Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
12/1999
12/22/1999EP0966186A2 Process for manufacturing a metal-ceramic substrate
12/22/1999EP0966185A1 Printed wiring board and method of manufacturing the same
12/22/1999EP0966031A2 Substrate for mounting a semiconductor chip
12/22/1999EP0965997A1 Via-filling conductive paste composition
12/22/1999EP0947124A4 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion
12/22/1999CN1239543A Spherical shaped semiconductor integrated circuit
12/22/1999CN1239397A 电子电路组件 Electronic circuit assembly
12/21/1999US6005777 Ball grid array capacitor
12/21/1999US6005776 Vertical connector based packaging solution for integrated circuits
12/21/1999US6005767 Portable computer having articulated display
12/21/1999US6005766 Multi-layered printed circuit board and its manufacturing method
12/21/1999US6005403 Flexible electrical test fixture for integrated circuits on prototype and production printed circuit boards
12/21/1999US6005399 Solder paste and residue measurement system
12/21/1999US6005224 Method of soldering components to at least one carrier
12/21/1999US6005198 Wiring board constructions and methods of making same
12/21/1999US6005197 Embedded thin film passive components
12/21/1999US6004657 Laminated electronic part
12/21/1999US6004633 Microstructured dies made of non-conductive resins.
12/21/1999US6004624 Densified ceramic body which is relatively free of surface defects. paste comprising a refractory metal powder, a binder and tricalcium aluminate in an amount sufficient to reduce formation of particles in surface and subsurface
12/21/1999US6004396 Spherical shaped semiconductor integrated circuit
12/21/1999US6004139 Memory module interface card adapter
12/21/1999US6003418 Punched slug removal system
12/21/1999US6003221 Metal matrix composites containing electrical insulators
12/21/1999CA2155257C Low inductance surface-mount connectors for interconnecting circuit devices and method for using same
12/16/1999WO1999065282A1 Ic stack utilizing flexible circuits with bga contacts
12/16/1999WO1999065089A1 Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer
12/16/1999WO1999064657A2 Fabric or garment with integrated flexible information infrastructure
12/16/1999WO1999064195A2 Curved ceramic moulded part
12/16/1999WO1999054525A3 Method for producing metallized substrate materials
12/16/1999DE19904258A1 Ball grid array semiconductor device e.g. for mobile telephone or personal computer
12/16/1999DE19852355A1 Circuit, e.g. for controller, especially motor vehicle engine controller
12/16/1999DE19826189A1 Integrated capacitor for laminated circuits
12/16/1999DE19826182A1 Arrangement for labeling circuit boards
12/16/1999DE19826023A1 Multi-layer electric circuit device with surface mounted devices
12/16/1999DE19825836A1 Thick-film heating conductor application method for hot water tank
12/16/1999DE19825684A1 Method of connecting electronic components
12/16/1999DE19825666A1 Kontaktierung zwischen wenigstens zwei Leiterplatten Contact between at least two printed circuit boards
12/16/1999CA2299319A1 Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer
12/16/1999CA2295534A1 Fabric or garment with integrated flexible information infrastructure
12/15/1999EP0964609A1 Anti-bridging solder ball collection zones
12/15/1999EP0964606A2 Interconnection between at least two circuit boards
12/15/1999EP0964605A2 Low-thermal expansion circuit board and multilayer circuit board
12/15/1999EP0964442A1 Ball arranging substrate for forming bump, ball arranging head, ball arranging device, and ball arranging method
12/15/1999CN1238899A Method for adding layers to PWB which yields high levels of copper to dielectric adhesion
12/15/1999CN1238856A Chip module and manufacturing process thereof
12/15/1999CN1238660A Method of forming lands on the surface of the circuit board
12/15/1999CN1238576A Printed circuit card with minor surface I/O pads
12/15/1999CN1238537A Surface mounting type coil unit
12/15/1999CN1238394A Process of controlling grain growth in metal films
12/15/1999CN1047411C Electrodeposited copper foil and process for making same
12/14/1999US6002638 Memory device having a switchable clock output and method therefor
12/14/1999US6002594 Flexible touchpad circuit with mounted circuit board
12/14/1999US6002593 Reducing electromagnetic noise radiated from a printed board
12/14/1999US6002590 Flexible trace surface circuit board and method for making flexible trace surface circuit board
12/14/1999US6002578 Ceramic substrate, circuit substrate and electronic circuit substrate by use thereof and method for preparing ceramic substrate
12/14/1999US6002569 Electrostatic discharge protection apparatus
12/14/1999US6002437 Camera head having a flexible printed circuit board with thin folding portions arranged in a cylindrical housing
12/14/1999US6002264 Interconnect adapter to printed circuit assembly for testing in an operational environment
12/14/1999US6002172 Substrate structure and method for improving attachment reliability of semiconductor chips and modules
12/14/1999US6001950 Heating glyoxal at a temperature of about 80-100 degrees c with a molar excess of a phenol in the presence of an acidic catalyst which is eliminated from the reaction mixture
12/14/1999US6001489 Flexible printed circuit and process for producing the same
12/14/1999US6001283 Paste composition of solvent, binder, plasticizer and solid powder or powders of phosphorescent material of compound of group vi/group iia or iib to which has been added a metal of copper, silver, manganese, thallium or a rare earth
12/14/1999US6000130 Process for making planar redistribution structure
12/14/1999US6000129 Process for manufacturing a circuit with filled holes
12/14/1999US6000124 Method and apparatus for manufacturing multilayer printed circuit board
12/14/1999US6000120 Method of making coaxial transmission lines on a printed circuit board
12/14/1999CA2195218C Copper wire and process for making copper wire
12/09/1999WO1999063795A1 Method for producing wirings having solder bumps
12/09/1999WO1999063792A1 Flexible circuit assembly
12/09/1999WO1999063557A1 Printed annular coil and method of manufacture thereof
12/09/1999WO1999063553A1 Thick film resistor compositions for making heat-transfer tapes and use thereof
12/09/1999WO1999063552A1 Rigid/flex printed circuit board and manufacturing method therefor
12/09/1999WO1999062841A1 Composite injection mouldable material
12/09/1999WO1999046965A3 Integrated circuit connection using an electrically conductive adhesive
12/09/1999WO1999030376A3 Battery-included pcb
12/09/1999WO1999029761A3 Poly(arylene ether) compositions and methods of manufacture thereof
12/09/1999DE19842080A1 Carrier disk manufacture for semiconductor chip
12/09/1999DE19823685A1 Electronic control device for vehicle
12/08/1999EP0963142A2 Assembly having a back plate with inserts
12/08/1999EP0962977A2 Electrically conductive paste and ceramic multi-layered substrate
12/08/1999EP0962968A2 Method of producing a multi-layer ceramic substrate
12/08/1999EP0962946A2 Standing mounted coil for printed circuit boards
12/08/1999EP0962559A2 Wholly aromatic polyamide fibers, a sheet comprising same and method of producing the sheet
12/08/1999EP0962495A1 A curable polyphenylene ether-thermosetting resin composition
12/08/1999EP0961809A1 Low temperature method and compositions for producing electrical conductors
12/08/1999EP0831072B1 Low-permittivity glass fibers
12/08/1999CN1237791A 半导体器件 Semiconductor devices
12/08/1999CN1237657A Wholly aromatic polyamide fibers, sheet comprising same and method of producing the sheet
12/08/1999CN1237586A Highly purified epoxy resin
12/08/1999CN1237547A Borate glass based ceramic tape
12/08/1999CN1237489A Rolled copper foil and method of manufacturing the same
12/08/1999CA2273754A1 Enhanced mounting pads for printed circuit boards
12/08/1999CA2273752A1 Anti-bridging solder ball collection zones
12/07/1999US5999414 Physically separating printed circuit boards with a resilient, conductive contact
12/07/1999US5999412 Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board
12/07/1999US5999410 Flexible circuit board configurable for use with different types of battery packs
12/07/1999US5999409 Contactless IC card
12/07/1999US5999408 Enhanced heat transfer in printed circuit boards
12/07/1999US5999097 Electrical lead and financial terminal including the lead
12/07/1999US5998864 Stacking semiconductor devices, particularly memory chips
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