| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/11/2000 | WO2000027166A2 Transducer concepts for hearing aids and other devices |
| 05/11/2000 | WO2000026942A2 Method for producing filled vias in electronic components |
| 05/11/2000 | WO2000026726A1 Method of forming pattern |
| 05/11/2000 | WO2000026318A1 Adhesive composition |
| 05/11/2000 | WO2000026269A1 Vinyl terminated polybutadienes containing urethane or ester residues |
| 05/11/2000 | WO2000026152A1 High dielectric constant buried capacitors with extended operating temperature ranges |
| 05/11/2000 | WO2000025941A1 Methods of forming metal contact pads on a metal support substrate |
| 05/11/2000 | WO2000013190A8 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
| 05/11/2000 | WO2000007219A3 High density printed circuit substrate and method of fabrication |
| 05/11/2000 | DE19952966A1 Modular semiconductor device, e.g. a power semiconductor module, has a tin-soldered heat sink of reduced thickness relative to the tin solder layer |
| 05/11/2000 | DE19951754A1 Background radiation blocking component structure used for circuit boards comprises a blocking component having a magnetic layer and a conducting layer |
| 05/11/2000 | DE19949378A1 Abgeschirmte impedanzgesteuerte Gatling-Geschütz-Durchkontaktierung Screened impedance controlled Gatling gun-plated-through hole |
| 05/11/2000 | DE19947092A1 Printed circuit board has electronic component(s) mounted in positioning area for separation from circuit board for another application |
| 05/11/2000 | DE19851575A1 Verfahren und Vorrichtung zum Ausrichten zweier Fotomasken zueinander und gegebenenfalls eines unbelichteten Leiterplatten-Rohlings und zum anschließenden simultanen Belichten bei der Herstellung von doppelseitigen Leiterplatten Method and apparatus for aligning two photomasks with each other and optionally an unexposed PCB blank and subsequent to simultaneous exposure in the production of double-sided printed circuit boards |
| 05/11/2000 | DE19851172A1 Anordnung zur Erwärmung einer bestückten gedruckten Schaltung Arrangement for heating a mounted on a printed circuit |
| 05/11/2000 | DE19850936A1 Trägersubstrat mit einer Widerstandsbahn Carrier substrate having a resistive track |
| 05/11/2000 | CA2348275A1 Case for circuit board for horizontal or vertical mounting |
| 05/10/2000 | EP0999731A1 Printed wiring board and method for manufacturing the same |
| 05/10/2000 | EP0999728A1 An electrical component and an electrical circuit module having connected ground planes |
| 05/10/2000 | EP0999725A2 Heating device for printed circuit board |
| 05/10/2000 | EP0999591A1 Semiconductor package |
| 05/10/2000 | EP0999562A2 Carrier substrate with resistance strip |
| 05/10/2000 | EP0999532A1 Resonant tag labels and method of making same |
| 05/10/2000 | EP0999253A1 Adhesive and circuit material using the adhesive |
| 05/10/2000 | EP0998760A1 Solid-state energy storage module employing integrated interconnect board |
| 05/10/2000 | EP0998608A1 Aramid papers of improved solvent resistance and dimensionally stable laminates made therefrom |
| 05/10/2000 | EP0777873B1 A coupling device presenting and/or dominating a capacitance belonging to a board with a printed circuit |
| 05/10/2000 | CN1252923A A shielding housing and method of producing a shielding housing |
| 05/10/2000 | CN1252894A BGA connector with heat activated connection and disconnection means |
| 05/10/2000 | CN1252683A Attached structure for control element of radiation noise |
| 05/10/2000 | CN1252682A Mixed type module |
| 05/10/2000 | CN1052373C Circuit board and circuit board module |
| 05/10/2000 | CN1052347C Printed circuit board sparkgap |
| 05/10/2000 | CN1052245C Epoxy acrylates containing carboxy and its preparing method and use |
| 05/10/2000 | CN1052189C 喷墨记录头 Ink jet recording head |
| 05/09/2000 | US6061263 Small outline rambus in-line memory module |
| 05/09/2000 | US6061249 Sealing system and method for sealing circuit card connection sites |
| 05/09/2000 | US6061248 Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon |
| 05/09/2000 | US6061246 Microelectric packages including flexible layers and flexible extensions, and liquid crystal display modules using the same |
| 05/09/2000 | US6061245 Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
| 05/09/2000 | US6061243 Modular and multifunctional structure |
| 05/09/2000 | US6061241 Line interface module |
| 05/09/2000 | US6061240 Push pin assembly for heat sink for cooling electronic modules |
| 05/09/2000 | US6061238 Information processing apparatus, method of arranging components of the apparatus, and heat sink |
| 05/09/2000 | US6061235 Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management |
| 05/09/2000 | US6061228 Multi-chip module having an integral capacitor element |
| 05/09/2000 | US6060954 Oscillator device having inductor formed inside multi-layer circuit board |
| 05/09/2000 | US6060780 Surface mount type unit and transducer assembly using same |
| 05/09/2000 | US6060777 Underside heat slug for ball grid array packages |
| 05/09/2000 | US6060775 Semiconductor device |
| 05/09/2000 | US6060665 Grooved paths for printed wiring board with obstructions |
| 05/09/2000 | US6060664 Electronic circuit component |
| 05/09/2000 | US6060381 Method of manufacturing an electronic part having an air-bridge interconnection |
| 05/09/2000 | US6060339 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 05/09/2000 | US6060165 Thick film paste conductors for multilayer ceramic electronic components; oxidation resistance; storage stability; resistors, capacitors; circuits; heating to decompose a metal compound to a metal while forming a glass protective coating |
| 05/09/2000 | US6060150 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 05/09/2000 | US6059983 Method for fabricating an overcoated printed circuit board with contaminant-free areas |
| 05/09/2000 | US6059949 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances |
| 05/09/2000 | US6059382 Control device for an antilocking system and process for producing a control device |
| 05/09/2000 | CA2230506C Nickel powder and process for preparing the same |
| 05/04/2000 | WO2000025562A1 Stacked circuit board assembly adapted for heat dissipation |
| 05/04/2000 | WO2000025559A1 Method for manufacturing a circuit board |
| 05/04/2000 | WO2000025558A1 A circuit board and a method for manufacturing the same |
| 05/04/2000 | WO2000025392A1 Coding element |
| 05/04/2000 | WO2000025378A1 Micro-electrochemical energy storage cells |
| 05/04/2000 | WO2000025265A1 Method for making a chip card and an electronic module designed to be inserted in such a card |
| 05/04/2000 | WO2000025141A1 High density printed circuit board |
| 05/04/2000 | WO2000024692A1 Silicon nitride composite substrate |
| 05/04/2000 | WO2000024612A1 Ribbed trim panel for thermal spraying of electrical circuit |
| 05/04/2000 | WO2000024544A1 Lead-free solder |
| 05/04/2000 | WO2000005748A3 Blind pin placement on circuit boards |
| 05/04/2000 | DE19850388A1 Hybrid carrier board, e.g. for motor vehicle engine control circuit, with microcontroller as flip chip module attached to board with further hybrid carrier substrate arranged over flip chip for additional components |
| 05/04/2000 | DE19847537A1 Platine mit auf beiden Seiten angeordneten Leiterbahnen Board having arranged on both sides conductor tracks |
| 05/04/2000 | CA2348507A1 Stacked circuit board assembly adapted for heat dissipation |
| 05/03/2000 | EP0998179A1 Device to support a circuit board |
| 05/03/2000 | EP0998176A2 Controllers programming in closed casing |
| 05/03/2000 | EP0997982A2 Electrical connector for printed circuit boards |
| 05/03/2000 | EP0997944A2 Printed circuit board with integrated circuit devices mounted on both sides thereof |
| 05/03/2000 | EP0997941A2 Conductive paste and ceramic printed circuit substrate using the same |
| 05/03/2000 | EP0997935A1 Printed wiring board and method for manufacturing the same |
| 05/03/2000 | EP0997497A1 Alkoxysilane/organic polymer composition for thin insulating film production and use thereof |
| 05/03/2000 | EP0997488A1 Polybenzoxazole resin and precursor thereof |
| 05/03/2000 | EP0997060A1 A device and method in electronics systems |
| 05/03/2000 | EP0996955A1 Hybrid circuit arrangement with overload protection |
| 05/03/2000 | EP0996534A1 Very ultra thin conductor layers for printed wiring boards |
| 05/03/2000 | EP0883862B1 Integrated circuit card comprising a conductor pattern made of a conductive polymer |
| 05/03/2000 | EP0880687B1 Arrangement comprising an electrical printed-circuit board and an electrical pressure pick-up |
| 05/03/2000 | EP0803135B1 Electrical connections with deformable contacts |
| 05/03/2000 | EP0576560B1 Low noise optical probe |
| 05/03/2000 | CN1252113A Dispersions of aramid fibres and sheets |
| 05/03/2000 | CN1251830A Crystal glass composite article, crystal glass, insulating composite article, insulating paste and thick film circuit board |
| 05/03/2000 | CN1251789A Nickel composite granules and manufacture thereof |
| 05/03/2000 | CN1052138C Printed circuit card with minor surface I/O pads |
| 05/03/2000 | CN1052088C Display board having wiring with three-layered structure and display device including the display board |
| 05/03/2000 | CN1052027C Pastes for coating of substrates, methods for manufacturing them and their use |
| 05/02/2000 | US6058256 Technique for effectively routing conduction paths in circuit layouts |
| 05/02/2000 | US6058023 Isolation of high-voltage components in a dense environment |
| 05/02/2000 | US6058022 Upgradeable PCB with adaptable RFI suppression structures |
| 05/02/2000 | US6058020 Component housing for surface mounting of a semiconductor component |
| 05/02/2000 | US6058019 Electronic circuit card assembly having confined ground path return |