Patents for H05K 1 - Printed circuits (98,583)
11/1999
11/11/1999DE19820234A1 Arrangement for transferring signals between a component of a portable data medium and a lead permanently associated with the component can be produced with a further simplified process
11/11/1999CA2295576A1 Substrate material for printed circuit, process for production thereof, and intermediate block for said substrate material
11/10/1999EP0955796A2 System for fastening an article to a board
11/10/1999EP0955795A2 Conductive paste for filing via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
11/10/1999EP0955702A1 Printed circuit board connecting device
11/10/1999EP0955691A2 Contacting device
11/10/1999EP0955642A2 Formation of thin films resistors
11/10/1999EP0955279A1 Aluminum-nitride sintered body, method for fabricating the same, and semiconductor substrate comprising the same
11/10/1999EP0842045A4 Debossable films
11/10/1999EP0815709A4 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages
11/10/1999EP0722652A4 Device with external electrical interface
11/10/1999CN1234721A Electronic component
11/10/1999CN1234673A Superthin telephone set
11/10/1999CN1234588A Formation of thin-film resistance
11/10/1999CN1234567A Element mounting method, IC card and producing method therefor
11/10/1999CN1234526A Motor connecting structure for camera
11/09/1999US5982927 Methods and apparatuses for in-line solder paste inspection
11/09/1999US5982654 System for connecting semiconductor devices
11/09/1999US5982635 Signal adaptor board for a pin grid array
11/09/1999US5982633 Opposed ball grid array mounting
11/09/1999US5982632 Short power signal path integrated circuit package
11/09/1999US5982630 Printed circuit board that provides improved thermal dissipation
11/09/1999US5982628 Circuit configuration having a smart card module and a coil connected thereto
11/09/1999US5982626 Two dimensional coupling for flexible printed circuit boards
11/09/1999US5982623 Module for packaged IC
11/09/1999US5982468 Liquid crystal display apparatus having dummy lead and dummy land for alignment
11/09/1999US5982256 Wiring board equipped with a line for transmitting a high frequency signal
11/09/1999US5982249 Reduced crosstalk microstrip transmission-line
11/09/1999US5982195 Programmable logic device architectures
11/09/1999US5982186 Contactor for test applications including membrane carrier having contacts for an integrated circuit and pins connecting contacts to test board
11/09/1999US5981880 Electronic device packages having glass free non conductive layers
11/09/1999US5981870 Flexible circuit board interconnect with strain relief
11/09/1999US5981869 Reduction of switching noise in high-speed circuit boards
11/09/1999US5981657 Polystyrenes and polyphenylene oxides; heat resistance; basic metal compound to neutralize acid groups
11/09/1999US5981315 Transfer molding
11/09/1999US5981102 Thin profile battery apparatus, battery powerable apparatus, radio frequency communication device, and method of forming battery powerable apparatus
11/09/1999US5981085 Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
11/09/1999US5981069 Copper powder coated with copper phosphate and copper paste containing the same
11/09/1999US5981043 Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
11/09/1999US5981036 For electrical or electronic power circuits or modules and which allows improved heat dissipation independent of temperature with simple for problem-free mounting in housing
11/09/1999US5980991 Process for heat-treating substrate having film-forming composition thereon
11/09/1999US5980723 Electrochemical deposition of a composite polymer metal oxide
11/09/1999US5980721 Fabrication method for double metallic resist printed circuit boards
11/09/1999US5980270 Soldering with resilient contacts
11/09/1999US5980267 Connector scheme for a power pod power delivery system
11/09/1999US5979771 Apparatus to verify position of electrical contacts within a sliding SIM mechanism
11/09/1999US5979044 Fabrication method of multilayer printed wiring board
11/09/1999US5979043 Method of manufacturing a circuit assembly from two or more layers of flexible film
11/09/1999CA2157994C Electronic device assembly
11/04/1999WO1999056517A1 Adapted electrically conductive layer
11/04/1999WO1999056510A1 Method of producing ceramic multilayer substrate
11/04/1999WO1999056509A1 Flip chip devices with flexible conductive adhesive
11/04/1999WO1999056508A1 Rigid interconnect device and method of making
11/04/1999WO1999041957A8 Method of making microwave, multifunction modules using fluoropolymer composite substrates
11/04/1999DE19918396A1 Connector assembly for flexible and hard printed circuits arranged in a connector receiving portion
11/04/1999DE19819088A1 Flexible circuit board
11/04/1999DE19819057A1 Device to bend flexible electrical flat conductors in bending radius specified by device
11/03/1999EP0954209A1 Laminated circuit board and method for producing the same
11/03/1999EP0954067A2 Grounding terminal and mounting structure of the same on a printed circuit board
11/03/1999EP0954049A2 Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system
11/03/1999EP0954026A2 Conductive paste and method for producing ceramic substrate using the same
11/03/1999EP0954020A2 Flip chip bonding lands
11/03/1999EP0953997A1 Electronic part and method for producing the same
11/03/1999EP0953608A1 Heat-resistant, lowly dielectric high-molecular material, and films, substrates, electric components and heat-resistant resin moldings produced therefrom
11/03/1999EP0953446A2 Energy control method for an inkjet print cartridge
11/03/1999EP0953277A2 Optimized solder joints for surface mount chips
11/03/1999EP0953219A1 Electric connection configuration
11/03/1999EP0952970A1 High yield-low carbon ceramic via polysilazane
11/03/1999EP0952917A1 Laminate for printed circuit boards
11/03/1999EP0765534B1 High impact digital crash data recorder
11/03/1999EP0714553B1 Method of forming electrically conductive polymer interconnects on electrical substrates
11/03/1999CN1233931A Method for improving adhesion of metal films to polyphenylene ether resins
11/03/1999CN1233849A Flip chip bonding land waving prevention pattern
11/03/1999CN1233773A Camera having flexible printed circuit board
11/02/1999US5978231 Printed wiring board with integrated coil inductor
11/02/1999US5978230 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections
11/02/1999US5978227 Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends
11/02/1999US5978224 Quad flat pack integrated circuit package
11/02/1999US5978093 Method for calibrating surface mounting processes in printed circuit board assembly manufacturing
11/02/1999US5978060 Liquid crystal display apparatus and apparatus for manufacturing the same
11/02/1999US5977863 Low cross talk ball grid array resistor network
11/02/1999US5977850 Multilayer ceramic package with center ground via for size reduction
11/02/1999US5977490 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
11/02/1999US5977489 Conductive elastomer for grafting to a metal substrate
11/02/1999US5977488 Printed circuit board having coordinate values of electronic components to be mounted thereon and a method of numbering the electronic components thereon
11/02/1999US5977232 Formaldehyde-free, accelerated cure, aqueous composition for bonding glass fiber heat-resistant nonwovens
11/02/1999US5977005 Mixture of perovskite crystal titanate, alumina and metal oxide
11/02/1999US5976974 Method of forming redundant signal traces and corresponding electronic components
11/02/1999US5976915 Low mutual inductance lead frame device
11/02/1999US5976762 Photosensitive element and process for producing multilayer printed wiring board
11/02/1999US5976703 Material and method for planarization of substrate
11/02/1999US5976628 Copper powder in binder
11/02/1999US5976437 Polyphenyl resins with pendant solubilizing groups; melt, wet, and dry-jet wet spinning; orienting by drawing or stretching; coating solid articles
11/02/1999US5976393 Method of manufacturing multilayer circuit substrate
11/02/1999US5976391 Manufacturing a multi-layer circuit assembly in a continuous process.
11/02/1999US5975963 Female terminal
11/02/1999US5975944 Connector for pitch spaced electrical cables
11/02/1999US5975913 Multilayer interconnection board and connection pin
11/02/1999US5975715 Taillight fixture for motor vehicles with printed circuit boards with connectors and LED's
11/02/1999US5975201 Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures