elements - has LED located in circuit board aperture, engaging with large cross section contact strips
03/04/1993DE4128476A1 Removal of metal film from an electrically-conductive film - by using the metal as an anode in an electrolysis bath
03/04/1993DE4128439A1 Contact exposure unit for photosensitive material, e.g. offset or flexoprinting plates, PCB(s) or foils - has rest and pressure system for photosensitive coated material in contact with original and light source radiating UV light exposing material through original
03/04/1993CA2115759A1 Reciprocally shuttled double sided screener with tiltable print squeegee
03/04/1993CA2115436A1 Azeotrope-like compositions of 2-trifluoromethyl-1,1,1,2- tetrafluorobutane and methanol, ethanol or isopropanol
03/03/1993EP0530148A1 Positive photo resist with increased dissolving power and reduced crystallisation tendency as well as new tetra(hydroxyphenyl)alkane
03/03/1993EP0530052A1 Method of manufacturing multilayer electronic component
03/03/1993EP0530003A1 Resistive metal layers and method for making same
03/03/1993EP0529944A1 Method and apparatus for aligning phototools for photoprocessing of printed circuit board panels
03/03/1993EP0529869A1 Cleaning composition
03/03/1993EP0529752A2 Via metallization for A1N ceramic electronic package
03/03/1993EP0529643A1 Aqueous-developable dry film photoresist
03/03/1993EP0529578A2 Semi-additive circuitry with raised features using formed mandrels
03/03/1993EP0529577A2 Electrical test probe having shaped contacts
03/03/1993EP0529298A2 Method for making thick film/solder joints
03/03/1993EP0529097A1 Method of manufacturing two-layer tab tape
03/03/1993EP0528963A1 Process for the production of a multilayer printed circuit board.
03/03/1993EP0528874A1 Dispersion-based heat-seal coating.
03/03/1993EP0489118A4 Multi-layer circuit board that suppresses radio frequency interference from high frequency signals
03/02/1993US5191404 High density memory array packaging
03/02/1993US5191182 Tuneable apparatus for microwave processing
03/02/1993US5191174 High density circuit board and method of making same
03/02/1993US5190892 Method for forming pattern using lift-off
03/02/1993US5190835 Electroless deposition of palladium or gold
03/02/1993US5190813 Polytetrafluoroethylene, cation exchange resin, platinum
03/02/1993US5190793 Refractory covercoat for semicondutor devices and methods of making and using the same
03/02/1993US5190601 Surface structure of ceramics substrate and method of manufacturing the same
03/02/1993US5190463 High performance metal cone contact
03/02/1993US5190065 Self-contained washing unit for printed circuit boards
03/01/1993CA2077151A1 Cleaning compositions
03/01/1993CA2076727A1 Alkaline-etch resistant dry film photoresist
03/01/1993CA2050386A1 Printed circuit board assembly manufacture
02/1993
02/27/1993CA2076738A1 Resistive metal layers and method for making same
02/25/1993DE4127744A1 Suppression of sulphate reducing bacteria - by bacterial metabolism of molasses increasing oil recovery from deposits
02/25/1993DE4126513A1 Use of amino-carboxylate(s) and betaine(s) in drilling emulsion - for drilling printed circuit boards, with reduced skin irritation
02/24/1993EP0528566A1 Conveyorized vacuum laminator and method therefor
02/24/1993EP0528481A1 Fluorinated ether containing compositions and their use
02/24/1993EP0528373A1 Apparatus for peeling off a film, laminated to a carrier-material
02/24/1993EP0528350A1 Method for soldering and mounting components on circuit boards
02/24/1993EP0528311A2 Electrical feedthrough structure and fabrication method
02/24/1993EP0528285A1 Method and apparatus for patterning an imaging member
02/24/1993EP0528108A1 Printed circuit board contact system
02/24/1993EP0528027A1 Method and apparatus for forming contacts.
02/24/1993EP0527980A1 Specific microsieve, specific composite body.
02/24/1993EP0527740A1 Azeotropic composition of perfluoro-1,2-dimethylcyclobutane with 1,1-dichloro-1-fluoroethane.
02/24/1993CN1069387A Puncture and eldctroplating method for circuit substrate
02/24/1993CA2076421A1 Method for making thick film/solder joints
02/24/1993CA2049790A1 Electro-chemical etch device
02/23/1993US5189539 Drive line wiring for liquid crystal display
02/23/1993US5189352 Drilling restart control system
02/23/1993US5189275 Printed circuit assembly with contact dot