| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/16/2000 | WO2000015015A1 Multilayer printed wiring board and method for manufacturing the same |
| 03/16/2000 | WO2000015002A1 Door-dependent system for enabling and adjusting options on hearing aids |
| 03/16/2000 | WO2000014798A1 Electronic part module mounted on socket |
| 03/16/2000 | WO2000014771A2 Non-circular micro-via |
| 03/16/2000 | WO2000014679A1 Method for contacting a circuit chip |
| 03/16/2000 | WO1999056509A9 Flip chip devices with flexible conductive adhesive |
| 03/16/2000 | DE4423888C2 Vorrichtung zur elektrischen Kontaktierung eines sich auf der Außenseite der Fahrzeugscheibe eines Kraftfahrzeugs befindlichen Sensors A device for electrically contacting a is located on the outside of the vehicle pane of a motor vehicle sensor |
| 03/16/2000 | DE19845296A1 Verfahren zur Kontaktierung eines Schaltungschips Method for contacting a circuit chip |
| 03/16/2000 | DE19841804A1 Preparation of an electrically conducting structure on a substrate for computer-controlled ink jet printing involves using an aqueous dispersion of polyalkylene dioxythiophenes with a polyanion as counter ion |
| 03/16/2000 | DE19831394A1 Carrier for electrical and/or electronic components has board with openings approximately corresp. to component connections and in electrical contact with corresp. tracks |
| 03/16/2000 | CA2343119A1 Door-dependent system for enabling and adjusting options on hearing aids |
| 03/15/2000 | EP0986289A2 Layout and method of marking circuit substrates |
| 03/15/2000 | EP0986197A2 Optical transmitting/receiving method and apparatus |
| 03/15/2000 | EP0986127A2 Nonreciprocal circuit device and its manufacturing method |
| 03/15/2000 | EP0986044A2 Display units and components thereof |
| 03/15/2000 | EP0985756A1 Woven glass fabrics and laminate for printed wiring boards |
| 03/15/2000 | EP0985486A1 Leadless solder |
| 03/15/2000 | EP0985474A2 Metal powder, method for producing the same by reduction of metallic salt, and conductive pastes containing this metal powder |
| 03/15/2000 | EP0985332A1 Rigid/flex printed circuit board using angled prepreg |
| 03/15/2000 | EP0985253A1 Method of applying esd protection to a shielded electrical connnector |
| 03/15/2000 | EP0985061A1 Fibers made from long chain branched syndiotactic vinyl aromatic polymers |
| 03/15/2000 | EP0902990A4 High density connector arrangement for a circuit board module |
| 03/15/2000 | EP0879489B1 Circuit board clip connector |
| 03/15/2000 | EP0764352A4 Microelectronic contacts and assemblies |
| 03/15/2000 | CN2369457Y Improved pressed pad |
| 03/15/2000 | CN1247689A Printed circuit assembly |
| 03/15/2000 | CN1247688A Combined electrical and optical edge contact for compact connection of part to another part, use thereof and method of mfg. such interconnection |
| 03/15/2000 | CN1247448A 印刷线路板 Printed circuit boards |
| 03/15/2000 | CN1247358A Displaying device and its parts |
| 03/15/2000 | CN1050452C Device for controlling motor vehicle |
| 03/14/2000 | US6038137 Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon |
| 03/14/2000 | US6038135 Wiring board and semiconductor device |
| 03/14/2000 | US6038133 Circuit component built-in module and method for producing the same |
| 03/14/2000 | US6038132 Memory module |
| 03/14/2000 | US6037902 Intrusion detection systems employing active detectors |
| 03/14/2000 | US6037641 Optical device package including an aligned lens |
| 03/14/2000 | US6037547 Via configuration with decreased pitch and/or increased routing space |
| 03/14/2000 | US6037438 As laminates in the electric and electronic fields in which low-dielectric property is desired and also applicable to uses of sealing and molding |
| 03/14/2000 | US6037048 Fibers made from long chain branched syndiotactic vinyl aromatic polymers |
| 03/14/2000 | US6037045 Thick-film paste and ceramic circuit substrate using the same |
| 03/14/2000 | US6037044 Direct deposit thin film single/multi chip module |
| 03/14/2000 | US6036912 Production method for ceramic green sheet |
| 03/14/2000 | US6036889 Efficiently consolidated to solid metal and bonded firmly to circuit board substrates at low temperature |
| 03/14/2000 | US6036836 Forming studs to connect spaced high density chips to the board by covering first copper layer with photoresist, then etching pattern and repeating, finally plating with copper so that first and last copper layers are separated |
| 03/14/2000 | US6036798 Process for producing electronic part with laminated substrates |
| 03/14/2000 | US6036505 Mechanism for connecting printed circuit boards of separate devices |
| 03/14/2000 | US6035712 Sensor device and method of producing the same using lead frame |
| 03/14/2000 | US6035528 Method of manufacturing electronic components |
| 03/09/2000 | WO2000013474A1 Forming plugs in vias of circuit board layers and subassemblies |
| 03/09/2000 | WO2000013473A1 Electrical component stacking system |
| 03/09/2000 | WO2000013254A1 Method for vertical connection of conductors in a device in the microwave range |
| 03/09/2000 | WO2000013228A1 Method for connecting electronic components to a substrate, and a method for checking such a connection |
| 03/09/2000 | WO2000013190A1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
| 03/09/2000 | WO2000012614A1 Flame retardant resin compositions containing phosphoramides, and method for making |
| 03/09/2000 | WO2000012613A1 Flame retardant polymer blends, and method for making |
| 03/09/2000 | WO2000012612A1 Flame retardant resin compositions containing phosphoramides, and method for making |
| 03/09/2000 | WO2000012611A1 Flame retardant resin compositions containing phosphoramides, and method for making |
| 03/09/2000 | WO2000012610A1 Flame resistant polyphenylene ether-polyamide resin blends |
| 03/09/2000 | WO2000012609A1 Flame retardant polymer blends, and method for making |
| 03/09/2000 | WO2000012608A1 Flame resistant polyketone resin compositions |
| 03/09/2000 | WO1999064657A8 Fabric or garment with integrated flexible information infrastructure |
| 03/09/2000 | WO1999062105A8 A package for power converters with improved transformer operations |
| 03/09/2000 | DE19860691A1 Magnet paste for production of flat magnets comprises a carrier paste with embedded particles made of a soft-magnetic alloy |
| 03/09/2000 | DE19840355A1 Optoelectronic component, esp. for communications between circuit boards, has two main surfaces with optical communications arrangements contg. infrared transmitters/receivers, etc. |
| 03/09/2000 | DE19826649C1 Phantom component item for use in circuit boards' automatic equipping machines |
| 03/09/2000 | DE19822794C1 Mehrfachnutzen für elektronische Bauelemente, insbesondere akustische Oberflächenwellen-Bauelemente Multiple uses for electronic components, especially surface acoustic wave devices |
| 03/09/2000 | CA2341645A1 Method for vertical connection of conductors in a device in the microwave range |
| 03/08/2000 | EP0984467A1 Method and apparatus for producing multilayer body for electronic component |
| 03/08/2000 | EP0984030A2 Polyimide film and process for manufacture thereof |
| 03/08/2000 | EP0983714A2 Method and arrangement for heating a component |
| 03/08/2000 | EP0983713A1 Electrical component arrangement on a circuit card |
| 03/08/2000 | EP0983712A1 ELECTRONIC PLATE FOLDED AT 45o |
| 03/08/2000 | EP0983617A1 Device for transmitting high-frequency signals |
| 03/08/2000 | EP0983616A1 Method and device for connecting two millimetric elements |
| 03/08/2000 | EP0897351B1 Overlay substrate for securing electronic devices in a vehicle |
| 03/08/2000 | CN2368136Y Flexible printed circuitboard cable device |
| 03/08/2000 | CN1246878A Themoplastic molding materials |
| 03/08/2000 | CN1246739A Improved microstrip edge package board connector |
| 03/08/2000 | CN1050260C Panel assembly structure and panel assembling method having minimal spacing electrode terminal |
| 03/07/2000 | US6035382 Circuit for receiving a command word for accessing a secure subkey |
| 03/07/2000 | US6034571 Oscillator module having a multi-layered base with a cover |
| 03/07/2000 | US6034421 Semiconductor device including molded IC fixed to casing |
| 03/07/2000 | US6034200 Heat-curable epoxy resin composition |
| 03/07/2000 | US6033936 Method of mounting an LSI package |
| 03/07/2000 | US6033787 Ceramic circuit board with heat sink |
| 03/07/2000 | US6033765 Having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin |
| 03/07/2000 | US6033764 Bumped substrate assembly |
| 03/07/2000 | US6033289 Detailing and cleaning apparatus for green ceramic dry dicing process |
| 03/07/2000 | US6032357 Method of fabricating a printed circuit |
| 03/07/2000 | US6032356 Wafer-level test and burn-in, and semiconductor process |
| 03/07/2000 | US6032355 Method of forming thermal conductive structure on printed circuit board |
| 03/07/2000 | CA2164353C Backplane arrangement for electrical equipment |
| 03/02/2000 | WO2000011920A1 Printed circuit plate used for testing electric components |
| 03/02/2000 | WO2000011919A1 Improved wiring substrate with thermal insert |
| 03/02/2000 | WO2000011755A1 Contact device mainly intended for contact between electric components and circuit supports and method for producing said device |
| 03/02/2000 | WO2000011747A1 Microwave dielectric material |
| 03/02/2000 | WO2000011716A1 Isolated flip chip or bga to minimize interconnect stress due to thermal mismatch |
| 03/02/2000 | WO2000011687A1 Planar transformer |
| 03/02/2000 | WO2000011681A1 Coatings for emi/rfi shielding |
| 03/02/2000 | WO2000011454A1 Inspection of printed circuit boards using color |