Patents for H05K 1 - Printed circuits (98,583)
04/2000
04/18/2000US6049977 Method of forming electrically conductive pillars
04/18/2000US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components
04/18/2000US6049958 High resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manufacture thereof
04/13/2000WO2000021344A1 Printed board assembly and method of its manufacture
04/13/2000WO2000021133A1 Embedded capacitor multi-chip modules
04/13/2000WO2000021102A1 Capacitance-coupled high dielectric constant embedded capacitors
04/13/2000WO2000021101A2 Large value buried inductors in low temperature co-fired ceramic circuit boards
04/13/2000WO2000021032A1 Rfid integrated in electronic assets
04/13/2000WO2000021030A1 Rfid transponder having improved rf characteristics
04/13/2000WO2000020214A1 Electrically conductive adhesive transfers
04/13/2000WO2000019892A1 Emg electrode apparatus and positioning system
04/13/2000DE19948059A1 Composition for preparing insulating materials used as raw materials for build-up print circuit boards, includes epoxy resin, curing agent and poly(ether sulfone)
04/13/2000DE19844965A1 Chip card module for chip card e.g. for entry access
04/13/2000DE19843731A1 Sound transducer arrangement has circuit board that forms acoustic component for influencing acoustic properties of sound transducer
04/13/2000DE19843627A1 Lösbare Verbindungsanordnung Detachable connection arrangement
04/13/2000DE19842705A1 Aerial arrangement esp for motor vehicle anti-theft system
04/13/2000DE19842590A1 Verfahren zur Herstellung von Schaltungsanordnungen A process for producing circuit arrangements
04/13/2000CA2346041A1 Large value buried inductors in low temperature co-fired ceramic circuit boards
04/12/2000EP0993242A1 Method of producing ceramic multilayer substrate
04/12/2000EP0993240A1 Circuit board and connection method
04/12/2000EP0993039A1 Substrate for mounting semiconductor chips
04/12/2000EP0992973A2 Method for attaching an acoustic transducer to a substrate
04/12/2000EP0992940A2 Process for manufacturing IC card
04/12/2000EP0992521A2 Thermosetting resin composition
04/12/2000EP0992308A2 Nickel composite particle and production process therefor
04/12/2000EP0992065A1 Film used as a substrate for integrated circuits
04/12/2000EP0992001A1 Housing including a back panel for guiding conductive printed tracks
04/12/2000EP0991711A1 A flame retardant epoxy resin composition
04/12/2000CN2373881Y Push-botton signal activator
04/12/2000CN1250264A Radio device and portable transmitter -receiver
04/12/2000CN1249994A Shell for thermal printing head
04/12/2000CN1051435C Method and apparatus for aligning and attaching a surface mount component
04/12/2000CN1051434C Jig for detecting warp of printed circuit board
04/12/2000CN1051386C Hot pluggable motherboard bus connector method
04/12/2000CN1051325C Phosphorus-modified epoxy resins, process for producing them and their use
04/12/2000CN1051309C Fluoro taxols
04/11/2000US6049467 Stackable high density RAM modules
04/11/2000US6049464 Electronic modules manufacturing
04/11/2000US6049275 Security mechanism for an IC packing box
04/11/2000US6049163 Discharge lamp unit with RF shield primary coil
04/11/2000US6049121 Tape carrier package and liquid crystal display device including such tape carrier package
04/11/2000US6049055 Method of producing a smart card
04/11/2000US6049043 Printed circuit board
04/11/2000US6049041 Flexible metal-clad dielectric including a beryllium-copper alloy foil, with an enriched electrical conductivity and a mean grain size of 20 mu.m or lesss, which is laminated with highly flexible resin film; improved bending
04/11/2000US6048807 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture
04/11/2000US6048424 Method for manufacturing ceramic laminated substrate
04/11/2000US6048212 Radio frequency connector
04/11/2000US6048095 External connection mechanism of temperature-measuring type for printed circuit board
04/11/2000US6048082 Direct-mounting electric lamp unit
04/11/2000US6047469 Method of connecting a unit under test in a wireless test fixture
04/11/2000US6047467 Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microelectronics packages via conduction through the package leads
04/11/2000US6047463 Embedded trimmable resistors
04/06/2000WO2000019791A1 Device for protecting an electric circuit against interface microdischarge phenomena
04/06/2000WO2000019532A1 Package for providing improved electrical contact and methods for forming the same
04/06/2000DE19943401A1 Manufacturing method for laminated transmission line, forming structure on laminated substrate using laser etching
04/06/2000DE19939933A1 Leistungs-Moduleinheit Power module unit
04/06/2000DE19842224A1 Ignition starter switch module for motor vehicle
04/05/2000EP0991306A1 Film for flexible printed wiring board
04/05/2000EP0991082A1 Composite dielectric material composition, and film, substrate, electronic parts and moldings therefrom
04/05/2000EP0991014A2 Conductive paste and method of forming antenna for transponder
04/05/2000EP0990729A1 Polycarboxy/polyol fiberglass binder of low pH
04/05/2000EP0990728A1 Low molecular weight polycarboxy/polyol fiberglass binder
04/05/2000EP0990727A1 Polycarboxy/polyol fiberglass binder
04/05/2000EP0990673A2 Polybenzoxazole resin and precursor thereof
04/05/2000EP0990512A1 An electrically insulating non-woven fabric, a prepreg and a laminate
04/05/2000EP0990201A1 Long-lasting flexible circuitry
04/05/2000EP0876691B1 Solder element
04/05/2000EP0820540B1 Unidirectional glass fabric produced with continuous yarn which is twisted, has a low number of twists or zero twisting turns and interlaced with thin glass yarns as a stabilizing binding, and use thereof in the manufacture of printed circuits
04/05/2000CN2372865Y Fixed support for circuit board
04/05/2000CN1249537A Miltilayer wiring structure and producing method thereof
04/05/2000CN1051199C Printed circuit board with internal capacitor
04/05/2000CN1051198C Resistive metal layers and method for making same
04/05/2000CN1051197C Method for mfg. circuit board, and made circuit board
04/05/2000CN1051169C Method for enhancement of polyimide adhesion to reactive metal
04/05/2000CA2273312A1 Wireless bus
04/04/2000US6047159 Reconfigurable node for a communications network
04/04/2000US6046918 Flux equalized transformer circuit
04/04/2000US6046912 Computer system having riser board expansion capability
04/04/2000US6046911 Dual substrate package assembly having dielectric member engaging contacts at only three locations
04/04/2000US6046909 Computer card with a printed circuit board with vias providing strength to the printed circuit board
04/04/2000US6046901 Support structure, electronic assembly
04/04/2000US6046886 Flex circuit head interconnect with insulating spacer
04/04/2000US6046703 Compact wireless transceiver board with directional printed circuit antenna
04/04/2000US6046653 Printed circuit board unit with a wiring line providing termination resistance
04/04/2000US6046503 Metalization system having an enhanced thermal conductivity
04/04/2000US6046501 RF-driven semiconductor device
04/04/2000US6046409 Multilayer microelectronic circuit
04/04/2000US6045979 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
04/04/2000US6045975 Photosensitive, heat-resistant resin composition for forming patterns
04/04/2000US6045897 Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same
04/04/2000US6045893 Multilayered electronic part with minimum silver diffusion
04/04/2000US6045713 Forming an underlying metal layer on an insulation film with a deposition layer formed by dry plating and a copper deposition layer formed by dry plating; applying a surface treatment using an alkaline solution; adhesive-free; defects
04/04/2000US6045615 Homogeneous screening nozzle
04/04/2000US6045240 LED lamp assembly with means to conduct heat away from the LEDS
04/04/2000US6045025 Method and apparatus for soldering and soldering land of a printed circuit board
04/04/2000US6044549 Assembly of electronic components onto substrates
04/02/2000CA2285513A1 Improved low molecular weight polycarboxy/polyol fiberglass binder
03/2000
03/30/2000WO2000018203A1 Method and means for manufacturing printed wiring boards
03/30/2000WO2000018202A1 Multilayer build-up wiring board
03/30/2000WO2000018201A1 Method for producing multi-layer circuits