Patents for H05K 1 - Printed circuits (98,583) |
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04/18/2000 | US6049977 Method of forming electrically conductive pillars |
04/18/2000 | US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components |
04/18/2000 | US6049958 High resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manufacture thereof |
04/13/2000 | WO2000021344A1 Printed board assembly and method of its manufacture |
04/13/2000 | WO2000021133A1 Embedded capacitor multi-chip modules |
04/13/2000 | WO2000021102A1 Capacitance-coupled high dielectric constant embedded capacitors |
04/13/2000 | WO2000021101A2 Large value buried inductors in low temperature co-fired ceramic circuit boards |
04/13/2000 | WO2000021032A1 Rfid integrated in electronic assets |
04/13/2000 | WO2000021030A1 Rfid transponder having improved rf characteristics |
04/13/2000 | WO2000020214A1 Electrically conductive adhesive transfers |
04/13/2000 | WO2000019892A1 Emg electrode apparatus and positioning system |
04/13/2000 | DE19948059A1 Composition for preparing insulating materials used as raw materials for build-up print circuit boards, includes epoxy resin, curing agent and poly(ether sulfone) |
04/13/2000 | DE19844965A1 Chip card module for chip card e.g. for entry access |
04/13/2000 | DE19843731A1 Sound transducer arrangement has circuit board that forms acoustic component for influencing acoustic properties of sound transducer |
04/13/2000 | DE19843627A1 Lösbare Verbindungsanordnung Detachable connection arrangement |
04/13/2000 | DE19842705A1 Aerial arrangement esp for motor vehicle anti-theft system |
04/13/2000 | DE19842590A1 Verfahren zur Herstellung von Schaltungsanordnungen A process for producing circuit arrangements |
04/13/2000 | CA2346041A1 Large value buried inductors in low temperature co-fired ceramic circuit boards |
04/12/2000 | EP0993242A1 Method of producing ceramic multilayer substrate |
04/12/2000 | EP0993240A1 Circuit board and connection method |
04/12/2000 | EP0993039A1 Substrate for mounting semiconductor chips |
04/12/2000 | EP0992973A2 Method for attaching an acoustic transducer to a substrate |
04/12/2000 | EP0992940A2 Process for manufacturing IC card |
04/12/2000 | EP0992521A2 Thermosetting resin composition |
04/12/2000 | EP0992308A2 Nickel composite particle and production process therefor |
04/12/2000 | EP0992065A1 Film used as a substrate for integrated circuits |
04/12/2000 | EP0992001A1 Housing including a back panel for guiding conductive printed tracks |
04/12/2000 | EP0991711A1 A flame retardant epoxy resin composition |
04/12/2000 | CN2373881Y Push-botton signal activator |
04/12/2000 | CN1250264A Radio device and portable transmitter -receiver |
04/12/2000 | CN1249994A Shell for thermal printing head |
04/12/2000 | CN1051435C Method and apparatus for aligning and attaching a surface mount component |
04/12/2000 | CN1051434C Jig for detecting warp of printed circuit board |
04/12/2000 | CN1051386C Hot pluggable motherboard bus connector method |
04/12/2000 | CN1051325C Phosphorus-modified epoxy resins, process for producing them and their use |
04/12/2000 | CN1051309C Fluoro taxols |
04/11/2000 | US6049467 Stackable high density RAM modules |
04/11/2000 | US6049464 Electronic modules manufacturing |
04/11/2000 | US6049275 Security mechanism for an IC packing box |
04/11/2000 | US6049163 Discharge lamp unit with RF shield primary coil |
04/11/2000 | US6049121 Tape carrier package and liquid crystal display device including such tape carrier package |
04/11/2000 | US6049055 Method of producing a smart card |
04/11/2000 | US6049043 Printed circuit board |
04/11/2000 | US6049041 Flexible metal-clad dielectric including a beryllium-copper alloy foil, with an enriched electrical conductivity and a mean grain size of 20 mu.m or lesss, which is laminated with highly flexible resin film; improved bending |
04/11/2000 | US6048807 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
04/11/2000 | US6048424 Method for manufacturing ceramic laminated substrate |
04/11/2000 | US6048212 Radio frequency connector |
04/11/2000 | US6048095 External connection mechanism of temperature-measuring type for printed circuit board |
04/11/2000 | US6048082 Direct-mounting electric lamp unit |
04/11/2000 | US6047469 Method of connecting a unit under test in a wireless test fixture |
04/11/2000 | US6047467 Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microelectronics packages via conduction through the package leads |
04/11/2000 | US6047463 Embedded trimmable resistors |
04/06/2000 | WO2000019791A1 Device for protecting an electric circuit against interface microdischarge phenomena |
04/06/2000 | WO2000019532A1 Package for providing improved electrical contact and methods for forming the same |
04/06/2000 | DE19943401A1 Manufacturing method for laminated transmission line, forming structure on laminated substrate using laser etching |
04/06/2000 | DE19939933A1 Leistungs-Moduleinheit Power module unit |
04/06/2000 | DE19842224A1 Ignition starter switch module for motor vehicle |
04/05/2000 | EP0991306A1 Film for flexible printed wiring board |
04/05/2000 | EP0991082A1 Composite dielectric material composition, and film, substrate, electronic parts and moldings therefrom |
04/05/2000 | EP0991014A2 Conductive paste and method of forming antenna for transponder |
04/05/2000 | EP0990729A1 Polycarboxy/polyol fiberglass binder of low pH |
04/05/2000 | EP0990728A1 Low molecular weight polycarboxy/polyol fiberglass binder |
04/05/2000 | EP0990727A1 Polycarboxy/polyol fiberglass binder |
04/05/2000 | EP0990673A2 Polybenzoxazole resin and precursor thereof |
04/05/2000 | EP0990512A1 An electrically insulating non-woven fabric, a prepreg and a laminate |
04/05/2000 | EP0990201A1 Long-lasting flexible circuitry |
04/05/2000 | EP0876691B1 Solder element |
04/05/2000 | EP0820540B1 Unidirectional glass fabric produced with continuous yarn which is twisted, has a low number of twists or zero twisting turns and interlaced with thin glass yarns as a stabilizing binding, and use thereof in the manufacture of printed circuits |
04/05/2000 | CN2372865Y Fixed support for circuit board |
04/05/2000 | CN1249537A Miltilayer wiring structure and producing method thereof |
04/05/2000 | CN1051199C Printed circuit board with internal capacitor |
04/05/2000 | CN1051198C Resistive metal layers and method for making same |
04/05/2000 | CN1051197C Method for mfg. circuit board, and made circuit board |
04/05/2000 | CN1051169C Method for enhancement of polyimide adhesion to reactive metal |
04/05/2000 | CA2273312A1 Wireless bus |
04/04/2000 | US6047159 Reconfigurable node for a communications network |
04/04/2000 | US6046918 Flux equalized transformer circuit |
04/04/2000 | US6046912 Computer system having riser board expansion capability |
04/04/2000 | US6046911 Dual substrate package assembly having dielectric member engaging contacts at only three locations |
04/04/2000 | US6046909 Computer card with a printed circuit board with vias providing strength to the printed circuit board |
04/04/2000 | US6046901 Support structure, electronic assembly |
04/04/2000 | US6046886 Flex circuit head interconnect with insulating spacer |
04/04/2000 | US6046703 Compact wireless transceiver board with directional printed circuit antenna |
04/04/2000 | US6046653 Printed circuit board unit with a wiring line providing termination resistance |
04/04/2000 | US6046503 Metalization system having an enhanced thermal conductivity |
04/04/2000 | US6046501 RF-driven semiconductor device |
04/04/2000 | US6046409 Multilayer microelectronic circuit |
04/04/2000 | US6045979 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material |
04/04/2000 | US6045975 Photosensitive, heat-resistant resin composition for forming patterns |
04/04/2000 | US6045897 Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same |
04/04/2000 | US6045893 Multilayered electronic part with minimum silver diffusion |
04/04/2000 | US6045713 Forming an underlying metal layer on an insulation film with a deposition layer formed by dry plating and a copper deposition layer formed by dry plating; applying a surface treatment using an alkaline solution; adhesive-free; defects |
04/04/2000 | US6045615 Homogeneous screening nozzle |
04/04/2000 | US6045240 LED lamp assembly with means to conduct heat away from the LEDS |
04/04/2000 | US6045025 Method and apparatus for soldering and soldering land of a printed circuit board |
04/04/2000 | US6044549 Assembly of electronic components onto substrates |
04/02/2000 | CA2285513A1 Improved low molecular weight polycarboxy/polyol fiberglass binder |
03/30/2000 | WO2000018203A1 Method and means for manufacturing printed wiring boards |
03/30/2000 | WO2000018202A1 Multilayer build-up wiring board |
03/30/2000 | WO2000018201A1 Method for producing multi-layer circuits |