| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/27/2000 | DE19832062A1 Mounting for control circuit chip in motor vehicle |
| 01/27/2000 | DE19803692A1 Verfahren zum Verwerten von Altplatinen und mit diesem hergestellte Verbundplatte Method for utilizing Altplatinen and with this manufactured composite board |
| 01/26/2000 | EP0975055A1 Card edge connector |
| 01/26/2000 | EP0975019A2 Chip mounting board and method of measuring it |
| 01/26/2000 | EP0974558A2 Electrically conductive paste and glass substrate having a circuit thereon |
| 01/26/2000 | EP0974249A1 Process for producing printed circuits and printed circuits thus obtained |
| 01/26/2000 | EP0974029A1 Lighting apparatus |
| 01/26/2000 | EP0973828A1 Thermoplastic molding materials |
| 01/26/2000 | EP0901744A4 Electronic card with shield cover having tabs where each tab engages with recess of corresponding shield cover |
| 01/26/2000 | CN1242926A Improvements in or relating to thermal trip arrangements |
| 01/26/2000 | CN1242684A Multilayer printed wiring board and method for mfg. same |
| 01/26/2000 | CN1242630A Card edge connector |
| 01/26/2000 | CN1242603A Wiring board for bump bonding, semiconductor device assembled from wiring board and mfg. method of wiring board for bump bonding |
| 01/26/2000 | CN1242602A Wafer-scale package structure and circuit board used therein |
| 01/26/2000 | CN1048824C Chip carrier and method for producing same,and use thereof |
| 01/25/2000 | US6018465 Apparatus for mounting a chip package to a chassis of a computer |
| 01/25/2000 | US6018463 Large non-hermetic multichip module package |
| 01/25/2000 | US6018462 Multi-tip module |
| 01/25/2000 | US6018448 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 01/25/2000 | US6018197 Wired board with improved bonding pads |
| 01/25/2000 | US6018193 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
| 01/25/2000 | US6018191 Semiconductor device |
| 01/25/2000 | US6017971 A thermoplastic resin blends comprising aluminum borate or amorphous silica; use for electrodeposit coating electric or electronic parts such as printed circuit boards, wiring circuit boards, connectors, housing, and insulators |
| 01/25/2000 | US6017696 Controlling nucleic acid hybridization by connecting multiple electrical sources to several location where a plurality of nucleic acids with target nucleic acids are attached, apply a negative potential, removing non specific nucleic acid |
| 01/25/2000 | US6017634 Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
| 01/25/2000 | US6017584 Encapsulated displays are disclosed; particles encapsulated therein are dispersed within a suspending or electrophoretic fluid |
| 01/25/2000 | US6017410 Method to anchor foils for green-tape circuits |
| 01/25/2000 | US6017246 Printed wiring board |
| 01/25/2000 | US6017222 Electrical connector assembly for connecting flexible connecting strips of a film circuitry and a main circuit board |
| 01/25/2000 | US6016947 Non-destructive low melt test for off-composition solder |
| 01/25/2000 | CA2161569C Circuit element mounting structure |
| 01/20/2000 | WO2000003575A1 Yarn treatment system |
| 01/20/2000 | WO2000003572A1 Printed wiring board and method for producing the same |
| 01/20/2000 | WO2000003571A1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
| 01/20/2000 | WO2000003569A1 Interconnect assembly for printed circuit boards and method of fabrication |
| 01/20/2000 | WO2000003567A1 A thermal management device and method of making such a device |
| 01/20/2000 | WO2000003436A2 Low cost high power hermetic package with electrical feed-through bushings |
| 01/20/2000 | WO2000003354A1 Noncontact ic card and manufacture thereof |
| 01/20/2000 | WO2000003305A1 A method for making a printed wiring board with heavy and thin conductive traces |
| 01/20/2000 | WO1999036959A9 High-density computer modules with stacked parallel-plane packaging |
| 01/20/2000 | DE19857256A1 IC (integrated circuit) socket for IC with multiple parallel pins |
| 01/20/2000 | DE19821174C1 Continuous hot lamination of solid photoresists onto metal-lined, thermoplastic, flexible printed circuit materials |
| 01/19/2000 | EP0973363A1 A conductor |
| 01/19/2000 | EP0973197A2 Wafer-scale package structure and circuit board used therein |
| 01/19/2000 | EP0973108A2 Field programmable printed circuit board |
| 01/19/2000 | EP0973098A1 High density connector system |
| 01/19/2000 | EP0972805A2 Polyimide-based composite, electronic parts using the composite, and polyimide-based aqueous dispersion |
| 01/19/2000 | EP0972432A1 Method of arranging signal and destination pads to provide multiple signal/designation connection combinations |
| 01/19/2000 | EP0972405A1 Computer system and process for capture, editing and playback of motion video compressed using interframe and intraframe techniques |
| 01/19/2000 | EP0972321A1 Contact arrangement |
| 01/19/2000 | EP0972318A1 Electrical connection between a circuit support and a strip conductor support |
| 01/19/2000 | EP0972303A1 Low dielectric constant material with improved dielectric strength |
| 01/19/2000 | EP0912335A4 Conductive elastomers and methods for fabricating the same |
| 01/19/2000 | EP0835536B1 Filtered electrical connector |
| 01/19/2000 | CN1242138A A method and a device for shielding of electronic components on a circuit board |
| 01/19/2000 | CN1242137A Multilayered printed wiring board |
| 01/19/2000 | CN1241894A Circuit board and its producing method |
| 01/19/2000 | CN1241792A Sheet shape inducer |
| 01/19/2000 | CN1241586A Non hygroscopic thermally stable aluminium hydroxide |
| 01/19/2000 | CN1048446C A method of manufacturing a composite laminate comprising unidirectional reinforcing fibres for use in printed wire boards |
| 01/18/2000 | US6016253 Electronic module |
| 01/18/2000 | US6016251 Printed circuit board and cooling system therefor |
| 01/18/2000 | US6016089 Printed circuit with resilient contacts providing a ground path for common-mode filtration capacitors |
| 01/18/2000 | US6016087 Coupled microstrip lines |
| 01/18/2000 | US6016084 Method for connecting printed circuit board with housing, and electronic instrument having connection structure according to the connecting method |
| 01/18/2000 | US6016083 Electronic circuit apparatus for suppressing electromagnetic radiation |
| 01/18/2000 | US6016005 Multilayer, high density micro circuit module and method of manufacturing same |
| 01/18/2000 | US6015872 Substrate for printed circuit board |
| 01/18/2000 | US6015607 Flexible laminates and method of making the laminates |
| 01/18/2000 | US6015520 Method for filling holes in printed wiring boards |
| 01/18/2000 | US6015300 Electronic interconnection method and apparatus for minimizing propagation delays |
| 01/18/2000 | US6015299 Card edge connector with symmetrical board contacts |
| 01/18/2000 | US6015249 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards |
| 01/18/2000 | US6014934 Modular model train circuit board arrangement |
| 01/18/2000 | US6014805 Method of fabricating a hybrid printed circuit board |
| 01/13/2000 | WO2000002430A1 Molded housing with integral heatsink |
| 01/13/2000 | WO2000002425A1 A device and method for mounting electronic components on printed circuit boards |
| 01/13/2000 | WO2000002246A1 Double-sided electronic device |
| 01/13/2000 | WO2000002245A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 01/13/2000 | WO2000002244A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 01/13/2000 | WO2000002243A1 Semiconductor device, method of manufacture, circuit board, and electronic device |
| 01/13/2000 | WO2000002160A1 Open-worked antenna for integrated circuit card, and integrated circuit card comprising same |
| 01/13/2000 | WO2000002088A1 Integral thin-film metal resistor with improved tolerance and simplified processing |
| 01/13/2000 | WO1999060827A3 Method for the packing of components, a card module and its cooling system |
| 01/13/2000 | DE19930197A1 Herstellungsverfahren für einen Padabschnitt einer LCD-Vorrichtung und Aufbau einer diesen Padabschnitt aufweisenden LCD-Vorrichtung Production method of a pad portion of an LCD device structure and a pad portion having this LCD device |
| 01/13/2000 | DE19848474C1 Ceramic articles, especially electronic ceramic multilayer hybrids, are produced from green bodies containing organic materials |
| 01/13/2000 | DE19830576A1 Fadenbearbeitungssystem Yarn processing system |
| 01/12/2000 | EP0971570A1 Printed wiring board and its manufacturing method |
| 01/12/2000 | EP0971569A1 Enhanced mounting pads for printed circuit boards |
| 01/12/2000 | EP0971568A2 Electronic component |
| 01/12/2000 | EP0971474A1 Motor boot for a circuit board |
| 01/12/2000 | EP0971443A2 Electrical connector system for shielded flat flexible circuitry |
| 01/12/2000 | EP0971411A2 Semiconductor device |
| 01/12/2000 | EP0971370A1 Cable and method of manufacturing it |
| 01/12/2000 | EP0970594A1 Moulded sockets for electronic component attachment |
| 01/12/2000 | EP0970522A1 Bga connector with heat activated connection and disconnection means |
| 01/12/2000 | EP0970495A2 Flat electrolytic capacitor |
| 01/12/2000 | EP0970480A1 Vertically interconnected electronic assemblies and compositions useful therefor |
| 01/12/2000 | CN1241353A System and method for packaging integrated circuits |
| 01/12/2000 | CN1241285A Method of mfg. plurality of electronic components |