Patents for H05K 1 - Printed circuits (98,583)
08/2000
08/03/2000WO2000045624A1 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
08/03/2000WO2000045472A1 Multifunction connector assembly
08/03/2000DE19951865A1 Circuit board e.g. for vehicle indicator instrument, has light source mounted on bearer in form of bridge attached to circuit board by fixing arrangement in form of clip fixing or hinge made in one piece with instrument housing
08/03/2000DE19903500A1 Dünnschichtschaltkreis mit Bauteil Thin film circuit with component
08/03/2000DE19901445A1 Semiconductor heat-sink arrangement
08/03/2000DE10003264A1 Dielectric ceramic, for electronic multilayer ceramic substrates, comprises a sintered mixture of a neodymium- and lanthanide-substituted barium titanate ceramic and a barium, silicon and boron oxide glass
08/02/2000EP1024546A1 Microwave circuit module and device for connection to another module
08/02/2000EP1024535A2 Thin film circuit with component
08/02/2000EP1024533A2 Thick-film paste with insoluble additive
08/02/2000EP1024529A2 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
08/02/2000EP1024405A1 Photosensitive insulating paste and thick-film multi-layer circuit substrate
08/02/2000EP1024171A1 Polyamide composition
08/02/2000EP1024155A1 Phenol/triazine derivative co-condensate resin and process for producing the same
08/02/2000EP1023820A1 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture
08/02/2000EP1023770A1 Surface mount lc filter with polymer layers
08/02/2000EP1023752A1 Disposable portable electronic devices and method of making
08/02/2000EP1023575A1 Position sensor
08/02/2000EP1023174A1 Manufacture of thin metal objects
08/02/2000EP0763261B1 Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof
08/02/2000EP0700409B1 Thermally cross-linkable heat-sealing adhesive
08/02/2000CN1262025A Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards
08/02/2000CN1261982A Thermal release for fixing on a circuit substrate
08/02/2000CN1261844A Extruded core laminates for circuit boards
08/02/2000CN1261584A Cable clamping terminal lead wire
08/02/2000CN1055045C Method for producing layered board
08/01/2000US6097883 Dual state memory card having combined and single circuit operation
08/01/2000US6097611 Multi-chip land grid array carrier
08/01/2000US6097607 Flexible computer system
08/01/2000US6097581 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
08/01/2000US6097277 Resistor network with solder sphere connector
08/01/2000US6097271 Low insertion phase variation dielectric material
08/01/2000US6097260 Distributed ground pads for shielding cross-overs of mutually overlapping stripline signal transmission networks
08/01/2000US6097202 Circuit board inspection apparatus and method
08/01/2000US6097089 Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
08/01/2000US6097085 Electronic device and semiconductor package
08/01/2000US6097082 Semiconductor device
08/01/2000US6096980 Non-ohmic energy coupling for crosstalk reduction
08/01/2000US6096829 Composed of 10 to 98% by weight styrene-based polymer having syndiotactic configuration and 2 to 90% polyolefin, 0.5 to 50 parts styrene-olefin copolymer having styrene content of 40 to 85%, 0 to 200 parts block or graft styrene olefin polymer
08/01/2000US6096665 Coating a sheet with a thermosetting resin surrounding the fibers, and filling some, but not all, of said interstices; coating again with a thermosetting resin surrounding the fiber and filling all the interstices; curing; integrated circuits
08/01/2000US6096482 Making insulating layer by heat treating polyamic acid of p-phenylenediamine, 3,3',4,4'-biphenyltetracarboxyacid and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl on a metal foil substrate; coefficient of thermal expansion same as foil
08/01/2000US6096411 Comprising 70-90 wt % of copper particles of an average particle size of 0.5-8 mu m, 0.5-15 wt % of insulating particles of an average particle size of 10-20 mu m, 6-17 wt % of thermosetting type liquid epoxy resin
08/01/2000US6096245 Conductive resin composition with kneading with alloy, molding with alloy of tin free of lead
08/01/2000US6095857 Electrical component for surface-mounting on a circuit board
08/01/2000US6095823 Method of electrically connecting a component to a PCB
08/01/2000US6094811 Central electric system for a motor vehicle and method of manufacturing same
08/01/2000CA2072380C Circuit assemblies of printed circuit boards and telecommunications connectors
07/2000
07/27/2000WO2000044213A1 An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board
07/27/2000WO2000044210A1 Multi-layer rf printed circuit architecture
07/27/2000WO2000044209A1 System and method for interconnecting layers in a printed circuit board
07/27/2000WO2000044208A1 Flexible microsystem and building techniques
07/27/2000WO2000044066A2 Remote entry integrally molded transmitter
07/27/2000WO2000043951A1 Chip card equipped with a loop antenna, and associated micromodule
07/27/2000WO2000026269A8 Vinyl terminated polybutadienes containing urethane or ester residues
07/27/2000WO2000021101A3 Large value buried inductors in low temperature co-fired ceramic circuit boards
07/27/2000WO1999062105A9 A package for power converters with improved transformer operations
07/27/2000DE19963332A1 Conducting wire carrier for use in motor vehicle has rows of snap protrusions on surface of insulating coating at same interval as through holes and each able to be brought into engagement with a through hole
07/27/2000DE19902714A1 Structured coating process used in metallizing processes comprises applying a material to a substrate, covering the substrate and the material with a coating and then removing the material together with the coating
07/27/2000DE10002351A1 Multiple plug connector for pre-ageing testing has housing section, circuit board with plug strip section and several connector-like electrodes for insertion into connector strip section
07/27/2000DE10001180A1 Manufacturing PCB involves holding suction surface, inserting conducting section into through hole, and soldering substrate sides to connect bridges to connection part and conducting section
07/27/2000DE10001137A1 Rolled copper foil, for flexible printed circuits, has a specified oxygen content, strictly controlled trace element contents and a specified softening temperature increase index
07/26/2000EP1022935A1 Bridge board for compact cabinet board
07/26/2000EP1022810A2 Method for connecting a cable with a printed circuit board and housing with cable connected to the circuit board according to the method
07/26/2000EP1022120A2 Press plate and method for producing it
07/26/2000EP0922379A4 Apparatus for cooling an electronic component
07/26/2000CN1261457A Surface mount multilayer capacitor
07/26/2000CN1261026A Flat multi-layer ceramic component with subadjacent grooves
07/25/2000US6094359 HF housing
07/25/2000US6094358 Card stiffener optimized for connector engagement
07/25/2000US6094357 Product having a rechargeable battery which is held in a mechanically stable manner and is easy to remove
07/25/2000US6094355 High-density computer modules with double-layer packaging
07/25/2000US6094354 Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board
07/25/2000US6094344 Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates
07/25/2000US6094343 Heat dissipation structure for electronic equipment including two heat dissipation block assemblies and a heat conductive coupler
07/25/2000US6094112 Surface mount filter device
07/25/2000US6094056 Multi-chip module with accessible test pads and test fixture
07/25/2000US6093997 Embedded piezoelectric resonator
07/25/2000US6093894 Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer
07/25/2000US6093787 Liquid crystalline polyesters and molding compositions prepared therefrom
07/25/2000US6093499 Copper alloy foils
07/25/2000US6093477 Laminated substrates and data input unit using the same
07/25/2000US6093476 Wiring substrate having vias
07/25/2000US6093443 Process for producing a ceramic-metal substrate
07/25/2000US6093038 Movable connector board for computer
07/20/2000WO2000042829A1 Article having a circuit soldered with parts and method for recycling wastes of the same
07/20/2000WO2000042679A2 A printed circuit board
07/20/2000WO2000042649A1 Test device of semiconductor integrated circuit
07/20/2000WO2000042517A1 Device for connecting a bus system to a computing unit, a plug-in card for a pcmcia-standard type interface and an adapter for a device of this type
07/20/2000WO2000042491A1 Usb-compliant personal key with integral input and output devices
07/20/2000WO2000042442A1 Apparatus for testing the pattern of pcb and method thereof
07/20/2000WO2000042114A1 Luminescent electroconductive adhesive
07/20/2000WO2000041884A1 Composite film
07/20/2000WO2000017840A3 Display and backlighting assembly
07/20/2000DE19901885A1 Circuit board for electronic components has full conducting coating on one/both sides with or without photo-lacquer coating, and conventional matrix or other arrangement of through openings
07/20/2000DE19901483A1 Arrangement for controlling functional furniture functions especially for sitting/lying furniture, has carrier element with connections for replaceable control modules to which electrical unit can be connected
07/20/2000DE19900912A1 Board, for electronic circuit board manufacture, comprises a pre-stamped board having holes filled with a soft filler or having an applied thin substrate to eliminate the need for drilling
07/19/2000EP1020988A1 Voltage regulating device
07/19/2000EP1020914A2 Ceramic substrate used for fabricating electric or electronic circuit
07/19/2000EP1020909A2 Thick-film hybrid circuit on a metal circuit board and method therefor
07/19/2000EP1020547A1 Wholly aromatic synthetic fiber produced by liquid-crystal spinning, process for producing the same, and use thereof
07/19/2000EP1019986A1 Wiring board constructions and methods of making same