Patents for H05K 1 - Printed circuits (98,583) |
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02/16/2000 | CN1245007A Optimized solder joints for surface mount chips |
02/16/2000 | CN1244950A Product having a rechargeable battery which is held in a mechanically stable manner and is easy to remove |
02/16/2000 | CN1244460A Composite foil of aluminium and copper |
02/16/2000 | CN1049474C Ignition device capable of preventing error action of its micro-processor |
02/15/2000 | US6026325 Implantable medical device having an improved packaging system and method for making electrical connections |
02/15/2000 | US6026221 Prototyping multichip module |
02/15/2000 | US6026004 Modular high voltage power supply with integral flux leakage compensation |
02/15/2000 | US6025996 Unitary contact block and printed circuit board |
02/15/2000 | US6025988 Interconnect adapter and head suspension assembly |
02/15/2000 | US6025768 Electromechanical switching device package with controlled impedance environment |
02/15/2000 | US6025641 Tape automated bonding (tab) tapes having underlying camber suppressing films to inhibit warping |
02/15/2000 | US6025087 Battery mounting and testing apparatuses, methods of forming battery mounting and testing apparatuses, battery-powered test configured electronic devices, and methods of forming battery-powered test configured electronic devices |
02/15/2000 | US6024702 Implantable electrode manufactured with flexible printed circuit |
02/15/2000 | US6024589 Power bus bar for providing a low impedance connection between a first and second printed circuit board |
02/15/2000 | US6024587 High speed circuit interconnection apparatus |
02/15/2000 | US6024581 Electrical socket for a multichip module |
02/15/2000 | US6024580 High performance pad on pad connector for flex circuit packaging |
02/15/2000 | US6023841 Printed circuit board fixing and mounting procedure for power devices |
02/10/2000 | WO2000007421A1 A method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
02/10/2000 | WO2000007420A1 Biometric sensor device comprising a positive engaging load compensation device between a flexible conductor strip and a chip housing |
02/10/2000 | WO2000007417A1 Low-impedance high-density deposited-on-laminate structures having reduced stress |
02/10/2000 | WO2000007235A1 Semiconductor device, method of manufacture thereof, semiconductor module, and electronic device including circuit board and electronic unit board |
02/10/2000 | WO2000007233A1 An improved method of planarizing thin film layers deposited over a common circuit base |
02/10/2000 | WO2000007222A2 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
02/10/2000 | WO2000007219A2 High density printed circuit substrate and method of fabrication |
02/10/2000 | WO2000007197A2 Composition and method for manufacturing integral resistors in printed circuit boards |
02/10/2000 | WO2000006023A1 Biometric sensor device with electronic components integrated into a flexible conductor strip |
02/10/2000 | DE19936326A1 Auxiliary circuit board with screen on both sides, includes spring clip for insertion into hole in main circuit board, simplifying and economizing attachment |
02/10/2000 | DE19936305A1 Component holder for inserting component without connector wires into hole in circuit board where component presses against edge of hole |
02/10/2000 | DE19924934A1 Surface mountable electronic package for high frequency digital applications |
02/10/2000 | DE19909855A1 System board device having a displaceable daughter- board cover System board device having a displaceable daughter- board cover |
02/10/2000 | DE19835127A1 Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink Printed circuit board with a heat sink and method for attaching a heatsink |
02/10/2000 | DE19832012A1 Connection arrangement for flat strip conductors, which are provided with several spaced parallel conductor tracks with contact and counter contact points |
02/10/2000 | DE19830967A1 Electromagnetic coil with ferrite core |
02/10/2000 | CA2337186A1 Composition and method for manufacturing integral resistors in printed circuit boards |
02/09/2000 | EP0978765A2 Positioning mark and alignment method using the same |
02/09/2000 | EP0978385A2 Thermal printhead, and clip-type terminal lead and cover member used therefor |
02/09/2000 | EP0978384A2 Thermal printhead, and clip-type terminal lead and cover member used therefor |
02/09/2000 | EP0680523B1 Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition |
02/08/2000 | US6023414 Display device mounting arrangement and method |
02/08/2000 | US6023412 System board device having a displaceable daughter-board cover |
02/08/2000 | US6023211 Transmission circuit using strip line in three dimensions |
02/08/2000 | US6023210 Interlayer stripline transition |
02/08/2000 | US6023202 Ground return for high speed digital signals that are capacitively coupled across a DC-isolated interface |
02/08/2000 | US6023200 Apparatus for inhibiting cross talk under a difference mode |
02/08/2000 | US6023029 Use of blind vias for soldered interconnections between substrates and printed wiring boards |
02/08/2000 | US6022761 Method for coupling substrates and structure |
02/08/2000 | US6022611 Dielectric sustrate with copper foil overcoating |
02/08/2000 | US6022225 Electrical assembly |
02/08/2000 | US6022091 Recording apparatus having an adjusting member for adjusting a guiding member toward amd away from recording material |
02/08/2000 | US6021564 Method for reducing via inductance in an electronic assembly and article |
02/03/2000 | WO2000005936A1 Hybrid solder ball and pin grid array circuit board interconnect system and method |
02/03/2000 | WO2000005935A1 A method and apparatus for matching trace lengths of signal lines making 90°/180° turns |
02/03/2000 | WO2000005933A1 Printed-circuit board and method of manufacture thereof |
02/03/2000 | WO2000005932A1 Radio-electronic unit |
02/03/2000 | WO2000005748A2 Blind pin placement on circuit boards |
02/03/2000 | DE19836082A1 Wandlereinrichtung für Schutzgeräte und Leistungsschaltereinrichtungen Transducer means for protection devices and circuit breakers facilities |
02/03/2000 | DE19834720A1 Biometrische Sensoreinrichtung mit formschlüssiger Zugentlastungseinrichtung zwischen Flexleiterband und Chipgehäuse Biometric sensor device with positive strain relief between flex conductor strip and chip package |
02/03/2000 | DE19834538A1 Electronic installation device used in buildings has liquid crystal display illuminated from rear via light source fitted into opening in surface of printed circuit board for installation device |
02/03/2000 | DE19834348A1 Electronic control unit and individual components of the unit |
02/03/2000 | DE19833928A1 Biometrische Sensoreinrichtung mit in einem Flexleiterband integrierten elektronischen Bauelementen Biometric sensor device with built-in Flex Head band electronic components |
02/02/2000 | EP0977323A2 Assembly containing a modular jack and a light emitting diode |
02/02/2000 | EP0977298A2 High-frequency module |
02/02/2000 | EP0977208A2 Conductive paste and glass circuit substrate |
02/02/2000 | EP0977127A2 Method for configuring a computer system |
02/02/2000 | EP0977041A2 Transducer arrangement for protection apparatus and power breakers |
02/02/2000 | EP0976848A1 Metal composition containing metal acetilide, blank having metallic coating formed therewith, and method for forming the metallic coating |
02/02/2000 | EP0976311A1 A shielding housing and a method of producing a shielding housing |
02/02/2000 | EP0976155A1 High-voltage, high-current multilayer circuit board, method for the production thereof |
02/02/2000 | EP0976104A2 Smart card, connection arrangement and method of producing a smart card |
02/02/2000 | EP0975891A2 Vibration control system, especially for circuit boards |
02/02/2000 | EP0975835A1 Dispersions of aramid fibres, and aramid sheets |
02/02/2000 | CN1243654A Electroluminescent body and structure for shielding same |
02/02/2000 | CN1243461A Method for making a sonoprobe |
02/02/2000 | CN1243416A Method for producing multilayer cicuit board and multilayer circuitboard produced by said method |
02/02/2000 | CN1243276A Printed circuit board involved in integrated cable connector power-supply system |
02/01/2000 | US6021050 Printed circuit boards with integrated passive components and method for making same |
02/01/2000 | US6021048 High speed memory module |
02/01/2000 | US6021046 Thermal protection of electrical elements systems |
02/01/2000 | US6021043 Miniature heat-dissipating fan with improved hall element and circuit board arrangement |
02/01/2000 | US6020862 Method for making non-planar radio frequency device and device produced thereby |
02/01/2000 | US6020809 Mounting structure for thermistor with positive resistance-to-temperature characteristic |
02/01/2000 | US6020748 Method and apparatus for conducting failure analysis on IC chip package |
02/01/2000 | US6020745 Method of batch testing surface mount devices using a substrate edge connector |
02/01/2000 | US6020660 Dynamoelectric machine |
02/01/2000 | US6020638 Packaging structure of BGA type semiconductor device mounted on circuit substrate |
02/01/2000 | US6020637 Ball grid array semiconductor package |
02/01/2000 | US6020634 Replaceable power module |
02/01/2000 | US6020562 Reduced-capacitance component mounting pads and capacitance-reduction methods for high frequency multi-layer printed circuit boards |
02/01/2000 | US6020561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof |
02/01/2000 | US6020049 This photoimageable dielectric material is a substitute for conventional dielectrics like epoxy, polyimides, etc. |
02/01/2000 | US6020048 Thick film circuit board and method of forming wire bonding electrode thereon |
02/01/2000 | US6019609 Elastomeric shielded connector |
02/01/2000 | US6019037 Method for screen printing patterns on a target object |
01/31/2000 | CA2278913A1 Assembly containing a modular jack and a light emitting diode |
01/27/2000 | WO2000004753A2 Alignment of vias in circuit boards or similar structures |
01/27/2000 | WO2000004750A1 Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures |
01/27/2000 | WO2000004595A2 Land-side mounting of components to an integrated circuit package |
01/27/2000 | WO2000004578A1 Method for transferring solder to a device and/or testing the device |
01/27/2000 | WO2000004446A1 Prototype development system |