Patents for H05K 1 - Printed circuits (98,583)
03/2000
03/02/2000WO2000011066A1 Polyimide film and process for producing the same
03/02/2000WO2000010736A1 Printing of electronic circuits and components
03/02/2000DE19940633A1 IC-Gehäuse IC package
03/02/2000DE19934732A1 Verfahren zum Laminieren eines flexiblen Schaltkreises auf ein Substrat A method for laminating a flexible circuit to a substrate
03/02/2000DE19912605A1 Circuit board strengthening element for system board arrangement has flow channels in side elements for heated fluid to heat connecting parts between electronic part and circuit board
03/02/2000DE19839760A1 Verfahren zur Verbindung von elektronischen Bauelementen mit einem Trägersubstrat sowie Verfahren zur Überprüfung einer derartigen Verbindung A method for connection of electronic components comprising a carrier substrate and to methods for checking of such a compound
03/02/2000DE19838519A1 Optoelectronic printed circuit board, forms multilayer package with transparent layers
03/02/2000DE19838455A1 Electrical equipment, especially for telecommunications, has circuit that decouples connecting region from supply region in event of multi-layer board short with capacitive HF coupling existing
03/02/2000DE19837217A1 Fine grid connector circuit board for line or matrix displays
03/02/2000DE19834381A1 Circuit board for accommodating plug devices for bus system in computer has conducting tracks via which information signal bores are connected on outer or next lower insulating layer
03/02/2000CA2342164A1 Planar transformer
03/02/2000CA2340988A1 Microwave dielectric material
03/01/2000EP0982807A2 Improved microstrip edge card connector
03/01/2000EP0982806A1 Connector with electric contact elements adapted to be mounted on a circuit board
03/01/2000EP0982798A2 Antenna device and communication apparatus including the same
03/01/2000EP0982751A1 Subminiature lamp for indication light
03/01/2000EP0982741A2 Method for fabricating a thin film resistor onto a ceramic-polymer substrate
03/01/2000EP0982385A1 Adhesive, method for bonding, and assemblies of mounted boards
03/01/2000EP0981722A1 Measuring system
03/01/2000EP0729484B1 Cure inhibited epoxy resin compositions and laminates prepared from the compositions
03/01/2000CN1049904C Thermally cross-linkable heat-sealing adhesive
02/2000
02/29/2000US6031730 Connector for electrically connecting circuit boards
02/29/2000US6031729 Integral heater for reworking MCMS and other semiconductor components
02/29/2000US6031728 Device and method for interconnection between two electronic devices
02/29/2000US6031727 Printed circuit board with integrated heat sink
02/29/2000US6031726 Low profile mounting of power converters with the converter body in an aperture
02/29/2000US6031723 Insulated surface mount circuit board construction
02/29/2000US6031349 Cross-connect method and apparatus
02/29/2000US6031297 Printed circuit board allowing usage of alternative pin-compatible modules
02/29/2000US6031282 High performance integrated circuit chip package
02/29/2000US6031280 Semiconductor device having resin encapsulated package structure
02/29/2000US6031068 Polyimide composition and base tape for TAB carrier tape and flexible printed circuit board made from said composition
02/29/2000US6031049 Blends comprising a syndiotactic polystyrene and a polyphenylene ether
02/29/2000US6030693 Electronic circuit package having one or more layers, at least one of the layers having a core material comprising by weight 58%fe/42%ni, or 60%fe/39%ni/1%cu
02/29/2000US6030254 Edge connector interposing probe
02/29/2000US6029344 Composite interconnection element for microelectronic components, and method of making same
02/29/2000US6029343 Insulated surface mount circuit board construction
02/29/2000CA2130632C Package, socket, and connector for integrated circuit
02/28/2000CA2277581A1 Improved microstrip edge card connector
02/24/2000WO2000010370A1 A flexible circuit with conductive vias and a method of making
02/24/2000WO2000010368A1 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture
02/24/2000WO2000010228A1 Connector with two rows of terminals having tail portions with similar impedance
02/24/2000WO2000009579A1 Phenol/triazine derivative co-condensate resin and process for producing the same
02/24/2000WO2000009327A1 Resin/copper/metal laminate and method of producing same
02/24/2000DE19838218A1 Construction system for a pair of electronic circuit boards has one board partially located in aperture of main board the is then mounted on a carrier board
02/24/2000DE19836548A1 Carrier component; has integrated electrical connections for use with main section that fits into aperture formed in circuit board
02/24/2000DE19835613A1 Resin composition for highly conductive plastics
02/24/2000CA2338102A1 A flexible circuit with conductive vias and a method of making
02/23/2000EP0981268A1 Circuit board with an electronic component mounted thereon and multi-layer board
02/23/2000EP0981183A2 Circuit board connecting structure, electro-optical device, electronic apparatus provided with the same, and manufacturing method for electo-optical device
02/23/2000EP0981162A1 Semiconductor chip with surface cover against optical inspection of the circuit structure
02/23/2000EP0981137A2 Protection of electrical devices with voltage variable materials
02/23/2000EP0980737A1 Laser machining method, laser machining device and control method of laser machining
02/23/2000EP0980322A2 Sensor circuit, specially for an automobiles
02/23/2000EP0759893A4 Coating of substrates
02/23/2000CN1245630A Connector assembly, and associated method, for radio frequency circuit device
02/23/2000CN1245629A Ceramic composite wiring structure for semiconductor devices and method of manufacture thereof
02/23/2000CN1245351A Semiconductor chip with surface covering layer
02/23/2000CN1245325A Circuit substrate connecting structure, electrooptical device and its manufacturing method and electronic equipment
02/23/2000CN1245304A Motherboard of computer
02/22/2000US6028774 Base cards and IC cards using the same
02/22/2000US6028770 Control device, especially for a motor vehicle
02/22/2000US6028500 Audible noise suppressor for planar magnetic devices
02/22/2000US6028497 RF pin grid array
02/22/2000US6028489 Modular high-frequency oscillator structure
02/22/2000US6028366 Ball grid array semiconductor device
02/22/2000US6028357 Semiconductor device with a solder bump over a pillar form
02/22/2000US6028353 Chip bead element and manufacturing method thereof
02/22/2000US6027958 Transferred flexible integrated circuit
02/22/2000US6027862 Electroless deposition of first silver layer followed by electrodeposition of second silver layer from cyanide-free bath, heat treating silver layer at least after depositing first layer
02/22/2000US6027817 Plated molded article and process for producing a plated molded article
02/22/2000US6027791 Structure for mounting a wiring board
02/22/2000US6027771 Nonporous composite material laminate formed by combination of a liquid crystal polymer film with two support membranes and stretching the composite material laminate to provide a multiaxially-oriented liquid crystal polymer film
02/22/2000US6027762 Plating copper on a film base of the circuit pattern; forming a resist layer on the base film and plating except for an exposed pattern, wherein the copper plating between the resist layer and circuit pattern have less stresses
02/22/2000US6027535 Battery charger for power tools
02/22/2000US6027366 Flat cable, connection device therefor and electric circuit apparatus
02/22/2000US6027347 Process and arrangement for connecting a plurality of mutually remote electric contact points
02/22/2000US6027346 Membrane-supported contactor for semiconductor test
02/22/2000US6027245 Apparatus for measuring a temperature of a substrate during a drilling operation
02/22/2000US6027006 Method and apparatus for applying solder and forming solder balls on a substrate
02/22/2000US6026564 Method of making a high density multilayer wiring board
02/22/2000US6026563 Method of making flat cable
02/22/2000CA2130498C Ink jet recording head and recording apparatus using same
02/17/2000WO2000008903A1 Printed circuit board with a heatsink and method for mounting a heatsink
02/17/2000WO2000008902A1 Front panel for an electronic instrument
02/17/2000WO2000008900A1 Printed circuit card
02/17/2000WO2000008898A2 High frequency heating apparatus
02/17/2000WO2000008755A1 Piezoelectric vibrator container, piezoelectric vibrator using it and circuit board mounting piezoelectric vibrator thereon and production method for piezoelectric vibrator
02/17/2000WO2000008694A1 Embedded piezoelectric resonator
02/17/2000WO2000008675A2 Adapter for surface mounted devices
02/17/2000WO2000008531A1 Circuit support with control elements communicating via bus lines
02/17/2000WO2000008071A2 Melt-processible poly(tetrafluoroethylene)
02/17/2000DE19835641A1 Hybrid element for electronic circuit has fixing legs at one end of hybrid board relatively displaced by flexure of hybrid board for insertion in openings in electronic circuit board
02/17/2000DE19835156A1 Polyvinyl acetal based paste containing a transition metal, useful for the printing of conductive grids, comprises a basic compound
02/17/2000DE19834641A1 Schaltungsträger mit voneinander trennbaren Steuereinheiten Circuit board with separable control units
02/16/2000EP0980114A1 Helical antenna and portable transceiver
02/16/2000EP0980097A2 Dispersion containing Cu ultrafine particles individually dispersed therein
02/16/2000EP0980079A2 Low cross-talk ball grid array resistor network
02/16/2000EP0979598A1 Display device and method therefor
02/16/2000CN1245008A Printed wiring board and method for manufacturing the same