Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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03/30/1993 | US5198391 Leadless ceramic chip carrier, heat resistance |
03/30/1993 | US5198389 Method of metallizing contact holes in a semiconductor device |
03/30/1993 | US5198295 Titanate or zirconate ceramics in circuit boards |
03/30/1993 | US5198279 Circuit board stiffener |
03/30/1993 | US5198264 Printed circuits substrates with layers of palladium and tin |
03/30/1993 | US5198096 Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
03/30/1993 | US5198067 Apparatus for conveying base with crosswise base sliding device |
03/30/1993 | US5198038 Foaming flux for automatic soldering process |
03/30/1993 | US5197902 Termination adaptor connector device |
03/30/1993 | US5197892 Electric circuit device having an electric connecting member and electric circuit components |
03/30/1993 | US5197889 Electrical contact for battery package or similar device |
03/30/1993 | US5197888 Method of positioning flexible circuit members on a common circuit member |
03/30/1993 | US5197673 Reciprocating nozzle assembly |
03/30/1993 | US5197655 Fine pitch solder application |
03/30/1993 | US5197384 Screen printer |
03/30/1993 | US5197185 Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques |
03/30/1993 | US5197184 Method of forming three-dimensional circuitry |
03/30/1993 | CA1315417C Printed circuit board with electroconductive polymer conductors |
03/30/1993 | CA1315372E Radiation supply and adhesive dispensing system |
03/27/1993 | CA2079033A1 Electroplating means for perforated printed circuit boards to be treated in a horizontal pass |
03/25/1993 | DE4131620A1 Separating soldered components from surface of circuit boards - immersing boards in solder bath by mechanical handler to aid separation when solder melts |
03/25/1993 | DE4131129A1 Clocked burn-in of thick-film integrated circuits - heating cassette by hot-air blowers in different temp. zones sepd. by moving hollow partitions |
03/25/1993 | DE4130121A1 Mfr. of double sided circuit boards with through hole contacts - has solder surface formed by masking with resistance layer that is removed to form contact points |
03/24/1993 | EP0533641A2 Coating composition for parts |
03/24/1993 | EP0533575A1 Plastic-supported metallic strip manufactured by metallising-plating |
03/24/1993 | EP0533198A2 Flexible printed substrate |
03/24/1993 | EP0532974A2 Electrical parts for surface mounting |
03/24/1993 | EP0532936A1 Electronic device elastomeric mounting and interconnection technology |
03/24/1993 | EP0532898A2 Flex tape protective coating |
03/24/1993 | EP0532897A2 Method of reworking circuit panels, and circuit panels reworked thereby |
03/24/1993 | EP0532776A1 Process to drill multilayered contact boards |
03/24/1993 | EP0313574B1 Potted electrical/mechanical devices, and dual cure potting method |
03/24/1993 | CN1070306A Apparatus for detecting solder wave surface |
03/24/1993 | CN1070287A Multichip module and integrated circuit substrates having planarized patterned surfaces |
03/23/1993 | US5196990 Metal printed circuit board |
03/23/1993 | US5196819 Printed circuits containing fuse elements and the method of making this circuit |
03/23/1993 | US5196726 Substrate for packaging a semiconductor device having particular terminal and bump structure |
03/23/1993 | US5196667 Soldering and desoldering device |
03/23/1993 | US5196652 Wireless electrical connections of abutting tiled arrays |
03/23/1993 | US5196384 Method for preparing green sheets |
03/23/1993 | US5196376 Laser lithography for integrated circuit and integrated circuit interconnect manufacture |
03/23/1993 | US5196371 Flip chip bonding method using electrically conductive polymer bumps |
03/23/1993 | US5196286 Xerography |
03/23/1993 | US5196251 Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate |
03/23/1993 | US5196230 Gradual diameter increase of aperture in each insulating layer |
03/23/1993 | US5196137 Azeotropic composition of 1,1,1,2,3,4,4,5,5,5-decafluoropentane and trans-1,2-dichloroethylene, cis-1,2-dichloroethylene or 1,1-dichlorethane |
03/23/1993 | US5196136 Cleaning composition of hydrocarbon component, surfactant and multibasic ester additive |
03/23/1993 | US5196134 Cleaning flux on printed circuits, alkali metal hydroxide, hydrogen peroxide, wetting agent, water |
03/23/1993 | US5196098 Insulated coatings such as photoresists |
03/23/1993 | US5196089 Multilayer ceramic substrate for mounting of semiconductor device |
03/23/1993 | US5196087 Method for making multi-layer printed circuit board |
03/23/1993 | US5196053 An imidazole-2-thione, copper coated printed circuits |
03/23/1993 | US5195908 Multicircuit cable connector |
03/23/1993 | US5195417 Registration of artwork panels in the manufacture of printed circuit boards |
03/23/1993 | US5195238 Method of manufacturing a printed circuit board |
03/23/1993 | US5195237 Flying leads for integrated circuits |
03/23/1993 | CA1315014C Method and apparatus for mounting electronic device on a printed circuit board |
03/23/1993 | CA1314694C Process for producing conducting patterns on parabolic antennas |
03/18/1993 | WO1993005633A1 Manufacturing method for electrical circuit board |
03/18/1993 | WO1993005632A1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
03/18/1993 | WO1993005631A1 Power electronics substrate and process for making it |
03/18/1993 | WO1993004998A1 Method of making co-fired, multilayer substrates |
03/18/1993 | WO1993001634A3 Electrical connection system |
03/18/1993 | DE4229026A1 Flexible printed circuit board with decreased bending - comprises conductive path arranged between two layers of insulating material |
03/18/1993 | DE4129964A1 Fixing integrated circuit element onto printed circuit - attaching IC to plastics film having conductive tracks, cutting out film, sticking onto printed circuit, and connecting tracks |
03/18/1993 | CA2113451A1 Method of making co-fired, multilayer substrates |
03/18/1993 | CA2051604A1 Plastic-mounted strips fabricated by vacuum deposition and cladding |
03/17/1993 | EP0532301A1 Electrical appliance powered by an incorporated rechargeable battery |
03/17/1993 | EP0532297A1 Process for flip-chip connection of a semiconductor chip |
03/17/1993 | EP0532215A2 Electrical connecting method |
03/17/1993 | EP0532015A2 Method of establishing soldered connections |
03/17/1993 | EP0531984A1 Electronic circuit for semi-conductor power components |
03/17/1993 | EP0531764A1 Fluorinated carbon polyimide composites |
03/17/1993 | EP0531724A1 Stepped electronic device package |
03/17/1993 | EP0531571A1 An automatic loading mechanism for PC board electroplating |
03/17/1993 | EP0531500A1 Method of producing coaxial connections for an electronic component |
03/17/1993 | EP0497925A4 Method for printed circuit board pattern making using selectively etchable metal layers |
03/17/1993 | EP0445174B1 Process and device for cleaning objects |
03/17/1993 | CN1070076A Componenet fo printed circuit boards |
03/16/1993 | USRE34197 Computer controller viscous material deposition apparatus |
03/16/1993 | US5195021 Constraining core for surface mount technology |
03/16/1993 | US5194933 Semiconductor device using insulation coated metal substrate |
03/16/1993 | US5194713 Punching apertures in fluorocarbon resins with glass fiber composites for composites |
03/16/1993 | US5194710 Tool for masking a substrate from energy |
03/16/1993 | US5194698 Apparatus and method using a permanent mandrel for manufacture of electrical circuitry |
03/16/1993 | US5194697 Electrically conductive feedthrough connection and methods of manufacturing same |
03/16/1993 | US5194419 Method for manufacturing an oxide superconductive multilayer circuit |
03/16/1993 | US5194365 Method for forming images |
03/16/1993 | US5194326 Bonding plies for electronics |
03/16/1993 | US5194316 Polyimide layer laminate sheet |
03/16/1993 | US5194313 Through-hole plated printed circuit board and process for manufacturing same |
03/16/1993 | US5194307 Lamination using heat activated adhesives of epoxy resins |
03/16/1993 | US5194295 Ceramic articles having heat-sealable metallic coatings and method of preparation |
03/16/1993 | US5194294 Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits |
03/16/1993 | US5194196 Hermetic package for an electronic device and method of manufacturing same |
03/16/1993 | US5194169 Refrigerants |
03/16/1993 | US5194137 Solder plate reflow method for forming solder-bumped terminals |
03/16/1993 | US5194092 Electrostatic coating apparatus for flat-plate type objects |
03/16/1993 | US5193949 Arrangement for driving a rotary tool |
03/16/1993 | US5193739 Pickling a circuit board to remove oxide layers |