| Patents for H05K 1 - Printed circuits (98,583) |
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| 08/17/2000 | WO2000047660A2 Electrically conductive flexible composition, methods of making same |
| 08/17/2000 | WO2000047655A1 Microwave-transparent thermosetting resin compositions, electrical laminates obtained therefrom, and process of producing these |
| 08/17/2000 | WO2000047399A1 Multilayer ceramic circuit boards with embedded resistors |
| 08/17/2000 | WO2000015547A9 Metal-carbon composite powders, methods for producing powders and devices fabricated from same |
| 08/17/2000 | WO2000012613A9 Flame retardant polymer blends, and method for making |
| 08/17/2000 | WO2000008898A3 High frequency heating apparatus |
| 08/17/2000 | DE19963961A1 Electric connector for flexible circuit board on printed circuit board in small sized electronic apparatus e.g. camcorder, has earthing terminal whose upper surface is made to correspond to surface mount portions |
| 08/17/2000 | DE19905886A1 Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements Identification element and method for producing an identification element |
| 08/17/2000 | CA2362609A1 Microwave-transparent thermosetting resin compositions, electrical laminates obtained therefrom, and process of producing these |
| 08/17/2000 | CA2362151A1 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board |
| 08/16/2000 | EP1028608A2 Process and coating composition for applying heat-sink paste to circuit boards |
| 08/16/2000 | EP1028607A1 Printed circuit board material and method of manufacturing board material and intermediate block body for board material |
| 08/16/2000 | EP1028483A1 Printed circuit with a conductive pattern for radio communication equipment and method for manufacturing such circuits |
| 08/16/2000 | EP1028388A2 Identification element and method of manufacturing an identification element |
| 08/16/2000 | EP1028354A1 Positive photosensitive resin composition, method of forming relief pattern, and electronic part |
| 08/16/2000 | EP1027753A1 Edge interface electrical connectors |
| 08/16/2000 | EP0929428B1 Valve control device with tridimensional printed board in mid technology |
| 08/16/2000 | EP0888209A4 Electrical system having a multilayer conductive composition |
| 08/16/2000 | EP0790800B1 Low noise optical sensor |
| 08/16/2000 | CN1263692A Method of producing ceramic multilayer substrate |
| 08/16/2000 | CN1263691A A device and method in electronics systems |
| 08/16/2000 | CN1263690A Pressure-bonded substrate, liquid crystal device, and electronic device |
| 08/16/2000 | CN1263689A Pressure-bonded substrate, liquid crystal device, and electronic device |
| 08/16/2000 | CN1263631A Method and apparatus for producing multilayer body for electronic component |
| 08/16/2000 | CN1263346A Flexible printed circuit board mounting structure and recording reproducing device adopting said structure |
| 08/16/2000 | CN1263280A Connection wiring base board of electro-optical board, electro-optical device and electronic device |
| 08/16/2000 | CN1055572C Assembly of shielded connectors and board having plated holes |
| 08/16/2000 | CN1055434C Single side copper-clad laminate |
| 08/15/2000 | US6104620 Shielded radio card assembly |
| 08/15/2000 | US6104618 Structure for connecting a plurality of mutually remote electrical components to a central unit |
| 08/15/2000 | US6104613 VME eurocard double printed wiring card host circuit card circuit (module) assembly |
| 08/15/2000 | US6104464 Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board |
| 08/15/2000 | US6104280 Method of manufacturing and testing an electronic device, and an electronic device |
| 08/15/2000 | US6104258 System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus |
| 08/15/2000 | US6104095 Printed circuit board and chip-on-board packages using same |
| 08/15/2000 | US6104088 Complementary wiring package and method for mounting a semi-conductive IC package in a high-density board |
| 08/15/2000 | US6104087 Microelectronic assemblies with multiple leads |
| 08/15/2000 | US6103978 Printed wiring board having inner test-layer for improved test probing |
| 08/15/2000 | US6103836 Comprising an epoxy resin and a polymer obtained by reacting a polycarbodiimide with a compound having in the molecule at least one group reactive with carbodiimide group, selected from amide and phenolic hydroxy groups |
| 08/15/2000 | US6103393 High purity; controlled crystallinity; small average particle size; narrow particle size distribution; spherical particle morphology; controlled surface chemistry, and surface are; useful in electrocatalyst applications |
| 08/15/2000 | US6103392 Tungsten-copper composite powder comprising individual particles having a tungsten phase and a copper phase wherein the tungsten phase encapsulates the copper phase; useful for forming a copper-tungsten pseudoalloy |
| 08/15/2000 | US6103146 Screen printable thick film with boride substrates |
| 08/15/2000 | US6103134 Circuit board features with reduced parasitic capacitance and method therefor |
| 08/15/2000 | US6102747 Modular connectors |
| 08/15/2000 | US6102742 Electrical connector having variable resistance contacts |
| 08/15/2000 | US6102734 Electrical connector |
| 08/15/2000 | US6102710 Controlled impedance interposer substrate and method of making |
| 08/15/2000 | US6101710 Method for facilitating engineering changes in a multiple level circuit package |
| 08/15/2000 | CA2064808C Liquid crystal polymer film |
| 08/10/2000 | WO2000047027A1 Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on a printed circuit and implementing device |
| 08/10/2000 | WO2000047026A1 An arrangement relating to conductor carriers and methods for the manufacture of such carriers |
| 08/10/2000 | WO2000047025A2 Method for forming printed circuit board electrical interconnects |
| 08/10/2000 | WO2000046984A1 Modular structure of a smart camera for image signal processing |
| 08/10/2000 | WO2000046837A2 Improved circuit board manufacturing process |
| 08/10/2000 | WO2000046816A1 Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same |
| 08/10/2000 | WO2000046730A1 Registration control during workpiece processing |
| 08/10/2000 | WO2000046608A1 Multi-layered electronic parts |
| 08/10/2000 | WO2000045674A1 Fabric-based, adhesively mounted printed circuit for upholstered seats and the like |
| 08/10/2000 | WO1999064657A3 Fabric or garment with integrated flexible information infrastructure |
| 08/09/2000 | EP1026930A1 Circuit board side interconnect |
| 08/09/2000 | EP1026929A2 Elemental piece of flexible printed wiring board and flexible printed wiring board |
| 08/09/2000 | EP1026928A2 Bond pads for fine-pitch applications on air bridge circuit boards |
| 08/09/2000 | EP1026927A2 Special bond pad configurations for printed circuit boards |
| 08/09/2000 | EP1026794A2 Electrical slip ring having a higher circuit density |
| 08/09/2000 | EP1026742A2 Solder ball grid array for connecting multiple millimeter wave assemblies |
| 08/09/2000 | EP1026707A1 Wire wound inductor |
| 08/09/2000 | EP1025989A1 Composite film |
| 08/09/2000 | EP1025749A1 Multi-layer circuit board |
| 08/09/2000 | EP1025747A1 Printed circuit boards |
| 08/09/2000 | EP1025587A1 Semiconductor flip-chip package and method for the fabrication thereof |
| 08/09/2000 | EP0686093B1 Metal on plastic films with adhesion-promoting layer |
| 08/09/2000 | CN1262859A Printed wiring board and method for manufacturing same |
| 08/09/2000 | CN1262800A IC socket |
| 08/09/2000 | CN1262596A Method for making multi-layer circuit board by substrate with open |
| 08/09/2000 | CN1262492A Conductive paste and its solidifying method, information receiver-transmitter and antenna forming method |
| 08/09/2000 | CN1262335A Rolled copper foil for flexible PCB and its manufacturing method |
| 08/09/2000 | CN1055370C Semiconductor unit heat discharging device |
| 08/08/2000 | US6101253 Ultra-slim telephone set |
| 08/08/2000 | US6101099 Method and device for connecting electrical components to printed circuit boards |
| 08/08/2000 | US6101094 Printed circuit board with integrated cooling mechanism |
| 08/08/2000 | US6101089 Electronic apparatus |
| 08/08/2000 | US6100787 Multilayer ceramic package with low-variance embedded resistors |
| 08/08/2000 | US6100750 Frequency-independent voltage divider |
| 08/08/2000 | US6100626 System for connecting a transducer array to a coaxial cable in an ultrasound probe |
| 08/08/2000 | US6100606 High frequency switching device |
| 08/08/2000 | US6100596 Connectorized substrate and method of connectorizing a substrate |
| 08/08/2000 | US6100582 Circuit substrate, circuit-formed suspension substrate, and production method thereof |
| 08/08/2000 | US6100580 Semiconductor device having all outer leads extending from one side of a resin member |
| 08/08/2000 | US6100475 Solder bonding printed circuit boards |
| 08/08/2000 | US6100345 Containing polystyrene and polyphenylene oxide, wherein at least one has an acid group and the acid group is neutralized with a basic metal compound containing a metal element of the group 2b, 3b, 4b or 5b of the periodic table; heat resistance |
| 08/08/2000 | US6100178 Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same |
| 08/08/2000 | US6100115 Semiconductor device |
| 08/08/2000 | US6099745 Rigid/flex printed circuit board and manufacturing method therefor |
| 08/08/2000 | US6099677 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 08/08/2000 | US6099324 Electrical motor unit having a control module |
| 08/08/2000 | US6098861 Breaking apparatus for ceramic board |
| 08/08/2000 | US6098283 Method for filling vias in organic, multi-layer packages |
| 08/08/2000 | US6098282 Laminar stackable circuit board structure with capacitor |
| 08/08/2000 | US6098280 Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes |
| 08/03/2000 | WO2000050909A1 Testing fastenings of printed circuit board |