| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/12/2000 | CN1241112A Electronic apparatus |
| 01/12/2000 | CN1241047A Electrical connector system for shielded flat flexible circuitry |
| 01/12/2000 | CN1048359C Flexible wiring board having terminal array and its connection structure with circuit board |
| 01/11/2000 | US6014320 High density stacked circuit module |
| 01/11/2000 | US6014319 Multi-part concurrently maintainable electronic circuit card assembly |
| 01/11/2000 | US6014317 Chip package mounting structure for controlling warp of electronic assemblies due to thermal expansion effects |
| 01/11/2000 | US6014316 IC stack utilizing BGA contacts |
| 01/11/2000 | US6014314 Package structure of a multi-chip module |
| 01/11/2000 | US6014196 Transparent electrically conductive film-attached substrate |
| 01/11/2000 | US6014066 Tented diode shunt RF switch |
| 01/11/2000 | US6013945 Electronic module for data cards |
| 01/11/2000 | US6013899 Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component |
| 01/11/2000 | US6013897 Electric circuit board having protective part against light beam soldering |
| 01/11/2000 | US6013877 Solder bonding printed circuit boards |
| 01/11/2000 | US6013588 Printed circuit board and printed circuit board base material |
| 01/11/2000 | US6013419 Polyimide resin films, coating on the surface with cyclodehydration and photopolymerization |
| 01/11/2000 | US6013357 Sintering aluminium nitride stack in presence of boron nitride release agent |
| 01/11/2000 | US6013203 Electroconductive paint for electromagnetic interference(emi) or radio frequency interference(rfi) shielding for housings of electronics comprising resin with specific curable groups, metallic particles, curing agent and curing catalyst |
| 01/11/2000 | US6012928 Microstrip edge card connector |
| 01/11/2000 | US6012658 Comminution porous sponge structure of metal; flattening |
| 01/11/2000 | US6012224 Method of forming compliant microelectronic mounting device |
| 01/11/2000 | US6012221 Method of attaching a flexible circuit to a substrate |
| 01/11/2000 | CA2064859C Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
| 01/06/2000 | WO2000001208A1 Assembly of an electronic component with spring packaging |
| 01/06/2000 | WO2000001207A1 Apparatus and method for improving computer memory speed and capacity |
| 01/06/2000 | WO2000001060A1 Electronic package assembly |
| 01/06/2000 | WO2000001041A1 Electrical connector having variable resistance contacts |
| 01/06/2000 | WO2000001039A1 Membrane-supported contactor for semiconductor test |
| 01/06/2000 | WO1999045416A3 Optoelectric multichip module |
| 01/06/2000 | CA2334681A1 Apparatus and method for improving computer memory speed and capacity |
| 01/05/2000 | EP0969707A2 Multilayer printed wiring board and method for manufacturing same |
| 01/05/2000 | EP0969706A2 Electrical connections with deformable contacts |
| 01/05/2000 | EP0969591A1 Piezo-oscillator |
| 01/05/2000 | EP0969503A2 Electronic circuit device |
| 01/05/2000 | EP0969409A2 Method for producing a chip card and corresponding chip card |
| 01/05/2000 | EP0969059A2 Compositions for use in the fabrication of circuit components and printed wire boards |
| 01/05/2000 | EP0969028A2 Circuit composition comprising allylated amide compounds |
| 01/05/2000 | EP0968629A2 Flat assembly and method for post-assembling additional components on a printed circuit board |
| 01/05/2000 | EP0968539A1 Product having a rechargeable battery which is held in a mechanically stable manner and is easy to remove |
| 01/05/2000 | EP0914688A4 Printed circuit board layering configuration for very high bandwidth interconnect |
| 01/05/2000 | EP0851885B1 Cross-linked biobased materials and uses thereof |
| 01/05/2000 | DE19829581A1 Baugruppenträger für elektronische Schaltungen Rack for electronic circuits |
| 01/05/2000 | DE19827089A1 Multilayer-Schaltungsaufbau mit beidseitiger SMD-Bestückung Multilayer circuit structure with two-sided SMD assembly |
| 01/05/2000 | CN1240568A Electronic component and mounting method and device thereof |
| 01/05/2000 | CN1240566A Means and method for mounting electronic device |
| 01/05/2000 | CN1240327A Installed circuit board structure and multi-layer circuit board for same |
| 01/05/2000 | CN1048116C Protective circuit for fuse |
| 01/04/2000 | US6011912 Automatic routing method with net ordering for facilitated collision evasion |
| 01/04/2000 | US6011741 Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems |
| 01/04/2000 | US6011695 External bus interface printed circuit board routing for a ball grid array integrated circuit package |
| 01/04/2000 | US6011693 Slotted printed circuit board surface mount stress relief system |
| 01/04/2000 | US6011691 Electronic component assembly and method for low cost EMI and capacitive coupling elimination |
| 01/04/2000 | US6011449 Surface mount technology contact for ferrite isolator/circulator applications |
| 01/04/2000 | US6011319 Integrated circuit assembly for power and electronics |
| 01/04/2000 | US6011299 Apparatus to minimize integrated circuit heatsink E.M.I. radiation |
| 01/04/2000 | US6011294 Low cost CCD packaging |
| 01/04/2000 | US6010771 Electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 01/04/2000 | US6010769 Multilayer wiring board and method for forming the same |
| 01/04/2000 | US6010359 Electrical connector system for shielded flat flexible circuitry |
| 01/04/2000 | US6010357 System for connecting flat flexible circuitry |
| 01/04/2000 | US6010058 BGA package using a dummy ball and a repairing method thereof |
| 01/04/2000 | US6009620 Method of making a printed circuit board having filled holes |
| 01/04/2000 | US6009619 Process for manufacturing an electronic circuit card |
| 12/30/1999 | DE19854899C1 Lighting unit for automobile |
| 12/30/1999 | DE19826658A1 Circuit substrate, especially a multilevel circuit board for SMD components, comprising conductive structures on or within insulating layers |
| 12/30/1999 | DE19826648A1 Circuit substrate with optoelectronic component |
| 12/29/1999 | WO1999067794A1 Uv-curable epoxy formulations, including conductive compositions |
| 12/29/1999 | EP0967650A2 Circuit board for mounting bare chip |
| 12/29/1999 | EP0967624A2 Via formation for multilayer inductive devices and other devices |
| 12/29/1999 | EP0967621A1 Conductor paste and nonreversible circuit elements made by using the same |
| 12/29/1999 | EP0966868A1 Printed circuit assembly |
| 12/29/1999 | EP0966777A1 Electric subassembly |
| 12/29/1999 | EP0966759A2 Thin-film component comprising a substrate with an elastic coating |
| 12/29/1999 | EP0966698A2 Opto-electric module |
| 12/29/1999 | CN1239863A Low-expansion circuit board and multilayer circuit board |
| 12/28/1999 | US6009327 Hand-off method in a personal communication service system |
| 12/28/1999 | US6008987 Electronic circuitry |
| 12/28/1999 | US6008982 Low profile electrical distribution center and method of making a bus subassembly therefor |
| 12/28/1999 | US6008774 Printed antenna structure for wireless data communications |
| 12/28/1999 | US6008538 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 12/28/1999 | US6007886 Multilayered substrate and method for its production |
| 12/28/1999 | US6007758 Using conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent, firing of the substrate onto which the ink has been coated, and plating of copper thereon |
| 12/28/1999 | US6007743 Nickel powder and process for preparing the same |
| 12/28/1999 | US6007668 Tape automated bonding (tab) formed by bonding a conductor metal foil onto an adhesive layer on a metal plate; coating the metal plate with a protective plating inert to the etchant and etching the foil; hermetic sealing |
| 12/28/1999 | US6007366 Method of incorporation crimp-style connector onto a board and an associated crimp-style connector |
| 12/28/1999 | US6007347 Coaxial cable to microstrip connection and method |
| 12/28/1999 | US6007185 Recording head, head cartridge and recording apparatus with flexible substrate coupling |
| 12/28/1999 | US6006636 Programmable punch mechanism |
| 12/28/1999 | US6006428 Polytetrafluoroethylene thin film chip carrier |
| 12/23/1999 | WO1999066770A1 A flat flexible printed circuit conformable to a contoured surface |
| 12/23/1999 | WO1999066555A1 Method for determining the desired decoupling components for power distribution systems |
| 12/23/1999 | WO1999066554A1 System and method for determining the desired decoupling components for power distribution systems using a computer system |
| 12/23/1999 | WO1999066553A1 Member for lead |
| 12/23/1999 | WO1999066518A1 Electric component |
| 12/23/1999 | WO1999066500A1 Low inductance flex-to-pcb spring connector for disc drive |
| 12/23/1999 | WO1999066499A1 Flex support and seal apparatus for a disc drive |
| 12/23/1999 | WO1999065639A1 Laser drilling of holes in materials |
| 12/23/1999 | DE19827414A1 Verfahren zum Herstellen eines Metall-Keramik-Substrates A method for producing a metal-ceramic substrate |
| 12/23/1999 | CA2273542A1 Thin film laminates |
| 12/22/1999 | EP0966187A2 Multilayer circuit assembly having surface mounted components on both sides |