Patents for H05K 1 - Printed circuits (98,583)
06/2000
06/15/2000DE19958197A1 Polymercompound, dessen Herstellung und Verwendung, sowie daraus hergestellter Sinterkörper Polymer compound, its preparation and use, and derived sintered body
06/15/2000DE19956970A1 Arrangement for wiring circuits on a panel e.g. of vehicle body, has circuit board separate from panel, conductors laid in desired wiring pattern to form circuits, and chamber in panel for circuit board
06/15/2000DE19955584A1 High frequency noise suppression structure for power cable of circuit board, has ground electrode formed to cover principle portions of conductive coil arranged between ferrite magnetic resin and electrodes
06/15/2000DE19857697A1 Fire-resistant epoxy resin mixture for prepregs and composites, e.g. printed circuit boards, contains epoxy resin and bis:amino-aryl alkane-phosphonate ester or bis:amino-aryl-mono:alkyl-phosphine oxide
06/15/2000DE19857478A1 Transient overvoltage protection device for plug-in electronic circuit board module uses active and/or passive overvoltage protection elements on each circuit board and passive protection elements on common carrier plate
06/14/2000EP1009201A2 Flexible printed substrate having a conductive pattern formed thereon
06/14/2000EP1009200A1 Circuit member and circuit board
06/14/2000EP1009195A1 Radiation structure for heating element
06/14/2000EP1009073A1 Hinge connector extensible to a longitudinal direction
06/14/2000EP1009028A2 Matrix type display apparatus, method of production thereof, and thermocompression bonding head
06/14/2000EP1008909A1 Composition for a photosensitive silver conductor tape and tape comprising the same
06/14/2000EP1008414A2 Solder ball connections and assembly process
06/14/2000EP1008231A2 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same
06/14/2000EP1008207A1 Cable assembly
06/14/2000EP1008156A1 Monolithic inductor and method of manufacturing same
06/14/2000EP1008143A4 Multilayer thick film surge resistor network
06/14/2000EP1008143A1 Multilayer thick film surge resistor network
06/14/2000EP1007596A1 Printable adhesive composition and methods of preparation
06/14/2000EP1007308A4 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
06/14/2000EP1007308A1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
06/14/2000CN1256613A Method for manufacturing flexible circuit board
06/14/2000CN1256612A Two signals single power flush printed circuit board
06/14/2000CN1256611A Built-in fingered flat capacitor and resistor and their manufacture
06/14/2000CN1256609A Flexible printed substrate
06/14/2000CN1256532A Socket for pin grid array component and actuating mechanism thereof
06/14/2000CN1256531A Socket for pin grid array component
06/14/2000CN1256514A Insulated substrate, its making method and modular semiconductor device having the same thereof
06/14/2000CN1256502A Circuit support of stacked ceramic capacitor and its mounting method
06/14/2000CN1256476A Matrix display unit and its making method, and hot-pressed key assembly
06/14/2000CN1053551C Multilayer circuit board
06/13/2000US6075711 System and method for routing connections of integrated circuits
06/13/2000US6075708 Partly bent electric circuit substrate and method for manufacturing the same
06/13/2000US6075707 Radio frequency identification tag
06/13/2000US6075704 Input/output bus system in a tower building block system
06/13/2000US6075700 Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
06/13/2000US6075432 Method for generating enhanced etched inductor elements
06/13/2000US6075427 MCM with high Q overlapping resonator
06/13/2000US6075423 Controlling signal trace characteristic impedance via a conductive epoxy layer
06/13/2000US6075288 Semiconductor package having interlocking heat sinks and method of fabrication
06/13/2000US6075285 Semiconductor package substrate with power die
06/13/2000US6075211 Multi-layered printed wiring board
06/13/2000US6074893 Multilayer elements for photoresists layers with grooves and filling, drying and developing
06/13/2000US6074740 Filler may comprise oxidized polyarylene sulfide polyarylene sulfide, polyimide, aromatic polyester, or polyether ketone.
06/13/2000US6074228 Guide rail and CAM system with integrated connector for removable transceiver
06/13/2000US6074041 Ink jet recording head having an electric discharge path for releasing static electricity and recording apparatus using same
06/13/2000US6073856 Noncontact IC device
06/13/2000US6073339 Method of making low profile pin-less planar magnetic devices
06/08/2000WO2000033626A1 Printed circuit boards with integrated passive components and method for making same
06/08/2000WO2000033625A1 Process for depositing conducting layer on substrate
06/08/2000WO2000033624A1 Printed circuit board and method for fabricating such board
06/08/2000WO2000033623A1 A printed circuit board for an amplifier, an amplifier and a method for distributing a signal and power in an amplifier
06/08/2000WO2000033452A1 A power supply device with externally disconnectable 'y' capacitors
06/08/2000WO2000033427A1 Controlling the heat expansion of electrical couplings
06/08/2000WO2000033096A1 Probe card for probing wafers with raised contact elements
06/08/2000WO2000032691A1 Polyimide/polyarylate resin compositions and moldings thereof
06/08/2000DE19948949A1 Plug connector for flexible printed circuit board has flexible printed circuit board sandwiched between plug component with spring contacts and plug socket
06/08/2000DE19856397A1 Fire-resistant epoxy resin mixture for prepregs and composites, e.g. printed circuit boards, contains epoxy resin and an amino-aryl-phosphonate ester of an aliphatic glycol or tetra-hydroxy compound
06/08/2000DE19855076A1 DC/DC voltage converter e.g. for switching network, solar energy plant or electric vehicle drive, has metallic carrier supporting respective circuit boards for primary and secondary circuits and coupling transformer
06/08/2000CA2353647A1 Polyimide/polyarylate resin compositions and moldings thereof
06/08/2000CA2352820A1 Printed circuit board and method for fabricating such board
06/08/2000CA2350506A1 Process for depositing conducting layer on substrate
06/07/2000EP1006766A2 Electronic device
06/07/2000EP1006763A2 Copper foil for printed wiring board having excellent chemical resistance and heat resistance
06/07/2000EP1006762A2 Arrangement for processing a circuit board
06/07/2000EP1006618A2 Zero-insertion-force socket for pin grid array packages
06/07/2000EP1006593A1 Photovoltaic solar module in a plate form
06/07/2000EP1006577A2 Multilayer wiring board
06/07/2000EP1006237A1 Base material for manufacturing a laminate and process for producing the same
06/07/2000EP1006130A1 Fumaric acid diester resin composition, cross-linked fumaric acid diester resin and process
06/07/2000EP1005983A1 Squeegee for screen printing and screen printing method
06/07/2000EP1005963A2 Punching device comprising removable stamps
06/07/2000EP1005703A1 Method for producing electrically conductive cross connections between two layers of wiring on a substrate
06/07/2000EP1005671A2 Flexible wearable computer system
06/07/2000EP1005642A1 Method and device for determining a parameter for a metallization bath
06/07/2000CN1256067A Circuit board
06/07/2000CN1255824A Distribution for heating combined printed circuit board
06/07/2000CN1255738A Method for shaping medium film patterns and layered patterns
06/07/2000CN1053315C Fabrication process for circuit substrate having interconnection leads
06/07/2000CN1053298C Connector for electrical components
06/07/2000CN1053170C Process for surface treatment of glass fabric
06/06/2000US6073229 Computer system having a modular architecture
06/06/2000US6072700 Ball grid array package
06/06/2000US6072699 Method and apparatus for matching trace lengths of signal lines making 90°/180° turns
06/06/2000US6072690 High k dielectric capacitor with low k sheathed signal vias
06/06/2000US6072687 Multilayer capacitor
06/06/2000US6072375 Waveguide with edge grounding
06/06/2000US6072239 Device having resin package with projections
06/06/2000US6072231 Semiconductor device
06/06/2000US6072126 Printed wiring board with grounding lines arranged between wiring lines
06/06/2000US6072018 High abrasion resistant coating material
06/06/2000US6071836 Electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene
06/06/2000US6071667 Photosensitive resin composition containing a photosensitive polyamide resin
06/06/2000US6071597 Flexible circuits and carriers and process for manufacture
06/06/2000US6071592 Metal-ceramic composite substrate
06/06/2000US6071559 Dustfree prepreg and method for making an article based thereon
06/06/2000US6070986 Method of manufacturing a lighting unit for inspecting a surface
06/06/2000US6070549 Pointer type indicating device
06/06/2000CA2193012C Surface acoustic wave apparatus
06/02/2000WO2000032021A1 Printed circuit assembly having locally enhanced wiring density
06/02/2000WO2000032020A1 Edge connectors for printed circuit boards comprising conductive ink