| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/02/2000 | WO2000032019A1 Depaneling system having multiple router stations |
| 06/02/2000 | WO2000031844A1 Secondary electric power distribution cabinet in an aeroplane |
| 06/02/2000 | WO2000031832A1 High density electrical connector |
| 06/02/2000 | WO2000031798A1 High density electronic package |
| 06/02/2000 | WO2000031591A1 Method of forming conductive pattern |
| 06/02/2000 | WO2000031163A2 Poly(arylene ether) homopolymer compositions and methods of manufacture thereof |
| 06/02/2000 | WO2000030865A1 Three-layer polyester resin sheet for cards and polyester resin laminates made by using the same |
| 06/02/2000 | WO2000013473A8 Electrical component stacking system |
| 06/02/2000 | WO2000003436A3 Low cost high power hermetic package with electrical feed-through bushings |
| 06/02/2000 | CA2351421A1 Printed circuit assembly having locally enhanced wiring density |
| 05/31/2000 | EP1005260A2 Formation of thin film capacitors |
| 05/31/2000 | EP1005259A2 Circuit board |
| 05/31/2000 | EP1005088A1 Sintered body for and manufacture of ceramic substrates |
| 05/31/2000 | EP1005086A2 Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate |
| 05/31/2000 | EP1005073A1 Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film |
| 05/31/2000 | EP1004141A1 A system and method for packaging integrated circuits |
| 05/31/2000 | EP0474879B1 Paste for high temperature baking |
| 05/31/2000 | DE19958029A1 Burn-in circuit board for burn-in testing of electronic apparatus, provides heat sink load for device under test (DUT) |
| 05/31/2000 | DE19952246A1 Electromechanical component includes covering and support layers composed of inflammable plastic material |
| 05/31/2000 | DE19854271A1 Leiterplatte Circuit board |
| 05/31/2000 | DE19844738C1 Three-dimensional integrated coil structure for plastics circuit boards |
| 05/31/2000 | CN1255087A Very ultra thin conductor layers for printed wiring boards |
| 05/31/2000 | CN1255039A Method for connection between electronic elements and circuit board and its finished products |
| 05/31/2000 | CN1254934A Formation of thin-film capacitor |
| 05/31/2000 | CN1254744A Electrically conducting adhesive, structural body for installation, LCD, electronic device and making method |
| 05/31/2000 | CN1254710A Polybenzoxazole resin and precursor thereof |
| 05/30/2000 | US6069682 Spherical shaped semiconductor integrated circuit |
| 05/30/2000 | US6069679 Selective call receiver having a display module with integrated circuits and method therefor |
| 05/30/2000 | US6069548 Planar transformer |
| 05/30/2000 | US6069323 Pad with indentations surface mount |
| 05/30/2000 | US6069029 Semiconductor device chip on lead and lead on chip manufacturing |
| 05/30/2000 | US6068952 Second pattern consists of a plurality of said first patterns so that it receives the same influence of aberration as said first pattern when irradiated with light. |
| 05/30/2000 | US6068912 Platible non-metallic filler material for metallurgical screening paste |
| 05/30/2000 | US6068782 Individual embedded capacitors for laminated printed circuit boards |
| 05/30/2000 | US6067843 Measuring sensor |
| 05/30/2000 | CA2198488C Printed circuit board inductor |
| 05/25/2000 | WO2000030418A1 Carbon coating method for electromagnetic shielding of electronic circuit boards to provide electromagnetic compatibility |
| 05/25/2000 | WO2000030210A1 Smartcard module and method of attaching antenna wires thereto |
| 05/25/2000 | WO2000030206A1 Adapters for rf connectors |
| 05/25/2000 | WO2000029208A1 Electrically heatable, transparent windows and mirrors and method for production |
| 05/25/2000 | DE19853777A1 Heat sink element for printed circuit board electronic component provided by metallic plate with pins along at least one side edge fitting through holes in surface of printed circuit board |
| 05/25/2000 | DE19853506A1 Acoustic signal source for automobile has interference suppression components mounted on insulating circuit board with contact pads for connection to electrical circuit of acoustic signal source |
| 05/25/2000 | DE19849878A1 Programmierung von Steuergeräten bei geschlossenem Gehäuse Programming of control units with closed housing |
| 05/24/2000 | EP1003216A2 Multilayered ceramic structure |
| 05/24/2000 | EP1003211A2 Multilayer ceramic structure |
| 05/24/2000 | EP1002638A2 Method of manufacturing a flexible circuit board |
| 05/24/2000 | EP1002611A1 Solder ball connections and assembly process |
| 05/24/2000 | EP1002610A1 Solder ball connections and assembly process |
| 05/24/2000 | EP1002452A1 Contact arrangement linking two substrates and method for the production of said contact arrangement |
| 05/24/2000 | EP1001852A1 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 05/24/2000 | EP0918610B1 Circuit-carrying automotive component and method of manufacturing the same |
| 05/24/2000 | EP0852896A4 Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing |
| 05/24/2000 | EP0715773B1 Cross-connect system |
| 05/24/2000 | CN1254252A Series-connected circuit board and its manufacture method |
| 05/24/2000 | CN1254251A Rolled copper foil as base plate for making flexible printed circuit board and its production method |
| 05/24/2000 | CN1253970A Thermosetting resin composite for assembling process |
| 05/24/2000 | CN1253969A Circuit element prepared with allylated amide compound |
| 05/24/2000 | CN1253961A Polybenzoxazole resin and its precursor |
| 05/23/2000 | US6067594 High frequency bus system |
| 05/23/2000 | US6067236 Power supply for providing high voltage power from a low voltage source |
| 05/23/2000 | US6067231 Heat-dissipating structure for an electrical device |
| 05/23/2000 | US6067226 Apparatus for increasing the number of input/output ports while maintaining the form factor of an associated computer chassis |
| 05/23/2000 | US6067216 Safeguard feature in a circuit arrangement for protecting an electrical component from an undesirable electrical potential |
| 05/23/2000 | US6067052 Loop antenna configuration for printed wire board applications |
| 05/23/2000 | US6067002 Circuit substrate with a built-in coil |
| 05/23/2000 | US6066808 Multilayer circuit board having metallized patterns formed flush with a top surface thereof |
| 05/23/2000 | US6065978 Input/output connector for portable communication device and process for mounting the said connector |
| 05/23/2000 | US6065977 Device for connecting circuit boards to each other |
| 05/18/2000 | WO2000028661A1 Bus through termination circuit |
| 05/18/2000 | WO2000028629A1 Socket for ic device |
| 05/18/2000 | WO2000028385A2 Method and device for aligning two photo masks with each other and optionally, an unexposed printed circuit board blank, and for subsequent simultaneous exposure in the production of double-sided printed circuit boards |
| 05/18/2000 | WO2000027776A1 Carbon-based metal composite material, method for preparation thereof and use thereof |
| 05/18/2000 | WO2000027685A1 Improvements relating to power steering |
| 05/18/2000 | WO2000027641A1 Method of manufacturing printed-circuit board, method of manufacturing recording device, and mask for printed-circuit board |
| 05/18/2000 | WO2000007222A3 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
| 05/18/2000 | WO2000005936A8 Hybrid solder ball and pin grid array circuit board interconnect system and method |
| 05/18/2000 | DE19954375A1 Rolled copper foil, especially for flexible printed circuits, consists of tough-pitch copper containing silver and having a specified softening temperature |
| 05/18/2000 | DE19847088A1 Flächig ausgebildeter Träger für Halbleiter-Chips und Verfahren zu seiner Herstellung Surface formed carrier for semiconductor chips and process for its preparation |
| 05/17/2000 | EP1001666A2 Electrical contacting device for an electrochemical fuel cell |
| 05/17/2000 | EP1001439A1 Printed annular coil and method of manufacture thereof |
| 05/17/2000 | EP1000529A1 Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards |
| 05/17/2000 | EP0883980B1 High speed depaneling apparatus and method |
| 05/17/2000 | EP0729839B1 Thermal printing head |
| 05/17/2000 | CN1253468A Control of thermal distortion of chip mount |
| 05/17/2000 | CN1253467A Flat resistor and capacitor and making method thereof |
| 05/17/2000 | CN1253466A Flat resistor and capacitor and making method thereof |
| 05/17/2000 | CN1253465A Built-in fingered flat capacitor and resistor and making method thereof |
| 05/17/2000 | CN1253377A Module type semi-conductor device |
| 05/17/2000 | CN1052554C Rotary variable resistor |
| 05/16/2000 | US6064576 Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board |
| 05/16/2000 | US6064575 Circuit module assembly |
| 05/16/2000 | US6064285 Printed circuit board helical resonator and filter apparatus |
| 05/16/2000 | US6063327 Shaping tools and quartz composites, curing, heating and hardening |
| 05/16/2000 | US6062904 PC card connector |
| 05/16/2000 | CA2057490C Laminated diamond substrate |
| 05/11/2000 | WO2000027178A1 Case for circuit board for horizontal or vertical mounting |
| 05/11/2000 | WO2000027174A1 An electrical component and an electrical circuit module having connected ground planes |
| 05/11/2000 | WO2000027173A1 Test coupon for printed wiring board |
| 05/11/2000 | WO2000027172A1 Foldable circuits and method of making same |
| 05/11/2000 | WO2000027171A2 Electromechanical component |