Patents for H05K 1 - Printed circuits (98,583) |
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11/11/1999 | DE19820234A1 Arrangement for transferring signals between a component of a portable data medium and a lead permanently associated with the component can be produced with a further simplified process |
11/11/1999 | CA2295576A1 Substrate material for printed circuit, process for production thereof, and intermediate block for said substrate material |
11/10/1999 | EP0955796A2 System for fastening an article to a board |
11/10/1999 | EP0955795A2 Conductive paste for filing via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
11/10/1999 | EP0955702A1 Printed circuit board connecting device |
11/10/1999 | EP0955691A2 Contacting device |
11/10/1999 | EP0955642A2 Formation of thin films resistors |
11/10/1999 | EP0955279A1 Aluminum-nitride sintered body, method for fabricating the same, and semiconductor substrate comprising the same |
11/10/1999 | EP0842045A4 Debossable films |
11/10/1999 | EP0815709A4 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages |
11/10/1999 | EP0722652A4 Device with external electrical interface |
11/10/1999 | CN1234721A Electronic component |
11/10/1999 | CN1234673A Superthin telephone set |
11/10/1999 | CN1234588A Formation of thin-film resistance |
11/10/1999 | CN1234567A Element mounting method, IC card and producing method therefor |
11/10/1999 | CN1234526A Motor connecting structure for camera |
11/09/1999 | US5982927 Methods and apparatuses for in-line solder paste inspection |
11/09/1999 | US5982654 System for connecting semiconductor devices |
11/09/1999 | US5982635 Signal adaptor board for a pin grid array |
11/09/1999 | US5982633 Opposed ball grid array mounting |
11/09/1999 | US5982632 Short power signal path integrated circuit package |
11/09/1999 | US5982630 Printed circuit board that provides improved thermal dissipation |
11/09/1999 | US5982628 Circuit configuration having a smart card module and a coil connected thereto |
11/09/1999 | US5982626 Two dimensional coupling for flexible printed circuit boards |
11/09/1999 | US5982623 Module for packaged IC |
11/09/1999 | US5982468 Liquid crystal display apparatus having dummy lead and dummy land for alignment |
11/09/1999 | US5982256 Wiring board equipped with a line for transmitting a high frequency signal |
11/09/1999 | US5982249 Reduced crosstalk microstrip transmission-line |
11/09/1999 | US5982195 Programmable logic device architectures |
11/09/1999 | US5982186 Contactor for test applications including membrane carrier having contacts for an integrated circuit and pins connecting contacts to test board |
11/09/1999 | US5981880 Electronic device packages having glass free non conductive layers |
11/09/1999 | US5981870 Flexible circuit board interconnect with strain relief |
11/09/1999 | US5981869 Reduction of switching noise in high-speed circuit boards |
11/09/1999 | US5981657 Polystyrenes and polyphenylene oxides; heat resistance; basic metal compound to neutralize acid groups |
11/09/1999 | US5981315 Transfer molding |
11/09/1999 | US5981102 Thin profile battery apparatus, battery powerable apparatus, radio frequency communication device, and method of forming battery powerable apparatus |
11/09/1999 | US5981085 Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same |
11/09/1999 | US5981069 Copper powder coated with copper phosphate and copper paste containing the same |
11/09/1999 | US5981043 Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield |
11/09/1999 | US5981036 For electrical or electronic power circuits or modules and which allows improved heat dissipation independent of temperature with simple for problem-free mounting in housing |
11/09/1999 | US5980991 Process for heat-treating substrate having film-forming composition thereon |
11/09/1999 | US5980723 Electrochemical deposition of a composite polymer metal oxide |
11/09/1999 | US5980721 Fabrication method for double metallic resist printed circuit boards |
11/09/1999 | US5980270 Soldering with resilient contacts |
11/09/1999 | US5980267 Connector scheme for a power pod power delivery system |
11/09/1999 | US5979771 Apparatus to verify position of electrical contacts within a sliding SIM mechanism |
11/09/1999 | US5979044 Fabrication method of multilayer printed wiring board |
11/09/1999 | US5979043 Method of manufacturing a circuit assembly from two or more layers of flexible film |
11/09/1999 | CA2157994C Electronic device assembly |
11/04/1999 | WO1999056517A1 Adapted electrically conductive layer |
11/04/1999 | WO1999056510A1 Method of producing ceramic multilayer substrate |
11/04/1999 | WO1999056509A1 Flip chip devices with flexible conductive adhesive |
11/04/1999 | WO1999056508A1 Rigid interconnect device and method of making |
11/04/1999 | WO1999041957A8 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
11/04/1999 | DE19918396A1 Connector assembly for flexible and hard printed circuits arranged in a connector receiving portion |
11/04/1999 | DE19819088A1 Flexible circuit board |
11/04/1999 | DE19819057A1 Device to bend flexible electrical flat conductors in bending radius specified by device |
11/03/1999 | EP0954209A1 Laminated circuit board and method for producing the same |
11/03/1999 | EP0954067A2 Grounding terminal and mounting structure of the same on a printed circuit board |
11/03/1999 | EP0954049A2 Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system |
11/03/1999 | EP0954026A2 Conductive paste and method for producing ceramic substrate using the same |
11/03/1999 | EP0954020A2 Flip chip bonding lands |
11/03/1999 | EP0953997A1 Electronic part and method for producing the same |
11/03/1999 | EP0953608A1 Heat-resistant, lowly dielectric high-molecular material, and films, substrates, electric components and heat-resistant resin moldings produced therefrom |
11/03/1999 | EP0953446A2 Energy control method for an inkjet print cartridge |
11/03/1999 | EP0953277A2 Optimized solder joints for surface mount chips |
11/03/1999 | EP0953219A1 Electric connection configuration |
11/03/1999 | EP0952970A1 High yield-low carbon ceramic via polysilazane |
11/03/1999 | EP0952917A1 Laminate for printed circuit boards |
11/03/1999 | EP0765534B1 High impact digital crash data recorder |
11/03/1999 | EP0714553B1 Method of forming electrically conductive polymer interconnects on electrical substrates |
11/03/1999 | CN1233931A Method for improving adhesion of metal films to polyphenylene ether resins |
11/03/1999 | CN1233849A Flip chip bonding land waving prevention pattern |
11/03/1999 | CN1233773A Camera having flexible printed circuit board |
11/02/1999 | US5978231 Printed wiring board with integrated coil inductor |
11/02/1999 | US5978230 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections |
11/02/1999 | US5978227 Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends |
11/02/1999 | US5978224 Quad flat pack integrated circuit package |
11/02/1999 | US5978093 Method for calibrating surface mounting processes in printed circuit board assembly manufacturing |
11/02/1999 | US5978060 Liquid crystal display apparatus and apparatus for manufacturing the same |
11/02/1999 | US5977863 Low cross talk ball grid array resistor network |
11/02/1999 | US5977850 Multilayer ceramic package with center ground via for size reduction |
11/02/1999 | US5977490 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same |
11/02/1999 | US5977489 Conductive elastomer for grafting to a metal substrate |
11/02/1999 | US5977488 Printed circuit board having coordinate values of electronic components to be mounted thereon and a method of numbering the electronic components thereon |
11/02/1999 | US5977232 Formaldehyde-free, accelerated cure, aqueous composition for bonding glass fiber heat-resistant nonwovens |
11/02/1999 | US5977005 Mixture of perovskite crystal titanate, alumina and metal oxide |
11/02/1999 | US5976974 Method of forming redundant signal traces and corresponding electronic components |
11/02/1999 | US5976915 Low mutual inductance lead frame device |
11/02/1999 | US5976762 Photosensitive element and process for producing multilayer printed wiring board |
11/02/1999 | US5976703 Material and method for planarization of substrate |
11/02/1999 | US5976628 Copper powder in binder |
11/02/1999 | US5976437 Polyphenyl resins with pendant solubilizing groups; melt, wet, and dry-jet wet spinning; orienting by drawing or stretching; coating solid articles |
11/02/1999 | US5976393 Method of manufacturing multilayer circuit substrate |
11/02/1999 | US5976391 Manufacturing a multi-layer circuit assembly in a continuous process. |
11/02/1999 | US5975963 Female terminal |
11/02/1999 | US5975944 Connector for pitch spaced electrical cables |
11/02/1999 | US5975913 Multilayer interconnection board and connection pin |
11/02/1999 | US5975715 Taillight fixture for motor vehicles with printed circuit boards with connectors and LED's |
11/02/1999 | US5975201 Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures |