| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/19/2000 | EP1019961A1 Method for producing a multilevel cable carrier (substrate), especially for multichip modules |
| 07/19/2000 | EP1019960A1 Ball grid array semiconductor package and method for making the same |
| 07/19/2000 | EP1019654A2 Flexible lighting element circuit and method of manufacturing the same |
| 07/19/2000 | EP1019246A1 Microsphere-containing circuit board paper |
| 07/19/2000 | EP0925713B1 Flexible conductive tape connection |
| 07/19/2000 | EP0896787B1 A multi-layer moulded electronic device and method for manufacturing same |
| 07/19/2000 | CN1260885A Substrate having unidirectional conductivity perpendicular to its surface, devices comprising such substrate and methods for manufacturing such substrate |
| 07/19/2000 | CN1260684A Copper foil with good chemicals-resisting and heat-resisting characteristicas for printed circuit board |
| 07/19/2000 | CN1260636A Clutter rejection apparatus |
| 07/19/2000 | CN1260619A Overlapped assembly |
| 07/18/2000 | US6092139 Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board |
| 07/18/2000 | US6091611 Connectors adapted for controlling a small form factor power supply |
| 07/18/2000 | US6091609 Electronic circuit card having transient-tolerant distribution planes |
| 07/18/2000 | US6091608 Method and apparatus for simplified and compact component addition to a printed circuit board |
| 07/18/2000 | US6091607 Resonant tag with a conductive composition closing an electrical circuit |
| 07/18/2000 | US6091598 Laminated ceramic electronic part including a plurality of internal electrodes having two leading portions and a non-exposed portion between the two leading portions |
| 07/18/2000 | US6091310 Multi-layer printed board with an inductor providing a high impedance at high frequency |
| 07/18/2000 | US6091155 BGA land pattern |
| 07/18/2000 | US6091147 Connector type semiconductor package |
| 07/18/2000 | US6091026 Multi-layer printed circuit board with human detectable layer misregistration, and manufacturing method therefor |
| 07/18/2000 | US6090870 Epoxy resin composition |
| 07/18/2000 | US6090486 Fiber materials for manufacturing fiber reinforced phenolic composites and adhesives with nucleophilic initiators positioned on the fiber surfaces |
| 07/18/2000 | US6090474 Flowable compositions and use in filling vias and plated through-holes |
| 07/18/2000 | US6090468 Insulation adhesive layer which is a semi-cured product of an epoxy group-containing acrylic rubber |
| 07/18/2000 | US6090436 Mixture containing binder and solvent |
| 07/18/2000 | US6090261 Method and apparatus for controlling plating over a face of a substrate |
| 07/18/2000 | US6090237 Apparatus for restraining adhesive overflow in a multilayer substrate assembly during lamination |
| 07/18/2000 | US6090052 Guide wire having a male connector |
| 07/18/2000 | US6089923 Jack including crosstalk compensation for printed circuit board |
| 07/18/2000 | US6089917 Method and system for circuit board common mode noise suppression utilizing ferrous cores |
| 07/18/2000 | US6089895 Card connector |
| 07/18/2000 | CA2196265C Assembly circuit board with plug connector |
| 07/13/2000 | WO2000041447A1 Method for producing a multilayer printed circuit board |
| 07/13/2000 | WO2000041446A1 Circuit board features with reduced parasitic capacitance and method therefor |
| 07/13/2000 | WO2000041253A1 Arrangement of electrochemical cells and circuit board |
| 07/13/2000 | WO2000041192A1 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor |
| 07/13/2000 | WO2000040637A1 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers |
| 07/13/2000 | WO2000040520A1 Electrically conductive ceramics |
| 07/13/2000 | WO1999065282A9 Ic stack utilizing flexible circuits with bga contacts |
| 07/13/2000 | DE19962702A1 Test card, for testing conductivity between a chip-sized package component and a solder ball on a BGA component, has a contact element block with a sloping face for uniform pressure application to a solder ball surface |
| 07/12/2000 | EP1018764A1 Member for lead |
| 07/12/2000 | EP1018291A1 Flexible circuits and carriers and process for manufacture |
| 07/12/2000 | EP1018290A1 A system and method for packaging integrated circuits |
| 07/12/2000 | EP1018157A1 Improved solder ball joint |
| 07/12/2000 | EP1018146A1 Improved transformer operations |
| 07/12/2000 | EP1017886A1 Method of electrophoretic deposition of laminated green bodies |
| 07/12/2000 | CN1259843A Circuit plate and circuit element, and method for mfg. same |
| 07/12/2000 | CN1259768A Interconnector made of conductive elastomer |
| 07/11/2000 | US6088607 Low noise optical probe |
| 07/11/2000 | US6088465 Door-dependent system for enabling and adjusting options on hearing aids |
| 07/11/2000 | US6088241 Foil-type connector for motor-vehicle subassemblies |
| 07/11/2000 | US6088235 EMI noise cancellation in disk drive having MR read head and single-ended preamplifier |
| 07/11/2000 | US6088234 Connection structure of circuit protection element |
| 07/11/2000 | US6088227 Heat sink with integrated buss bar |
| 07/11/2000 | US6087920 Monolithic inductor |
| 07/11/2000 | US6087912 High frequency multi-layer module comprising a dielectric resonator |
| 07/11/2000 | US6087716 Semiconductor device package having a connection substrate with turned back leads and method thereof |
| 07/11/2000 | US6087467 Rigid-rod polymers |
| 07/11/2000 | US6086990 High thermal conductivity silicon nitride circuit substrate and semiconductor device using the same |
| 07/11/2000 | US6086863 Compositions of microspheres for wound healing |
| 07/11/2000 | US6086793 Method of producing electrically conductive pastes and materials using same |
| 07/11/2000 | US6086441 Method for connecting electrodes of plasma display panel |
| 07/11/2000 | US6086383 Coaxial interconnect devices and methods of making the same |
| 07/11/2000 | US6086043 Valve control apparatus with three-dimensional circuit board using MID technology |
| 07/11/2000 | US6085407 Component alignment apparatuses and methods |
| 07/08/2000 | CA2292680A1 Time switch |
| 07/06/2000 | WO2000040065A1 A device having a flexible circuit disposed within a conductive tube and method of making same |
| 07/06/2000 | WO2000039854A1 Coaxial type signal line and manufacturing method thereof |
| 07/06/2000 | WO2000039216A1 Cyanate-epoxy resin composition, and prepreg, metal foil-laminated plate and printed wiring board using the same |
| 07/06/2000 | DE19957609A1 Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them |
| 07/06/2000 | DE19902428C1 Connecting cable to circuit board involves forming connecting lead perpendicularly with respect to main direction of cable by bending end region by inserting cable transversely into cable opening |
| 07/06/2000 | DE19859739A1 Heat sink for electronic control device has power component thermally coupled to heat sink block on underside of component carrier via heat conduction plate in component reception opening in component carrier |
| 07/06/2000 | DE19857959A1 Elektronisches Steuergerät Electronic control unit |
| 07/06/2000 | DE10002097A1 Method for installing interposition device, for testing dense connection area array; involves applying solder preform to ends of terminal pins protruding through interposition circuit board and soldering in soldering furnace |
| 07/05/2000 | EP1017258A2 Method for manufacturing double-sided flexible printed board |
| 07/05/2000 | EP1017133A2 Electrical connector housing |
| 07/05/2000 | EP1017068A2 Process for forming device comprising metallized magnetic substrates |
| 07/05/2000 | EP1017043A2 Process for producing magnetic head suspension |
| 07/05/2000 | EP1016739A2 Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same |
| 07/05/2000 | EP1016467A2 Vibration motor holding apparatus and portable electronic equipment having the same |
| 07/05/2000 | EP1016106A1 Ceramic multilayer printed circuit boards with embedded passive components |
| 07/05/2000 | EP0857348A4 An electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 07/05/2000 | CN1259230A Orthogonally mounted substrate based resonator |
| 07/05/2000 | CN1259085A Bonding system in an ink jet printer pen and method for providing the same |
| 07/05/2000 | CN1259008A Tellite and display apparatus and electronic equipment usng the same |
| 07/05/2000 | CN1259007A Tellite and its producing method,and display apparatus and electronic equipment using the same circuit board |
| 07/05/2000 | CN1258954A Vibratory motor maintainer and portable electronic equipment with the same apparatus |
| 07/04/2000 | US6085018 Integrated circuit, electronic equipment and method of assembly which uses said integrated circuit |
| 07/04/2000 | US6084782 Electronic device having self-aligning solder pad design |
| 07/04/2000 | US6084780 Printed circuit board with high electronic component density |
| 07/04/2000 | US6084779 Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips |
| 07/04/2000 | US6084778 Three dimensional assembly using flexible wiring board |
| 07/04/2000 | US6084776 Control device, consisting of at least two housing parts |
| 07/04/2000 | US6084759 Arrangement for protection against electrostatic discharge in electronic apparatuses |
| 07/04/2000 | US6084296 Low cost high power hermetic package with electrical feed-through bushings |
| 07/04/2000 | US6084182 Backplane stiffener |
| 07/04/2000 | US6084053 As structural component, a dielectric polyimide material having at least one fluorene-containing structural unit; applying polyimide solution to substrate, and drying to form the dielectric; heat resistance, low dielectric constant |
| 07/04/2000 | US6083768 Inverted orientation until the viscous material dries or cures enough to maintain definition |
| 07/04/2000 | US6083426 Conductive powder, binder and solvent; electrical resistant films |
| 07/04/2000 | US6083039 Connector contact mold-positioning |