Patents for H05K 1 - Printed circuits (98,583) |
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05/02/2000 | US6058018 Electronic card |
05/02/2000 | US6058017 Plastic integrated circuit card with an enclosed reinforcement structure separated from an integrated circuit module for protecting the integrated circuit module |
05/02/2000 | US6058013 Molded housing with integral heatsink |
05/02/2000 | US6058004 Unitized discrete electronic component arrays |
05/02/2000 | US6058000 Method and apparatus for electromagnetic shielding and electrostatic discharge protection |
05/02/2000 | US6057743 Distributed noise reduction circuits in telecommunication system connector |
05/02/2000 | US6057600 Structure for mounting a high-frequency package |
05/02/2000 | US6057512 Flexible printed circuitry with pseudo-twisted conductors |
05/02/2000 | US6057221 Laser-induced cutting of metal interconnect |
05/02/2000 | US6057175 Method of making encapsulated package |
05/02/2000 | US6057027 Method of making peripheral low inductance interconnects with reduced contamination |
05/02/2000 | US6055857 Instrument cluster gauge mounting means |
05/02/2000 | US6055847 Measuring sensor having metal jacket lead and externally mounted threaded connector |
05/02/2000 | US6055725 Method for reducing shorts on a printed circuit board edge connector |
05/02/2000 | US6055722 Stripline flexible cable to printed circuit board attachment system |
04/27/2000 | WO2000024080A1 Voltage tunable laminated dielectric materials for microwave applications |
04/27/2000 | WO2000024051A1 Method and device for producing shaped ceramic bodies using setter plates |
04/27/2000 | WO1999064657A9 Fabric or garment with integrated flexible information infrastructure |
04/27/2000 | DE19949771A1 Flexible circuit board for head gimbal assembly of hard disk has a conductive tab electrically connected to a pre-amp pad and head pad |
04/27/2000 | DE19847946A1 Multilayer circuit board, with an integrated capacitor, comprises a first planar aluminum insert electrode bearing an aluminum oxide layer as an insulating interlayer |
04/27/2000 | DE19847521A1 Einrichtung zum Abstützen einer Schaltungsplatine Means for supporting a circuit board |
04/27/2000 | CA2346878A1 Voltage tunable laminated dielectric materials for microwave applications |
04/26/2000 | EP0996323A2 Surface mounting part |
04/26/2000 | EP0996322A2 Electronic circuit unit useful for portable telephones or the like, and a method of manufacturing the same |
04/26/2000 | EP0996320A1 Double sided circuit board |
04/26/2000 | EP0996317A1 Structure and method for mounting an electronic circuit unit to a printed board |
04/26/2000 | EP0996194A2 Electrical connector |
04/26/2000 | EP0995346A1 A heating method for a printed circuit board and a printed circuit board comprising a heating element |
04/26/2000 | EP0995207A1 Surface mount multilayer capacitor |
04/26/2000 | EP0995199A1 Electrical device, electrical appliance or lighting device |
04/26/2000 | CN2376164Y Card puller structure |
04/26/2000 | CN1251734A Method of arraging signal and destination pads to provide multiple signal/destination connection |
04/26/2000 | CN1251685A Monolithic inductor and method of manufacturing same |
04/26/2000 | CN1251476A Device capable of fastening object on plate |
04/26/2000 | CN1251400A Completely aromatic-polyamide-fiber synthesized paper sheet |
04/26/2000 | CN1251333A Novel composite foil and its mfg. method, and copper-coated laminated plate |
04/26/2000 | CN1051905C Multilayer printed circuit board for frame unit back-wall |
04/26/2000 | CN1051904C Fixing end structure of electronic unit |
04/25/2000 | US6055385 Camera |
04/25/2000 | US6055154 In-board chip cooling system |
04/25/2000 | US6055151 A capacitor ink comprising a dielectric selected from barium titanate, titanium oxide and lead-magnesium niobate, a low firing temperature glass including 2% or less barium oxide and an organic vehicle for screen printing of ink on the tape |
04/25/2000 | US6054975 Liquid crystal display device having tape carrier packages |
04/25/2000 | US6054767 Programmable substrate for array-type packages |
04/25/2000 | US6054762 Semiconductor substrates of high reliability ceramic metal composites |
04/25/2000 | US6054757 Semiconductor apparatus, circuit board and combination thereof |
04/25/2000 | US6054720 Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture |
04/25/2000 | US6054653 Apparatus for attaching a surface mount component |
04/25/2000 | US6054652 Thin-film multi-layer substrate and electronic device |
04/25/2000 | US6054545 Modified cellulose compound and photopolymerizable resin composition containing the same |
04/25/2000 | US6054509 Adhesive of epoxy resin, nitrile rubbers and curing agent |
04/25/2000 | US6054175 Spurttering metal with low melting point onto conductive metal powder while vibrating powder to produce conductive filler comprising metal powder having metallic layer; mixing filler with matrix resin to make paste; applying paste and heating |
04/25/2000 | US6053394 Column grid array substrate attachment with heat sink stress relief |
04/25/2000 | CA2042047C A function unit |
04/20/2000 | WO2000022899A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
04/20/2000 | WO2000022896A1 Fabrication process for flex circuit applications |
04/20/2000 | WO2000022895A1 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
04/20/2000 | WO2000022894A1 Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging |
04/20/2000 | WO2000022893A1 Article having an embedded electronic device, and method of making same |
04/20/2000 | WO2000022674A1 Tape ball grid array with interconnected ground plane |
04/20/2000 | WO2000022673A1 Two-dimensional support for semiconductor chips, and a method for producing such a two-dimensional support |
04/20/2000 | WO2000022624A1 Disk drive enclosure |
04/20/2000 | WO2000022443A1 Improving multi-chip module testability using poled-polymer interlayer dielectrics |
04/20/2000 | WO2000021904A1 Composite plate and method for producing and using such a composite plate |
04/20/2000 | WO2000021900A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
04/20/2000 | WO2000021899A1 Impregnated glass fiber strands and products including the same |
04/20/2000 | WO2000021659A1 Integrated multilayered microfluidic devices and methods for making the same |
04/20/2000 | DE19916010C1 Heat conduction device for circuit board component heat sink has press-fit element inserted in opening in printed circuit board between circuit board component and heat sink mounted on opposite circuit board surfaces |
04/20/2000 | DE19904364C1 Object, especially a faulty circuit board, is marked using a low vapor pressure room temperature solid marker which releases a detectable gas on heating |
04/20/2000 | DE19853018C1 Chip card antenna coil manufacturing and mounting method has stamped out coil windings held together by residual bridging sections separated upon application of adhesive foil bridges |
04/20/2000 | DE19846638A1 Composite board, especially a mounting board for power electronic modules, comprises a ceramic board eutectic bonded directly to a silver sheet |
04/20/2000 | DE19845041A1 Production of photostructured layers on planar substrates used in the manufacture of sensors comprises using a screen printed layer with an added wet chemical structured binder |
04/20/2000 | CA2346111A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
04/20/2000 | CA2346059A1 Integrated multilayered microfluidic devices and methods for making the same |
04/20/2000 | CA2346027A1 Impregnated glass fiber strands and products including the same |
04/20/2000 | CA2344826A1 Fabrication process for flex circuit applications |
04/20/2000 | CA2344663A1 Tape ball grid array with interconnected ground plane |
04/19/2000 | EP0994640A2 Method of making a circuit assembly |
04/19/2000 | EP0994639A1 Lattice-shaped circuit board |
04/19/2000 | EP0994508A1 Semiconductor device comprising bump contacts |
04/19/2000 | EP0994215A1 Wholly aromatic polyamide fiber synthetic paper sheet |
04/19/2000 | EP0993677A1 Thermal release for fixing on a circuit substrate |
04/19/2000 | EP0993597A1 Organic solvent vapor detector |
04/19/2000 | EP0858433A4 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board |
04/19/2000 | CN1250939A Sheet like variable resistor having metallic terminals |
04/19/2000 | CN1051670C Method for mfg. laminar stackable circuit board structure |
04/19/2000 | CN1051669C Circuit board having non-annular welding zone |
04/19/2000 | CN1051668C Circuit board with capacitor, and mfg. method therefor |
04/18/2000 | US6052172 Contacting device for display panel |
04/18/2000 | US6052171 Liquid crystal display with electrically connected integrated circuits and opposite voltage line between input and output wirings |
04/18/2000 | US6052170 Inspectable liquid-crystal display panel and method of inspecting same |
04/18/2000 | US6052093 Small omni-directional, slot antenna |
04/18/2000 | US6052045 Electromechanical switching device package with controlled impedance environment |
04/18/2000 | US6052038 Crosstalk reduction in parsitically coupled circuits |
04/18/2000 | US6052012 Method and apparatus for clock uncertainly minimization |
04/18/2000 | US6051878 Method of constructing stacked packages |
04/18/2000 | US6051662 Curable polyphenylene ether-thermosetting resin composition and process |
04/18/2000 | US6051448 Method of manufacturing an electronic component |
04/18/2000 | US6051171 Method for controlling firing shrinkage of ceramic green body |
04/18/2000 | US6051093 Mounting method of semiconductor element |
04/18/2000 | US6050830 Tape carrier package for liquid crystal display |