Patents for H05K 1 - Printed circuits (98,583)
05/2000
05/02/2000US6058018 Electronic card
05/02/2000US6058017 Plastic integrated circuit card with an enclosed reinforcement structure separated from an integrated circuit module for protecting the integrated circuit module
05/02/2000US6058013 Molded housing with integral heatsink
05/02/2000US6058004 Unitized discrete electronic component arrays
05/02/2000US6058000 Method and apparatus for electromagnetic shielding and electrostatic discharge protection
05/02/2000US6057743 Distributed noise reduction circuits in telecommunication system connector
05/02/2000US6057600 Structure for mounting a high-frequency package
05/02/2000US6057512 Flexible printed circuitry with pseudo-twisted conductors
05/02/2000US6057221 Laser-induced cutting of metal interconnect
05/02/2000US6057175 Method of making encapsulated package
05/02/2000US6057027 Method of making peripheral low inductance interconnects with reduced contamination
05/02/2000US6055857 Instrument cluster gauge mounting means
05/02/2000US6055847 Measuring sensor having metal jacket lead and externally mounted threaded connector
05/02/2000US6055725 Method for reducing shorts on a printed circuit board edge connector
05/02/2000US6055722 Stripline flexible cable to printed circuit board attachment system
04/2000
04/27/2000WO2000024080A1 Voltage tunable laminated dielectric materials for microwave applications
04/27/2000WO2000024051A1 Method and device for producing shaped ceramic bodies using setter plates
04/27/2000WO1999064657A9 Fabric or garment with integrated flexible information infrastructure
04/27/2000DE19949771A1 Flexible circuit board for head gimbal assembly of hard disk has a conductive tab electrically connected to a pre-amp pad and head pad
04/27/2000DE19847946A1 Multilayer circuit board, with an integrated capacitor, comprises a first planar aluminum insert electrode bearing an aluminum oxide layer as an insulating interlayer
04/27/2000DE19847521A1 Einrichtung zum Abstützen einer Schaltungsplatine Means for supporting a circuit board
04/27/2000CA2346878A1 Voltage tunable laminated dielectric materials for microwave applications
04/26/2000EP0996323A2 Surface mounting part
04/26/2000EP0996322A2 Electronic circuit unit useful for portable telephones or the like, and a method of manufacturing the same
04/26/2000EP0996320A1 Double sided circuit board
04/26/2000EP0996317A1 Structure and method for mounting an electronic circuit unit to a printed board
04/26/2000EP0996194A2 Electrical connector
04/26/2000EP0995346A1 A heating method for a printed circuit board and a printed circuit board comprising a heating element
04/26/2000EP0995207A1 Surface mount multilayer capacitor
04/26/2000EP0995199A1 Electrical device, electrical appliance or lighting device
04/26/2000CN2376164Y Card puller structure
04/26/2000CN1251734A Method of arraging signal and destination pads to provide multiple signal/destination connection
04/26/2000CN1251685A Monolithic inductor and method of manufacturing same
04/26/2000CN1251476A Device capable of fastening object on plate
04/26/2000CN1251400A Completely aromatic-polyamide-fiber synthesized paper sheet
04/26/2000CN1251333A Novel composite foil and its mfg. method, and copper-coated laminated plate
04/26/2000CN1051905C Multilayer printed circuit board for frame unit back-wall
04/26/2000CN1051904C Fixing end structure of electronic unit
04/25/2000US6055385 Camera
04/25/2000US6055154 In-board chip cooling system
04/25/2000US6055151 A capacitor ink comprising a dielectric selected from barium titanate, titanium oxide and lead-magnesium niobate, a low firing temperature glass including 2% or less barium oxide and an organic vehicle for screen printing of ink on the tape
04/25/2000US6054975 Liquid crystal display device having tape carrier packages
04/25/2000US6054767 Programmable substrate for array-type packages
04/25/2000US6054762 Semiconductor substrates of high reliability ceramic metal composites
04/25/2000US6054757 Semiconductor apparatus, circuit board and combination thereof
04/25/2000US6054720 Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture
04/25/2000US6054653 Apparatus for attaching a surface mount component
04/25/2000US6054652 Thin-film multi-layer substrate and electronic device
04/25/2000US6054545 Modified cellulose compound and photopolymerizable resin composition containing the same
04/25/2000US6054509 Adhesive of epoxy resin, nitrile rubbers and curing agent
04/25/2000US6054175 Spurttering metal with low melting point onto conductive metal powder while vibrating powder to produce conductive filler comprising metal powder having metallic layer; mixing filler with matrix resin to make paste; applying paste and heating
04/25/2000US6053394 Column grid array substrate attachment with heat sink stress relief
04/25/2000CA2042047C A function unit
04/20/2000WO2000022899A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates
04/20/2000WO2000022896A1 Fabrication process for flex circuit applications
04/20/2000WO2000022895A1 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
04/20/2000WO2000022894A1 Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging
04/20/2000WO2000022893A1 Article having an embedded electronic device, and method of making same
04/20/2000WO2000022674A1 Tape ball grid array with interconnected ground plane
04/20/2000WO2000022673A1 Two-dimensional support for semiconductor chips, and a method for producing such a two-dimensional support
04/20/2000WO2000022624A1 Disk drive enclosure
04/20/2000WO2000022443A1 Improving multi-chip module testability using poled-polymer interlayer dielectrics
04/20/2000WO2000021904A1 Composite plate and method for producing and using such a composite plate
04/20/2000WO2000021900A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
04/20/2000WO2000021899A1 Impregnated glass fiber strands and products including the same
04/20/2000WO2000021659A1 Integrated multilayered microfluidic devices and methods for making the same
04/20/2000DE19916010C1 Heat conduction device for circuit board component heat sink has press-fit element inserted in opening in printed circuit board between circuit board component and heat sink mounted on opposite circuit board surfaces
04/20/2000DE19904364C1 Object, especially a faulty circuit board, is marked using a low vapor pressure room temperature solid marker which releases a detectable gas on heating
04/20/2000DE19853018C1 Chip card antenna coil manufacturing and mounting method has stamped out coil windings held together by residual bridging sections separated upon application of adhesive foil bridges
04/20/2000DE19846638A1 Composite board, especially a mounting board for power electronic modules, comprises a ceramic board eutectic bonded directly to a silver sheet
04/20/2000DE19845041A1 Production of photostructured layers on planar substrates used in the manufacture of sensors comprises using a screen printed layer with an added wet chemical structured binder
04/20/2000CA2346111A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
04/20/2000CA2346059A1 Integrated multilayered microfluidic devices and methods for making the same
04/20/2000CA2346027A1 Impregnated glass fiber strands and products including the same
04/20/2000CA2344826A1 Fabrication process for flex circuit applications
04/20/2000CA2344663A1 Tape ball grid array with interconnected ground plane
04/19/2000EP0994640A2 Method of making a circuit assembly
04/19/2000EP0994639A1 Lattice-shaped circuit board
04/19/2000EP0994508A1 Semiconductor device comprising bump contacts
04/19/2000EP0994215A1 Wholly aromatic polyamide fiber synthetic paper sheet
04/19/2000EP0993677A1 Thermal release for fixing on a circuit substrate
04/19/2000EP0993597A1 Organic solvent vapor detector
04/19/2000EP0858433A4 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
04/19/2000CN1250939A Sheet like variable resistor having metallic terminals
04/19/2000CN1051670C Method for mfg. laminar stackable circuit board structure
04/19/2000CN1051669C Circuit board having non-annular welding zone
04/19/2000CN1051668C Circuit board with capacitor, and mfg. method therefor
04/18/2000US6052172 Contacting device for display panel
04/18/2000US6052171 Liquid crystal display with electrically connected integrated circuits and opposite voltage line between input and output wirings
04/18/2000US6052170 Inspectable liquid-crystal display panel and method of inspecting same
04/18/2000US6052093 Small omni-directional, slot antenna
04/18/2000US6052045 Electromechanical switching device package with controlled impedance environment
04/18/2000US6052038 Crosstalk reduction in parsitically coupled circuits
04/18/2000US6052012 Method and apparatus for clock uncertainly minimization
04/18/2000US6051878 Method of constructing stacked packages
04/18/2000US6051662 Curable polyphenylene ether-thermosetting resin composition and process
04/18/2000US6051448 Method of manufacturing an electronic component
04/18/2000US6051171 Method for controlling firing shrinkage of ceramic green body
04/18/2000US6051093 Mounting method of semiconductor element
04/18/2000US6050830 Tape carrier package for liquid crystal display