| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/30/2000 | WO2000017967A1 Removable connecting system |
| 03/30/2000 | WO2000017840A2 Display and backlighting assembly |
| 03/30/2000 | WO2000017806A1 Electrical connector for the simultaneous connection of two electronic-memory cards |
| 03/30/2000 | WO2000017253A1 Liquid crystalline polyesters having a surprisingly good combination of a low melting point, a high heat distortion temperature, a low melt viscosity, and a high tensile elongation |
| 03/30/2000 | WO2000017243A1 Phenol-novolacs with improved optical properties |
| 03/30/2000 | WO2000017010A1 Emergency device for vehicles |
| 03/30/2000 | WO2000016904A1 Method of producing metal flakes |
| 03/30/2000 | DE19946682A1 Flexible laminate, for e.g. printed circuits, comprises two polyimide layers and metal film |
| 03/30/2000 | DE19858232C1 Electric drive unit for motor vehicle window lifter or windscreen wiper, has power switch combined with control unit in integrated circuit arranged on lead frame |
| 03/30/2000 | DE19844098A1 Kunststoffolie für die Verklebung mit anderen Folien und Leiterplatten Plastic film for bonding with other films and boards |
| 03/30/2000 | DE19840167A1 Electrical insulation testing of thin base material, for multilayer printed circuit board, applies voltage avoiding breakdown, then breakdown current measurement |
| 03/30/2000 | CA2338840A1 Electrical connector for the simultaneous connection of two electronic-memory cards |
| 03/30/2000 | CA2309579A1 Phenol-novolacs with improved optical properties |
| 03/29/2000 | EP0989796A1 Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time |
| 03/29/2000 | EP0989794A2 Surface mount thermal connections |
| 03/29/2000 | EP0989793A2 Method of making peripheral low inductance interconnects with reduced contamination |
| 03/29/2000 | EP0989792A2 Polymeric foil for glueing onto other foils and circuit boards |
| 03/29/2000 | EP0989789A2 Printed wiring board and manufacturing method thereof |
| 03/29/2000 | EP0989788A2 Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board |
| 03/29/2000 | EP0989773A2 Soundtransducer apparatus |
| 03/29/2000 | EP0989610A2 Multilayered wiring structure and method of manufacturing the same |
| 03/29/2000 | EP0989607A1 IMPROVEMENTS TO THE PROTECTION OF FETs BY MEANS OF TRACKS OF PRINTED CIRCUIT BOARDS |
| 03/29/2000 | EP0988667A1 Contact pin |
| 03/29/2000 | EP0988658A1 Orthogonally mounted substrate based resonator |
| 03/29/2000 | EP0988619A1 Method for making a contactless smart card |
| 03/29/2000 | EP0988576A2 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate |
| 03/29/2000 | EP0988197A2 Window wiper motor system for an automotive vehicle |
| 03/29/2000 | EP0988029A1 Device and methods for wound treatment |
| 03/29/2000 | EP0663417B1 Polyimide laminate comprising thermoplastic polyimide polymer or thermoplastic polyimide film, and process for producing the laminate |
| 03/29/2000 | CN1249122A Moulded sockets for electronic component attachment |
| 03/29/2000 | CN1249121A Circuit board for electrical apparatus with HF components, particularly for mobile radio communications equipment |
| 03/29/2000 | CN1248882A Multi-layer circuit board for semiconductor chip set unit and making method thereof |
| 03/29/2000 | CN1248798A Method for installing transmission or receiving module of optical chain and rigid bendable board |
| 03/29/2000 | CN1248503A Metal power and its preparation process and electric conductivity paste |
| 03/29/2000 | CN1050951C Specifically configured sheet members or articles for use in improving sound or image quality |
| 03/29/2000 | CN1050941C Device and method for electric/mechanical connection structure |
| 03/29/2000 | CN1050810C Composite connector |
| 03/28/2000 | US6043990 Multiple board package employing solder balis and fabrication method and apparatus |
| 03/28/2000 | US6043989 Static electricity removing structure for portable electronic devices |
| 03/28/2000 | US6043988 Hard disk drive and hard disk apparatus having bus and its installing method |
| 03/28/2000 | US6043987 Printed circuit board having a well structure accommodating one or more capacitor components |
| 03/28/2000 | US6043986 Printed circuit board having a plurality of via-holes |
| 03/28/2000 | US6043966 Printed circuit board assembly having an integrated fusible link |
| 03/28/2000 | US6043558 IC packages including separated signal and power supply edge connections, systems and devices including such packages, and methods of connecting such packages |
| 03/28/2000 | US6043482 Scanning unit with a printed circuit for an optical position-measuring apparatus |
| 03/28/2000 | US6043435 Conducting section device and method for manufacturing the same |
| 03/28/2000 | US6042936 Microsphere containing circuit board paper |
| 03/28/2000 | US6042933 Comprising electroconductive composite non-noble metal powder particles having a flat shape covered with a noble metal layer; providing a layer of a mixture of the non-noble and noble metal between the two along with a binder |
| 03/28/2000 | US6042889 Immersing substrate in aqueous plating bath containing dissolved metal salt, chelating agent, reducing agent, dissolved mediator organometallic compound |
| 03/28/2000 | US6042751 Platinum group metal powder, modified graphite, and thermoplastic resin |
| 03/28/2000 | US6042712 Apparatus for controlling plating over a face of a substrate |
| 03/28/2000 | US6042685 Multiple wire printed circuit board and process for making the same |
| 03/28/2000 | US6042682 Method of thermocompression bonding a supporting substrate to a semiconductor bare chip |
| 03/28/2000 | US6042667 Method of fabricating ceramic multilayer substrate |
| 03/28/2000 | US6042413 Method for achieving substantially uniform expansion of dielectric plate and electrical connector made in accordance therewith |
| 03/28/2000 | US6041496 Method of making ceramic substrate |
| 03/28/2000 | US6041495 Filling holes in a photoresist-coated polyimide film with metal, removing photoresist leaving metal bumps projecting from film; electroplating bumps forms connections on circuit board surface opposite from where semiconductor chip attaches |
| 03/23/2000 | WO2000016595A1 Printed conductors made of polyalkylene dioxythiophene |
| 03/23/2000 | WO2000016446A1 Printed circuit board arrangement with a multipole plug-in connector |
| 03/23/2000 | WO2000016443A1 Non-circular micro-via |
| 03/23/2000 | WO2000016398A1 Power semiconductor module and motor drive system |
| 03/23/2000 | WO2000015547A2 Metal-carbon composite powders, methods for producing powders and devices fabricated from same |
| 03/23/2000 | DE19842523A1 Electromagnetic energy converter e.g. brushless electric motor or magnetic bearing, has integrated circuit board located between stator winding heads |
| 03/23/2000 | CA2343445A1 Non-circular micro-via |
| 03/22/2000 | EP0987931A2 Composite foil of aluminum and copper |
| 03/22/2000 | EP0987926A1 Electroluminescent light and structure for shielding the same |
| 03/22/2000 | EP0987748A2 Multilayered circuit board for semiconductor chip module, and method of manufacturing the same |
| 03/22/2000 | EP0987719A1 Insulating materials containing cycloolefinic polymers |
| 03/22/2000 | EP0987333A2 Thick film conductor composition for use in biosensors |
| 03/22/2000 | EP0987230A2 Dielectric ceramic material |
| 03/22/2000 | EP0986613A1 Liquid crystalline polyester compositions containing carbon black |
| 03/22/2000 | EP0986598A1 Liquid crystalline polyesters and molding compositions prepared therefrom |
| 03/22/2000 | EP0986480A1 Bonding system in an inkjet printer pen and method for providing the same |
| 03/22/2000 | EP0907998A4 Power pad/power delivery system |
| 03/22/2000 | CN1248355A Multi-deck power converter module |
| 03/22/2000 | CN1248197A Laminate for printed circuit boards |
| 03/22/2000 | CN1050729C Special-purpose retainer for multilayer circuit board |
| 03/22/2000 | CN1050710C 层结构 Layer structure |
| 03/22/2000 | CN1050705C Dual substrate package assembly for being electrically coupled to conducting member |
| 03/22/2000 | CN1050681C Non-contact tpype IC card and method and apparatus for manufacturing the same |
| 03/21/2000 | US6040985 Circuit board having general purpose region and programmable region |
| 03/21/2000 | US6040983 Vertical passive components for surface mount assembly |
| 03/21/2000 | US6040951 Optical apparatus having hard circuit board encoder |
| 03/21/2000 | US6040806 Circular-polarization antenna |
| 03/21/2000 | US6040624 Semiconductor device package and method |
| 03/21/2000 | US6040623 Slotted lead for a semiconductor device |
| 03/21/2000 | US6040622 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 03/21/2000 | US6040612 Image pickup apparatus for endoscope having reduced diameter |
| 03/21/2000 | US6040530 Versatile printed circuit board for testing processing reliability |
| 03/21/2000 | US6040529 Flexible substrate |
| 03/21/2000 | US6040524 Printed circuit board having two holes connecting first and second ground areas |
| 03/21/2000 | US6040459 N-aminoalkyldibenzothiophenecarboxamides; new dopamine receptor subtype specific ligands |
| 03/21/2000 | US6040252 Laminate base material, a method of producing the same, a prepreg and a laminate |
| 03/21/2000 | US6040093 Method and transferring conductor patterns to a film carrier, and masks and film carriers to be used therefor |
| 03/21/2000 | US6040068 Ceramic wiring board and method of producing the same |
| 03/21/2000 | US6039889 Process flows for formation of fine structure layer pairs on flexible films |
| 03/21/2000 | US6039600 Male connector for flat flexible circuit |
| 03/21/2000 | US6039581 Electrical connector for circuit card assemblies |
| 03/21/2000 | US6039429 Misprint detection techniques |
| 03/16/2000 | WO2000015017A1 Method and device for processing substrates |