Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/1999
11/02/1999US5975178 Manufacturing method of film carrier tape, manufacturing apparatus of film carrier tape, and film carrier tape
11/02/1999US5974931 Flex die punching apparatus and method
11/02/1999US5974662 Method of planarizing tips of probe elements of a probe card assembly
11/02/1999US5974655 Method of mounting loudspeakers and a loudspeaker mounting
11/02/1999CA2184022C Thin-film multilayered electrodes and method of fabricating same
11/02/1999CA2111815C Specifically configured sheet members or articles for use in improving sound or image quality
10/1999
10/28/1999WO1999054935A1 Portable communication equipment
10/28/1999WO1999054888A1 Composite dielectric material composition, and film, substrate, electronic parts and moldings therefrom
10/28/1999WO1999054525A2 Method for producing metallized substrate materials
10/28/1999DE19817388A1 Metallizing a fluoropolymer substrate for forming conductor structures or a plasma etching mask on a circuit substrate
10/28/1999DE19817354A1 Flexible strip conductor
10/28/1999DE19816670A1 Standard printed circuit board and plug, especially power supply unit
10/27/1999EP0952762A1 Printed wiring board and method for manufacturing the same
10/27/1999EP0952760A1 Flexible circuit
10/27/1999EP0951808A1 A combined electrical and optical edge contact for compact connection of a part to another part, a use thereof and a method of manufacturing such an interconnection
10/27/1999EP0951807A1 Improvements in or relating to thermal trip arrangements
10/27/1999EP0951631A1 Spherical shaped semiconductor integrated circuit
10/27/1999EP0951500A1 Microporous polytetrafluoroethylene (ptfe) bodies with filler
10/27/1999EP0951366A1 Method for making a sonoprobe
10/27/1999EP0763431B1 Thermal printing head, substrate used therefor and method for producing the substrate
10/27/1999EP0666291B1 Conductive coating material having good adhesiveness to metal oxide molding
10/27/1999CN1232860A Liquid crystal polymer film and stacked body and its producing method, and laminated installation loop base plate
10/26/1999US5973951 Single in-line memory module
10/26/1999US5973932 Soldered component bonding in a printed circuit assembly
10/26/1999US5973931 Printed wiring board and electronic device using same
10/26/1999US5973930 Mounting structure for one or more semiconductor devices
10/26/1999US5973929 Printed circuit board having an embedded capacitor
10/26/1999US5973928 Multi-layer ceramic substrate decoupling
10/26/1999US5973927 Mounting structure for an integrated circuit
10/26/1999US5973923 Packaging power converters
10/26/1999US5973594 Multiple optical designs for a multifunction sensor
10/26/1999US5973420 Electrical system having a clear conductive composition
10/26/1999US5973410 Safety device for linking reference grounds in an integrated circuit
10/26/1999US5973409 Electrical distribution system
10/26/1999US5973391 Interposer with embedded circuitry and method for using the same to package microelectronic units
10/26/1999US5973340 Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits
10/26/1999US5973283 Tearable membrane switch with resinous bounded silver-palladium alloy contacts
10/26/1999US5973041 Themroplastic resin blended with an aromatic bisphosphoramidate of givne formula having acceptable fire retarding properties and a higher heat deflection temperture
10/26/1999US5972811 Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof
10/26/1999US5972807 Photosensitive, heat-resistant resin composition and process for using same to form patterns as well as polymeric composite and production process thereof
10/26/1999US5972564 Alkali development type photocurable conductive paste composition and plasma display panels having electrodes formed thereof
10/26/1999US5972484 Ultrahigh molecular weight polyethylene composite and at least one electroconductive layer including an electroconductive material, said dielectric and electroconductive layers being intimately bonded to one another.
10/26/1999US5972482 Uncured substrate material with closed voids which are disposed with a through-hole. by filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the
10/26/1999US5972246 Electro-conductive composition and electronic equipment using same
10/26/1999US5972231 Imbedded PCB AC coupling capacitors for high data rate signal transfer
10/26/1999US5972152 Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
10/26/1999US5972053 Capacitor formed within printed circuit board
10/26/1999US5971804 Backplane having strip transmission line ethernet bus
10/26/1999US5971775 Single-sided, straddle mount printed circuit board connector
10/26/1999US5971597 Multifunction sensor and network sensor system
10/21/1999WO1999053736A1 Pressure-bonded substrate, liquid crystal device, and electronic device
10/21/1999WO1999053735A1 Pressure-bonded substrate, liquid crystal device, and electronic device
10/21/1999WO1999053585A1 Terminal box
10/21/1999WO1999053573A1 Reduction of crosstalk in data transmission system
10/21/1999WO1999053564A1 Orthogonal transition from coax to stripline for opposite sides of a stripline board
10/21/1999WO1999053545A1 Film used as a substrate for integrated circuits
10/21/1999WO1999052833A1 Glass fiber having low dielectric constant and woven fabric of glass fiber made therefrom
10/21/1999WO1999034657A3 Hybrid circuit with a heat dissipation system
10/21/1999DE19816794A1 Printed circuit board system, for electronic combination instrument
10/21/1999DE19816445A1 SMD component module manufacturing method e.g. for telephone equipment
10/21/1999DE19804607A1 Electrical connection of a sensor of an internal combustion engine component, e.g. a suction unit or cylinder head cover, simplifies assembly and the electrical contacts of the sensor
10/20/1999EP0951209A2 Low profile printed circuit board rf shield for radiating pin
10/20/1999EP0951206A2 Liquid crystal polymer film, laminate, method of making them and multi-layered parts-mounted circuit board
10/20/1999EP0951161A1 Contact device for connecting a liquid crystal display to a printed circuit board
10/20/1999EP0951102A2 Power connector
10/20/1999EP0950271A1 Component for contacting a measuring unit and method for its production
10/20/1999EP0785557B1 Composite magnetic material and product for eliminating electromagnetic interference
10/20/1999CN1232242A Contact device between liquid crystal display and printed circuit
10/19/1999US5970310 Method for manufacturing multilayer wiring board and wiring pattern forming apparatus
10/19/1999US5969953 Stacked memory for flight recorders
10/19/1999US5969952 Hybrid IC and electronic device using the same
10/19/1999US5969945 Electronic package assembly
10/19/1999US5969924 Spark gap for overcoated printed circuit boards
10/19/1999US5969783 Reflective liquid crystal display and connection assembly and method
10/19/1999US5969559 Method and apparatus for using a power grid for clock distribution in semiconductor integrated circuits
10/19/1999US5969530 Circuit board inspection apparatus and method employing a rapidly changing electrical parameter signal
10/19/1999US5969421 Integrated circuit conductors that avoid current crowding
10/19/1999US5969417 Chip package device mountable on a mother board in whichever of facedown and wire bonding manners
10/19/1999US5969083 Derived from terephthalic acid residues and 2,6-naphthalenedicarboxylic acid residues, hydroquinone residues and p-hydroxybenzoic acid residues; low melting points
10/19/1999US5968858 Potassium boron silicate glass in organic vehicle wherein glass follows specific stoichiometry according to ternary compositional diagram
10/19/1999US5967854 Circuit connector
10/19/1999US5967850 High-density electrical interconnect system
10/19/1999US5967848 Apparatus for providing controlled impedance in an electrical contact
10/19/1999US5967837 Assembly for connecting an electric/electronic device to a printed circuit board
10/19/1999US5967801 Modular plug having compensating insert
10/19/1999US5967402 Aluminum nitride sintered compact and the copper foil mutually diffuse when a liquid and a component which is mutually reactive with the liquid are applied and cause an exothermic reaction
10/19/1999US5966805 End connecting portion of a planar circuit body, and method of making same
10/19/1999US5966804 Printed wiring board assemblies
10/14/1999WO1999052337A1 Printed-circuit board with bypass capacitor for mounting integrated circuit, and method of manufacture
10/14/1999WO1999052334A1 Circuit member and circuit board
10/14/1999WO1999052210A1 Component carrier
10/14/1999WO1999052148A1 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
10/14/1999WO1999052147A1 Wire bond attachment of a integrated circuit package to a heat sink
10/14/1999WO1999034112A3 Apparatus for routing electrical signals in an engine
10/14/1999DE19915745A1 Assembly structure of electronic parts prevents the formation of cracks in adhesive substrate
10/14/1999DE19816066A1 Folie als Träger von integrierten Schaltungen Film as a substrate of integrated circuits
10/14/1999DE19815291A1 Beschichtungszusammensetzung zur Herstellung von elektrisch leitfähigen Schichten A coating composition for producing electrically conductive layers
10/14/1999DE19814428A1 Circuit substrate with connector surfaces or solder pads
10/14/1999DE19811578A1 Multiple layer circuit board especially for chip card
10/14/1999DE19804264C1 Loudspeaker device for motor vehicle display or operating unit
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