Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/1999
10/14/1999CA2327331A1 Wire bond attachment of a integrated circuit package to a heat sink
10/14/1999CA2327330A1 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
10/13/1999EP0949855A2 Multilayer circuit board
10/13/1999EP0949854A1 Multilayered printed wiring board
10/13/1999EP0949853A1 Heat spreader mounting pad configurations for laser soldering
10/13/1999EP0949715A2 Improved contact for error resistant coupling of electrical signals
10/13/1999EP0949582A1 Electronic object
10/13/1999EP0949306A1 Coating composition for the production of electrically conductive layers
10/13/1999EP0948881A1 Method of soldering components to at least one carrier
10/13/1999EP0948879A1 Ceramic composite wiring structures for semiconductor devices and method of manufacture
10/13/1999EP0948815A1 Chip module and manufacturing process
10/13/1999EP0948737A1 Electric resistor and a mechanical electrical transformer produced with said electric resistor
10/13/1999EP0934614A4 Vehicle power distribution box
10/13/1999CN1231467A Electro-acoustic transducer
10/13/1999CN1231319A Process for increasing adhesive capacity of polyimide to active metal
10/13/1999CN1231307A Curable polyphenylene ether-thermosetting resin composition and process
10/13/1999CN1045703C 接收机 Receiver
10/13/1999CN1045693C Contact structure for interconnections, interposer, semiconductor assembly and method
10/12/1999US5966647 Portable receiver having pivotally connected case arranged to shield antenna
10/12/1999US5966580 Process for making a thin film using a metal paste
10/12/1999US5966294 Printed circuit board for prevention of unintentional electromagnetic interference
10/12/1999US5966052 Voltage-controlled oscillator with input and output on opposite corners of substrate
10/12/1999US5966020 Printed circuit board
10/12/1999US5965944 Printed circuit boards for mounting a semiconductor integrated circuit die
10/12/1999US5965935 Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications
10/12/1999US5965848 Disposable portable electronic devices and method of making
10/12/1999US5965843 Diagonal printed conductor connecting metal coatings of two walls of a box
10/12/1999US5965682 Derived from polymerization of vinyl aromatic monomer in presence of 10 to 1000 ppm, based on amount of vinyl aromatic monomer, of a multifunctinal monomer having more than one olefinic functionality
10/12/1999US5965274 Body of nickel-aluminum based alloys with adherent alumina layer formed via oxidation covering a portion of its surface; and a conductive element, a portion being electrically insulated from the alloy; strength, thermoconductivity
10/12/1999US5965273 Polyphenylene sulfide, a cyclic olefin copolymer or a blend coated on a ceramic selected from calcium or strontium zirconate, calcium titanium silicate, lead zirconate or zirconia balanced so dielectric constant is >4; variation <2%
10/12/1999US5965262 Reinforcement mat
10/12/1999US5965245 Prepreg for printed circuit board
10/12/1999US5965193 Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
10/12/1999US5964918 Spray pyrolysis of a solution of metal salt(s), in which at least one metal, semimetal or oxide is added to the solution remaining unmelted and heat-segregated to the surface of the powder; nonaggregating, uniform particle size
10/12/1999US5964854 Card cage for an electronic control unit having signal-processing components and high-speed digital components coupled to a common ground plane
10/10/1999CA2268700A1 Heat spreader mounting pad configurations for laser soldering
10/07/1999WO1999051074A1 Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace
10/07/1999WO1999051072A1 Electronic circuit structure with optimised space requirement according to available volume
10/07/1999WO1999051070A1 Hybrid circuit with contact surfaces (solder pads)
10/07/1999WO1999050909A1 Semiconductor socket converter module
10/07/1999WO1999050871A1 Hybrid circuit arrangement with a thermal release
10/07/1999WO1999050708A1 Liquid crystal display and manufacture thereof
10/07/1999WO1999050480A1 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances
10/07/1999WO1999049934A1 Implantable medical electrode comprising a flexible printed circuit
10/07/1999WO1999041701A3 Flat carrier with a display device
10/07/1999WO1999022570A3 Three-dimensional electronic module
10/07/1999DE19914520A1 Rolled copper foil e.g. for flexible printed connection components of flexible printed circuits useful in printer heads and hard disk drives
10/07/1999DE19914305A1 On-board device relaying digital input signal as complementary signal on transmission line pair
10/07/1999DE19911731A1 Multilayer printed circuit board for electronic device, such as information processing or communications device
10/07/1999DE19818502C1 Heat dissipating printed circuit board e.g. PCB
10/07/1999DE19812965A1 Vorrichtung zum induktiven Messen der Lage eines Metallbandes Apparatus for inductive measuring the position of a metal strip
10/06/1999EP0948250A1 Electronic component and mounting method and device therefor
10/06/1999EP0947532A1 Epoxy resin composition for printed circuit board and printed circuit board using the same
10/06/1999EP0947391A2 Electrical distribution system
10/06/1999EP0947127A1 Vibration damped and stiffened circuit articles
10/06/1999EP0947125A1 Method of making a printed circuit board having a tin/lead coating
10/06/1999EP0947124A1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion
10/06/1999EP0946914A1 Methods and devices relating to circuit board constructions
10/06/1999EP0876743B1 Control device, especially for a motor vehicle
10/06/1999CN1230815A Electrical coupler for detachable interconnection between main unit and external unit
10/06/1999CN1230740A LCD module
10/05/1999US5963793 Microelectronic packaging using arched solder columns
10/05/1999US5963689 Substrate edge connnector
10/05/1999US5963681 Circuit board guide and light conduit
10/05/1999US5963463 Method for on-board programming of PRD serial EEPROMS
10/05/1999US5963434 Electronic device and method
10/05/1999US5963287 Display unit with flexible printed circuit board
10/05/1999US5963121 Resettable fuse
10/05/1999US5963111 Orthogonal transition from coax to stripline for opposite sides of a stripline board
10/05/1999US5963045 Method for testing circuit board assemblies
10/05/1999US5963023 Power surge management for high performance integrated circuit
10/05/1999US5962925 Mounting structure of electronic component having bumps
10/05/1999US5962922 Semiconductor device flat package
10/05/1999US5962917 Semiconductor device package having end-face halved through-holes and inside-area through-holes
10/05/1999US5962835 Board adapter
10/05/1999US5962815 Antifuse interconnect between two conducting layers of a printed circuit board
10/05/1999US5962348 Method of making thermal core material and material so made
10/05/1999US5962151 Method for controlling solderability of a conductor and conductor formed thereby
10/05/1999US5962122 Liquid crystalline polymer composites having high dielectric constant
10/05/1999US5962073 Selectively etching the elastomer and the ppa matrix with a solution containing chromic acid, then effectively removing from the substrate any retained chromium which would adversely affect the ability of metal plating to adhere to the
10/05/1999US5961808 An alloy film containing mainly nickel and phosphorus is formed by not an electroless plating process but an electrolytic plating process. film thickness of the formed alloy film of the middle part on the surface of the insulating
10/05/1999US5961349 Assembly of shielded connectors and a board having plated holes
10/05/1999US5960538 Printed circuit board
10/05/1999US5960535 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
10/05/1999CA2104401C Novel demetallizing procedure
09/1999
09/30/1999WO1999049707A1 Moulded part and flexible film with a protected printed conductor, and method for producing the same
09/30/1999WO1999049513A1 An inductance device
09/30/1999WO1999049468A1 Rambus stakpak
09/30/1999WO1999049283A1 Support for a temperature-sensitive resistor
09/30/1999WO1999049118A1 Base webs for printed circuit board production using the foam process and aramid fibers
09/30/1999WO1999048639A1 Leadless solder
09/30/1999DE19850884A1 Storage device for recording/reproducing information on/from a magnetic medium minimizes influence of stray capacitance on transfer path to ensure high speed transfer of analogue reading signals and writing data
09/30/1999DE19812880A1 Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung Molding and flexible film with a protected trace and process for their preparation
09/30/1999DE19809138A1 Leiterplatte mit SMD-Bauelementen PCB with SMD components
09/30/1999DE19753149C2 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate
09/30/1999CA2325535A1 An inductance device
09/30/1999CA2325025A1 Moulded part and flexible film with a protected printed conductor, and method for producing the same
09/30/1999CA2266980A1 High density stacked circuit module
09/29/1999EP0945940A1 Motor starter block
09/29/1999EP0945934A1 Electrical coupler for detachable interconnection between a main unit and an external unit
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