Patents for H05K 1 - Printed circuits (98,583)
11/1999
11/24/1999EP0959056A1 Method for controlling firing shrinkage of ceramic green body
11/24/1999EP0958717A1 Backplane for high speed data processing system
11/24/1999EP0958607A1 Transferred flexible integrated circuit
11/24/1999EP0896714B1 Esd protection of magnetic heads
11/24/1999EP0809862B1 Organic chip carriers for wire bond-type chips
11/24/1999EP0579610B1 Demetallizing apparatus
11/24/1999CN1236536A Console panel for equipment
11/24/1999CN1236410A Heat resistant fiber paper
11/24/1999CN1236219A Method of forming groove in surface of mother substrate
11/24/1999CN1236203A Electronic part and method of manufacturing the same
11/23/1999US5991435 Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component
11/23/1999US5991164 Electronic device with connecting/disconnecting screw
11/23/1999US5991162 High-frequency integrated circuit device and manufacture method thereof
11/23/1999US5991161 Multi-chip land grid array carrier
11/23/1999US5991156 Ball grid array integrated circuit package with high thermal conductivity
11/23/1999US5990981 Modular video signal matrix switcher with color-coded components
11/23/1999US5990802 Modular LED messaging sign panel and display system
11/23/1999US5990776 Low noise full integrated multilayers magnetic for power converters
11/23/1999US5990752 Method for mechanically tuning a voltage controlled oscillator
11/23/1999US5990736 High frequency amplifier with a guard circuit and a radio wave transmission apparatus including the same
11/23/1999US5990732 Composite high frequency apparatus and method of forming same
11/23/1999US5990553 Multilayer; polyimide dielectric
11/23/1999US5990550 Integrated circuit device cooling structure
11/23/1999US5990547 Semiconductor device having plated contacts and method thereof
11/23/1999US5990505 Solid-state image pickup device
11/23/1999US5990421 Built in board resistors
11/23/1999US5990028 Dielectric paste
11/23/1999US5989936 Microelectronic assembly fabrication with terminal formation from a conductive layer
11/23/1999US5989074 Wire pair disconnect module
11/23/1999US5988856 Apparatus for real-time estimation of printing medium properties and method for the use thereof
11/23/1999US5987742 Technique for attaching a stiffener to a flexible substrate
11/23/1999US5987739 Method of making a polymer based circuit
11/23/1999US5987732 Method of making compact integrated microwave assembly system
11/18/1999WO1999059387A1 A heating method for a printed circuit board and a printed circuit board comprising a heating element
11/18/1999WO1999059386A1 Substrate for formation of special pattern, and method of manufacture of substrate
11/18/1999WO1999059270A1 Signal transmission method and motherboard structure
11/18/1999WO1999059239A1 Method for mechanically tuning a voltage controlled oscillator
11/18/1999WO1999058748A1 Plasma catalysis of carbon nanofibers
11/18/1999WO1999058373A1 Electric junction box for an automotive vehicle
11/18/1999DE19902348A1 Ball raster array device to facilitate of reading input and output signals of integrated circuit mounted on printed circuit board
11/18/1999DE19821857A1 Hochintegrierte elektronische Schaltung, insbesondere zum Einsatz in Herzschrittmachern Highly integrated electronic circuit, in particular for use in heart pacemakers
11/18/1999DE19820414A1 Kontaktierungsvorrichtung Contacting
11/18/1999DE19812690C1 Träger für einen temperaturabhängigen Widerstand Carrier for a temperature-dependent resistor
11/17/1999EP0957664A1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device
11/17/1999EP0957663A2 Electronic part and a method of manufacturing the same
11/17/1999EP0957520A2 Semiconductor package and mount board, and mounting method
11/17/1999EP0957513A1 Electronic parts device
11/17/1999EP0957123A2 Cyanate ester composition and cured product thereof
11/17/1999EP0957122A2 Epoxy resin composition
11/17/1999EP0956748A1 Printed circuit multilayer assembly and method of manufacture therefor
11/17/1999EP0956747A1 Circuit board for electrical apparatus with hf components, particularly for mobile radiocommunications equipment
11/17/1999EP0956746A1 Means and method for mounting electronics
11/17/1999EP0956745A1 Microelectronic lead structures with dielectric layers
11/17/1999EP0956564A1 Polymeric compositions having a temperature-stable dielectric constant
11/17/1999EP0956538A1 Modular data medium
11/17/1999EP0956161A1 Ipc (chip) termination machine
11/17/1999EP0795262A4 Chemically grafted electrical devices
11/17/1999EP0766907B1 Metallized laminate material having ordered distribution of conductive through holes
11/17/1999EP0569509B1 Electrical connectors
11/17/1999CN1235699A Electronic part device
11/17/1999CN1046618C Printed circuit board including code and method of forming them
11/17/1999CN1046557C Electrodeposited copper foil and process therefor by electrolyte solutions
11/16/1999USRE36396 Electrical substrate material comprising amorphous fused silica powder
11/16/1999US5987531 Control board system including a removable terminal stand which can easily conform to different specifications and power sources
11/16/1999US5987337 Radio pager
11/16/1999US5986893 Apparatus for controlling the impedance of high speed signals on a printed circuit board
11/16/1999US5986887 Stacked circuit board assembly adapted for heat dissipation
11/16/1999US5986886 Three-dimensional flexible electronic module
11/16/1999US5986884 Method for cooling electronic components
11/16/1999US5986853 Transducer suspension system
11/16/1999US5986614 Antenna device
11/16/1999US5986613 Electric contact and process for producing electric contact
11/16/1999US5986506 Semiconductor microwave amplifier
11/16/1999US5986342 Liquid crystal display apparatus structure for mounting semiconductor device
11/16/1999US5986339 Laminated multilayer substrates
11/16/1999US5986218 Circuit board with conductor layer for increased breakdown voltage
11/16/1999US5986217 Printed circuit board for mitigating thermally-induced mechanical damage of solder joints connecting electronic components
11/16/1999US5985785 Manufacturing a laminate which is catalytically effective for subsequent electroless deposition thereon of metals, such as copper, and which is useful as a substrate for printed circuit boards
11/16/1999US5985760 Method for manufacturing a high density electronic circuit assembly
11/16/1999US5985461 Electroconductive paste, and method for producing ceramic substrate using it
11/16/1999US5985456 Heat curable; nonhydrolzying; corrosion resistance
11/16/1999US5985161 Method of forming printed circuits having multiple conductor thicknesses
11/16/1999US5985068 Forming two thin metal film layers on supporting member, forming monolithic ceramic structure incorporating said film, changing portion of first metal film into insulating material and diffusing into ceramic
11/16/1999US5985043 Thermally curable adhesive comprising acid having two or more double bonds as fluxing agent, double bond containing diluent capable of crosslinking fluxing agent, optionally free radical initiator, resin
11/16/1999US5984699 Method of fabricating a semiconductor device
11/16/1999US5984692 Board stacking connector chip and tape cartridge containing the chip
11/16/1999US5984691 Flexible circuitized interposer with apertured member and method for making same
11/16/1999US5984523 Method for recording the heat generated in a hole wall of a substrate during a drilling operation
11/16/1999US5984464 Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer
11/16/1999US5983493 Method of temporarily, then permanently, connecting to a semiconductor device
11/16/1999US5983490 Conductive ball mounting apparatus
11/16/1999CA2112860C Integrated circuit package and assembly thereof for thermal and emi management
11/11/1999WO1999057954A1 Local-coordinate-based component-position verification
11/11/1999WO1999057951A1 A printed circuit board and a method of processing printed circuit boards
11/11/1999WO1999057948A1 Printed circuit board material and method of manufacturing board material and intermediate block body for board material
11/11/1999WO1999057341A1 Dispersion-strengthened electrolytic cupper foil and method for producing the same
11/11/1999WO1999057170A1 Modified polyamide resins and heat-resistant compositions containing the same
11/11/1999WO1998046827A9 Dispersions of aramid fibres and aramid sheets
11/11/1999DE19915702A1 Mounting structure for printed circuit boards in computer server
11/11/1999DE19820524A1 Micro-optical bench, e.g. for optical transmitters and receivers, enables miniaturized optical components to be adjusted w.r.t. each other and can be incorporated into electrical assembly and connection techniques