Patents for H05K 1 - Printed circuits (98,583) |
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07/04/2000 | US6082894 Temperature and passive infrared sensor module |
07/04/2000 | US6081999 Wire-circuit sheet manufacturing method |
06/29/2000 | WO2000038307A1 Modular power supply for generating a high voltage dc output |
06/29/2000 | WO2000038108A1 Device arranged for contactless communication and provided with a data carrier with fully enclosed holding means for holding a chip and a passive component |
06/29/2000 | WO2000027171A3 Electromechanical component |
06/29/2000 | WO2000004595A3 Land-side mounting of components to an integrated circuit package |
06/29/2000 | WO1999062105A3 A package for power converters with improved transformer operations |
06/29/2000 | DE19962031A1 Electrical illumination unit for toy model, has bulb mounted in carrier that can be positioned on power supply ribbon connection. |
06/29/2000 | DE19961537A1 Glass-ceramic board, especially a multilayer wiring board, comprises a co-fired product of a silver-based conductive material and a glass-ceramic insulation material containing an oxidizable metal |
06/29/2000 | DE19957654A1 Connecting arrangement for circuit elements e.g. in vehicle instrument panel or door panel, has terminals with contact sections corresponding to layouts connecting sections respectively and connected to them |
06/29/2000 | DE19859082A1 Verfahren zum Messen der zeitlichen Verzögerung zwischen zwei periodischen Pulssignalen mit der gleichen Frequenz A method for measuring the time delay between two periodic pulse signals with the same frequency |
06/28/2000 | EP1014772A2 High frequency circuit packaging structure |
06/28/2000 | EP1014766A2 Flexible board |
06/28/2000 | EP1014765A2 Flexible printed board, polyamic acid and polyamic acid varnish containing same |
06/28/2000 | EP1014580A2 Method for measuring the delay between two periodic pulse signals of the same frequency |
06/28/2000 | EP1014524A2 Stacked assembly |
06/28/2000 | EP1014508A2 Pluggable printed circuit board with movable plug contact arrangement |
06/28/2000 | EP1014506A2 Zero insertion force connector for a pin grid-array package |
06/28/2000 | EP1014399A2 Flexible thin film capacitor and method for producing the same |
06/28/2000 | EP1014302A1 Noncontact ic card and manufacture thereof |
06/28/2000 | EP1014096A2 Substrate and method for inspection |
06/28/2000 | EP1013684A1 Flame retardant resin material and flame retardant resin composition |
06/28/2000 | EP1013015A2 Reconfigurable node for a communications network |
06/28/2000 | EP1011973A2 Viewing and imaging systems |
06/28/2000 | EP1011810A1 Compact flexible circuit configuration |
06/28/2000 | EP0824426B1 Control system for an automotive vehicle multi-functional apparatus |
06/28/2000 | CN2385497Y Contactless soldering point type switch power supply module |
06/28/2000 | CN1258325A Fibres made from long chain branched syndiotactic vinyl aromatic polymers |
06/28/2000 | CN1258190A Method for mfg. printed circuit board |
06/28/2000 | CN1258188A Glass-ceramic board |
06/28/2000 | CN1258187A Flexographic plate, poly (amide-acid) and poly(amide-acid) varnish contg. said poly (amide-acid) |
06/28/2000 | CN1258113A 电连接器盒 The electrical connector box |
06/28/2000 | CN1258098A Back electrode type electronic component and electronic assembly mounting same to printed circuit board |
06/28/2000 | CN1257866A Epoxy acrylate, preparing process and use thereof |
06/28/2000 | CN1054012C Signal transmitting device suitable for fast signal transmission |
06/28/2000 | CN1054001C Method and apparatus for locating electrical circuit members |
06/27/2000 | US6081430 High-speed backplane |
06/27/2000 | US6081242 Antenna matching circuit |
06/27/2000 | US6081160 Method and apparatus for increasing the bandwidth, and reducing the size, of the DC feed network for wideband RF amplifiers using selective placement of high dielectric constant material |
06/27/2000 | US6081026 High density signal interposer with power and ground wrap |
06/27/2000 | US6081023 Semiconductor device |
06/27/2000 | US6081022 Clock distribution network with efficient shielding |
06/27/2000 | US6080936 Connecting board with oval-shaped protrusions |
06/27/2000 | US6080684 During lamination, the first coating acts like an impenetrable insulating sheet, and preventing glass fiber contact with the conductive planes. the second coating is fluid enough to fill in spaces in the planes |
06/27/2000 | US6080603 Fixtures and methods for lead bonding and deformation |
06/27/2000 | US6080450 Comprising a free radical-polymerizable liquid composition, about 0.02 to 1.0 percent of a fluorescing agent, said fluorescing agent fluorescing at wavelengths above 350 nm and including a phosphine oxide photoinitiator |
06/27/2000 | US6080336 Via filling conductive paste consists of a silver coated copper particles, liquid epoxy resin having two or more epoxy groups, resol phenolic resin and a curing agent for epoxy resin |
06/27/2000 | US6080335 Conductive paste and method for producing ceramic substrate using the same |
06/27/2000 | US6079620 Board adapter |
06/27/2000 | US6079100 Method of making a printed circuit board having filled holes and fill member for use therewith |
06/27/2000 | US6079098 Method and apparatus for processing substrates |
06/22/2000 | WO2000036887A1 Electronic control device |
06/22/2000 | WO2000036886A1 Conductive connecting pin and package board |
06/22/2000 | WO2000036731A1 Electric drive unit for units of a motor vehicle |
06/22/2000 | WO2000036646A1 Mounting adapter for ball grid array packages, mounting structure for ball grid array packages utilizing the same, and method of repairing ball grid array package |
06/22/2000 | WO2000036557A1 Chip card with a shaped lead frame module and mehtod of its manufacturing |
06/22/2000 | WO2000035988A1 Processes for producing phenolic resin and epoxy resin |
06/21/2000 | EP1011298A1 Substrate for formation of special pattern, and method of manufacture of substrate |
06/21/2000 | EP1011139A1 Printed wiring board and method for manufacturing the same |
06/21/2000 | EP1011111A1 Resistive metal layers and method for making same |
06/21/2000 | EP1011039A1 Gap-coupling bus system |
06/21/2000 | EP1010228A4 A transient voltage protection device and method of making same |
06/21/2000 | EP1010228A1 A transient voltage protection device and method of making same |
06/21/2000 | EP1010037A1 Applications for encapsulated electrophoretic displays |
06/21/2000 | EP1010035A1 Novel addressing schemes for electrophoretic displays |
06/21/2000 | EP1009868A2 Electrochemical deposition of a composite polymer-metal oxide |
06/21/2000 | EP0896706B1 Resonant tag and method of manufacturing the same |
06/21/2000 | DE19961999A1 Method to arrange low-impedance resistor on circuit plate, for use in electric vehicle; involves calculating required resistance per square centimeter to determine required area of thin film microresistor |
06/21/2000 | DE19959294A1 Anschlussbaueinheit zum funktionsfähigen Verbinden mehrerer unabhängiger Abbildungsvorrichtungen, optisches System für einen Reflexionsprojektor und Flüssigkristallanzeige Terminal assembly for operatively connecting a plurality of independent imaging devices, optical system for a reflective liquid crystal display projector and |
06/21/2000 | DE19859228C1 Steckbare Leiterplatte mit beweglicher Steckkontaktanordnung Pluggable PCB with movable plug contact arrangement |
06/21/2000 | DE19856839A1 Flexible circuit board structure e.g. for electronic equipment such as photographic equipment and cameras, and electrical connection elements in motor vehicles |
06/21/2000 | DE19855389A1 Elektronische Vorrichtung Electronic device |
06/21/2000 | CN1257529A Alkoxysilane/organic polymer composition for thin insulating film prodution and use thereof |
06/21/2000 | CN1257333A Grid shape circuit board |
06/21/2000 | CN1053785C Circuit elements and manufacture of same |
06/20/2000 | US6078965 Transmission line system for printed circuits |
06/20/2000 | US6078505 Circuit board assembly method |
06/20/2000 | US6078229 Surface acoustic wave device mounted with a resin film and method of making same |
06/20/2000 | US6078102 Semiconductor die package for mounting in horizontal and upright configurations |
06/20/2000 | US6078101 High-power microwave-frequency hybrid integrated circuit |
06/20/2000 | US6078097 Lead frame |
06/20/2000 | US6078013 Clover-leaf solder mask opening |
06/20/2000 | US6078012 Airbag circuit with resistor |
06/20/2000 | US6077766 Variable thickness pads on a substrate surface |
06/20/2000 | US6077309 Method and apparatus for locating coordinated starting points for routing a differential pair of traces |
06/20/2000 | US6077124 Electrical connectors for flat flexible circuitry with yieldable backing structure |
06/20/2000 | US6077106 Thin profile battery mounting contact for printed circuit boards |
06/20/2000 | US6077094 Plug connector means with gripper rib |
06/20/2000 | US6077091 Surface mounted package adapter using elastomeric conductors |
06/20/2000 | CA2158785C Electronic thick film component multiple terminal and method of making the same |
06/15/2000 | WO2000035261A1 Resonant tag with a conductive composition closing an electrical circuit |
06/15/2000 | WO2000035260A1 Method of manufacturing ceramic substrate |
06/15/2000 | WO2000035258A1 Multilayered switching plate |
06/15/2000 | WO2000035016A1 Multi-chip package with stacked chips and interconnect bumps |
06/15/2000 | WO2000035015A1 Rf circuit module |
06/15/2000 | WO2000035009A1 Substrate for ic crystals |
06/15/2000 | WO2000034961A1 Method for forming transparent conductive film by using chemically amplified resist |
06/15/2000 | WO2000034830A1 Photocurable anisotropically conductive composition and anisotropically conductive pattern formed by using the same |
06/15/2000 | WO2000034566A1 Visible and fluorescent dye containing laminate materials |
06/15/2000 | WO2000034204A1 Polymer compound, the production and use thereof, and sintered compacts produced therefrom |