Patents for H05K 1 - Printed circuits (98,583)
12/1999
12/07/1999US5998738 Electronic control module
12/07/1999US5998314 Low-temperature sinterable ceramic composition, and monolithic ceramic substrate using the same
12/07/1999US5998291 Attachment method for assembly of high density multiple interconnect structures
12/07/1999US5998239 Method of manufacturing a semiconductor device with a brazing mount
12/07/1999US5998237 Dielectric polymer material is used to form layers on the printed circuit board as a base for electrical circuitry and for photoforming vias.
12/07/1999US5998228 Method of testing semiconductor
12/07/1999US5998043 High melting point metallizing layer, intervening metal layer, which has a melting point of not greater than 1,000.degree. c. and consists mainly of at least one selected from among ni, cu and fe
12/07/1999US5998037 Porcelain enamel composition for electronic applications
12/07/1999US5998036 Dielectric pastes and tapes, and metal substrates coated therewith
12/07/1999US5997999 Sintered body for manufacturing ceramic substrate
12/07/1999US5997983 Rigid/flex printed circuit board using angled prepreg
12/07/1999US5997710 Copper foil for a printed circuit board, a process and an apparatus for producing the same
12/07/1999US5997358 Electrical connector having time-delayed signal compensation
12/07/1999US5996880 Method of manufacturing dual-bank memory modules with shared capacitors
12/07/1999US5996418 Laminated pressure sensing device
12/07/1999US5996222 Soldering process with minimal thermal impact on substrate
12/02/1999WO1999062309A1 Circuit board of protective circuit for storage battery, protective circuit for storage battery, and storage battery pack
12/02/1999WO1999062168A1 Packaging of a dc-to-dc converter
12/02/1999WO1999062143A1 Pcb to metallic ground connection method
12/02/1999WO1999062135A1 Wideband rf port structure using coplanar waveguide and bga i/o
12/02/1999WO1999062105A2 A package for power converters with improved transformer operations
12/02/1999WO1999044400A3 Backplane having reduced lc product
12/02/1999WO1999039555A9 Circuit board
12/02/1999WO1999022571A3 Three-dimensional flexible electronic module
12/02/1999DE19924341A1 Elektronisches Keramikbauteil und eine Anbringungsstruktur für dasselbe Ceramic electronic part and a mounting structure for the same
12/02/1999DE19923287A1 Dry production of a green ceramic layer useful in an electronic circuit component
12/02/1999DE19822095A1 Plastic housing for electrical razor or toothbrush
12/02/1999DE19805492C2 Leiterplatte Circuit board
12/02/1999CA2333403A1 Wideband rf port structure using coplanar waveguide and bga i/o
12/01/1999EP0961531A2 Highly integrated electronic circuit, especially for using in heart stimulators
12/01/1999EP0961530A2 Electronic appliance comprising a printed circuit board comprising an insect repellent
12/01/1999EP0961321A2 High-frequency module
12/01/1999EP0961303A2 A transformer assembly
12/01/1999EP0960895A2 Highly purified epoxy resin
12/01/1999EP0960866A1 Ceramic substrate composition and ceramic circuit component
12/01/1999EP0960855A1 Non hygroscopic thermally stable aluminium hydroxide
12/01/1999EP0960553A1 Method and machine for producing flexible and semirigid printed-circuit boards
12/01/1999EP0960468A1 Multi-deck power converter module
12/01/1999EP0960038A1 Manufacture of a wiring loom
12/01/1999EP0925175A4 Maleimide containing formulations and uses therefor
12/01/1999CN1237325A Assembly consisting of substrate for power components and cooling element and method for production thereof
12/01/1999CN1237191A Heat-resistant, lowly dielectric polymer, and films, substrates, electronic components and heat-resistant resin moldings produced therefrom
12/01/1999CN1237081A PCB-type transformer without iron core
12/01/1999CN1237012A Picture capacitor assembly
12/01/1999CN1236798A Conducting resin composition for filling small hole, and double-face and multi-layer board made of same and producing method thereof
12/01/1999CN1236789A Cyanate ester composition and cured product thereof
12/01/1999CN1046950C Epoxy resin mixture
12/01/1999CN1046949C 环氧树脂混合物 Epoxy resin mixture
11/1999
11/30/1999US5995380 Electric junction box for an automotive vehicle
11/30/1999US5995379 Stacked module and substrate therefore
11/30/1999US5995376 Chassis which includes configurable slot 0 locations
11/30/1999US5995372 Card-type electronic device with plastic frame sandwiched between printed circuit board and metal panel
11/30/1999US5995370 Heat-sinking arrangement for circuit elements
11/30/1999US5995329 Hard magnetic disc unit having head gimbal assemblies
11/30/1999US5995322 Magnetic disk apparatus
11/30/1999US5995321 Carriage structure for disk device
11/30/1999US5995262 Signal transmission bus and signal processing apparatus
11/30/1999US5995232 Method of and device for inspecting a PCB
11/30/1999US5995006 Radio frequency tag
11/30/1999US5994997 Thick-film resistor having concentric terminals and method therefor
11/30/1999US5994983 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement
11/30/1999US5994765 Clock distribution network with efficient shielding
11/30/1999US5994703 Printed sheet for deflection coils
11/30/1999US5994648 Three-dimensional molded sockets for mechanical and electrical component attachment
11/30/1999US5994480 Resin composites and method for producing the same
11/30/1999US5994429 Blend of bisphenol epoxy resin, dicyandiamide curing agent, red phosphorus particles and filler
11/30/1999US5994166 Method of constructing stacked packages
11/30/1999US5993946 Wiring board for mounting electronic devices with high-density terminals and method for producing wiring board
11/30/1999US5993945 Does not requiring drilling of vias, yet provides good adhesion of circuitization to dielectric layer.
11/30/1999US5993908 Depositing polycrystalline aluminum film containing copper, heating to a target temperature, controlled cooling to a final temperature
11/30/1999US5993579 High performance electrical cable and method of manufacture
11/30/1999US5993301 Apparatus to clean golden plates
11/30/1999US5993248 Battery connector
11/30/1999US5992320 Transfer sheet, and pattern-forming method
11/30/1999US5992012 Method for making electrical interconnections between layers of an IC package
11/30/1999CA2132247C Electrical angle connector of a printed circuit board type having a plurality of connecting conductive strips of a common length
11/29/1999CA2272448A1 Non-hygroscopic thermally stable aluminium hydroxide
11/25/1999WO1999060832A1 Electronic circuit card assembly
11/25/1999WO1999060831A1 Printed circuit board and method of production thereof
11/25/1999WO1999060830A1 Multiple printed panel for electronic components, and method for constructing bumps, soldering frames, spacers and similar on said multiple printed panel
11/25/1999WO1999060829A2 Method and apparatus for making electrical traces, circuits and devices
11/25/1999WO1999060828A1 Mounting structure for temperature-sensitive fuse on circuit board
11/25/1999WO1999060827A2 Method for the packing of components, a card module and its cooling system
11/25/1999WO1999060699A1 System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus
11/25/1999WO1999060689A1 Embedded backup energy storage unit
11/25/1999WO1999060637A1 Ptc element, ptc element-mounted pcb board, secondary cell protection circuit device and secondary cell assembly
11/25/1999WO1999060627A1 Electronic module
11/25/1999WO1999060315A1 Holder for use in refrigeration appliance and method for the production of such a holder
11/25/1999WO1999060070A1 Adhesive and circuit material using the adhesive
11/25/1999WO1999059761A1 Laser machining method
11/25/1999DE19824048C1 Compact circuit arrangement incorporating heat-dissipating components, for vehicles
11/25/1999DE19822990A1 Two part molded socket-type electrical connector
11/25/1999DE19822345A1 Circuit board connection with hybrid device
11/25/1999DE19820345A1 Solid solder deposition on circuit boards
11/25/1999DE19750324C2 Schichtweise ausgebildetes elektronisches Bauelement Layer by layer formed electronic component
11/25/1999CA2332891A1 Multiple blank for electronic components, in particular surface acoustic wave components, and method of building up bumps, solder frames, spacers and the like on the multiple blank
11/25/1999CA2332251A1 Embedded backup energy storage unit
11/24/1999EP0959649A1 Temperature measuring type outside connecting mechanism for printed wiring board
11/24/1999EP0959648A1 Printed wiring board and manufacturing method therefor
11/24/1999EP0959500A2 Packaging silicon on silicon multichip modules