| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/29/1999 | EP0945912A1 Dielectric filter and method of manufacturing the same |
| 09/29/1999 | EP0945477A1 Cyanate ester based thermoset compositions |
| 09/29/1999 | EP0945381A2 Apparatus for inductively measuring the position of a metal sheet |
| 09/29/1999 | EP0875011A4 Optical circuit on printed circuit board |
| 09/29/1999 | EP0601203B1 Photosensitive resin composition |
| 09/29/1999 | CN1230330A Modularized hearing aid circuit structure |
| 09/29/1999 | CN1230145A Reinforcement mat |
| 09/29/1999 | CN1229972A Storage apparatus |
| 09/29/1999 | CN1229817A Cyanate ester based thermoset compositions |
| 09/28/1999 | US5960307 Method of forming ball grid array contacts |
| 09/28/1999 | US5959847 Form factor-configured channel bank card containing form factor non-conformal printed circuit board |
| 09/28/1999 | US5959845 Universal chip carrier connector |
| 09/28/1999 | US5959844 Instrument cluster |
| 09/28/1999 | US5959842 Surface mount power supply package and method of manufacture thereof |
| 09/28/1999 | US5959839 Apparatus for heat removal using a flexible backplane |
| 09/28/1999 | US5959709 Display unit with flexible printed circuit board |
| 09/28/1999 | US5959366 Electrical connection system for motor-vehicle subassembly |
| 09/28/1999 | US5959358 Oxidation resistant high conductivity copper layers for microelectronic applications and process of making same |
| 09/28/1999 | US5959356 Solder ball grid array carrier package with heat sink |
| 09/28/1999 | US5959348 Construction of PBGA substrate for flip chip packing |
| 09/28/1999 | US5959256 Multilayer printed wiring board |
| 09/28/1999 | US5959042 Material comprising a polyamide, a polymer having polyamide and polyether blocks and a functionalized polyolefin, and film and object obtained therefrom |
| 09/28/1999 | US5958808 Low dielectric constant glass fiber containing in specific weights, oxides fo silicon, aluminum, boron, calcium, magnesium, lithium, sodium and potassium; useful as reinforcement of printed wiring board |
| 09/28/1999 | US5958597 Ceramic electronic part |
| 09/28/1999 | US5958592 Composites of fluoroaliphatic cyanate resins for low dielectric applications |
| 09/28/1999 | US5958590 Dendritic powder materials for high conductivity paste applications |
| 09/28/1999 | US5958572 Multilayer; variations in heat conductivity |
| 09/28/1999 | US5958562 Electrically conductive material filling openings to couple wiring pattern sections |
| 09/28/1999 | US5958556 Vibration damped and stiffened circuit articles |
| 09/28/1999 | US5958209 Electrodeposition of copper foil having a low profile matte side and specific crystal orientation from a substantially chlorine-free solution of cupric, stannous, ferrous ions and polyoxyalkylene glycol surfactant |
| 09/28/1999 | US5958030 Intra-shelf free space interconnect |
| 09/28/1999 | US5956843 Multilayer printed wiring board and method of making same |
| 09/28/1999 | CA2143175C Flex circuit board for liquid crystal display |
| 09/23/1999 | WO1999048345A1 Electrical component arrangement on a circuit card |
| 09/23/1999 | WO1999041770A3 Routing topology for identical connector point layouts on primary and secondary sides of a substrate |
| 09/23/1999 | DE19908979A1 Base for positioning semiconductor device on circuit board |
| 09/23/1999 | DE19811733A1 Arrangement of electric components on a circuit board especially for running electric lamps |
| 09/23/1999 | DE19810842A1 Modular power output stage for driving several axle drive motors for multiple axle machines, esp. machine tools, robot drives, packaging machines, etc. |
| 09/23/1999 | DE19810428A1 Electronic device housing with contact region e.g. for a portable electronic device |
| 09/22/1999 | EP0944098A2 Thermally conductive electrical insulating composition |
| 09/22/1999 | EP0943392A2 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 09/22/1999 | EP0943170A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 09/22/1999 | CN2340146Y Double-side metal film |
| 09/22/1999 | CN1229515A Resistance wiring board and method for manufacturing the same |
| 09/22/1999 | CN1229330A Hybrid module and making method thereof and mounting method thereof |
| 09/22/1999 | CN1229212A Signaling improvement using extended transmission lines on high speed DIMMS |
| 09/21/1999 | US5956560 Tungsten-copper composite powder |
| 09/21/1999 | US5956237 Primary printed wiring board |
| 09/21/1999 | US5956235 Method and apparatus for flexibly connecting electronic devices |
| 09/21/1999 | US5956234 Method and structure for a surface mountable rigid-flex printed circuit board |
| 09/21/1999 | US5956233 High density single inline memory module |
| 09/21/1999 | US5955789 Ball grid array module |
| 09/21/1999 | US5955776 Spherical shaped semiconductor integrated circuit |
| 09/21/1999 | US5955733 Imaging support for removably mounting an image device |
| 09/21/1999 | US5955704 Optimal PWA high density routing to minimize EMI substrate coupling in a computer system |
| 09/21/1999 | US5955686 Brazing materials for producing metal-ceramics composite substrates |
| 09/21/1999 | US5955184 Bisphenol a type epoxy resin, novolak type epoxy resin, nitrogen-containing phenolic resin acting as a curing agent which is a reaction product of a phenolic compound, a guanamine compound and an aldehyde compound. |
| 09/21/1999 | US5955179 Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 09/21/1999 | US5955176 Copper alloy |
| 09/21/1999 | US5954751 Implantable defibrillator with stacked transistor subassemblies |
| 09/21/1999 | CA2093480C Aromatic diamine and polyimide, and preparation process of same |
| 09/16/1999 | WO1999046967A1 Modular power output stage |
| 09/16/1999 | WO1999046965A2 Integrated circuit connection using an electrically conductive adhesive |
| 09/16/1999 | WO1999046818A1 IMPROVEMENTS TO THE PROTECTION OF FETs BY MEANS OF TRACKS OF PRINTED CIRCUIT BOARDS |
| 09/16/1999 | WO1999046813A1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 09/16/1999 | WO1999046781A1 Process of making a printed wiring board core stock and product formed therefrom |
| 09/16/1999 | DE19811076A1 Illuminated laminar panel hot-pressed from resin prepregs, transparent overlay and structurally-supportive under-protection |
| 09/16/1999 | DE19810749A1 Radio set for use as terminal in mobile radio systems |
| 09/16/1999 | DE19810736A1 High impedance input for connecting voltage source to voltage-processing circuit, e.g. for electrochemical sensor |
| 09/16/1999 | CA2295157A1 Improvements to the protection of fets by means of tracks of printed circuit boards |
| 09/15/1999 | EP0942636A2 Solder bonding printed circuit board |
| 09/15/1999 | EP0942628A2 Microphone assembly and calibration method |
| 09/15/1999 | EP0942436A1 Electroconductive resin composition |
| 09/15/1999 | EP0941644A1 Electronic circuit with a screening case to attenuate high-frequency interference |
| 09/15/1999 | EP0941545A2 Method of manufacturing a plurality of electronic components |
| 09/15/1999 | CN1228882A Power pad/power delivery system |
| 09/15/1999 | CN1045134C Circuit protector |
| 09/14/1999 | US5953594 Method of making a circuitized substrate for chip carrier structure |
| 09/14/1999 | US5953447 Method for recognizing a printed circuit board fiducial mark in order to decide origin point in chip mounter |
| 09/14/1999 | US5953216 Method of repairing an electrical assembly |
| 09/14/1999 | US5953215 For enhancing the performance of an electronic system |
| 09/14/1999 | US5953214 Dual substrate package assembly coupled to a conducting member |
| 09/14/1999 | US5953213 Multichip module |
| 09/14/1999 | US5953210 Reworkable circuit board assembly including a reworkable flip chip |
| 09/14/1999 | US5953203 A support, a burried screen printed capacitor made from a dielectric selected from barium titanate and lead-magnesium niobiate, a silver conductor layer printed below and above the capacitor, an overlying green tape layer |
| 09/14/1999 | US5952901 Laminated electronic component with trimmable parallel electrodes |
| 09/14/1999 | US5952836 In a rotor strap of a helicopter |
| 09/14/1999 | US5952719 Metal ball grid electronic package having improved solder joint |
| 09/14/1999 | US5952713 Non-contact type IC card |
| 09/14/1999 | US5952709 High-frequency semiconductor device and mounted structure thereof |
| 09/14/1999 | US5952629 Switch apparatus |
| 09/14/1999 | US5952431 Process for producing acid-modified polyphenylene ether and polystyrenic resin composition |
| 09/14/1999 | US5952083 Used for electronic packaging such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film to avoid short circuiting |
| 09/14/1999 | US5951918 Composite electroconductive powder, electroconductive paste, process for producing electroconductive paste, electric circuit and process for producing electric circuit |
| 09/14/1999 | US5951917 Conductive paste for large greensheet screening including high thixotropic agent content |
| 09/14/1999 | US5951304 Fanout interconnection pad arrays |
| 09/14/1999 | US5950968 Wire holder and wire holder assembly |
| 09/14/1999 | US5950306 Circuit board |
| 09/14/1999 | US5950303 Method and fixturing to perform two side laminations of stacked substrates forming 3-D modules |
| 09/14/1999 | US5950292 Methods of fabricating applique circuits |