| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/05/2000 | US6113400 Modular plug having compensating insert |
| 09/05/2000 | US6113260 Configurable interface module |
| 09/03/2000 | CA2299837A1 Electrical component for surface-mounting on a circuit board |
| 08/31/2000 | WO2000051232A1 Filter structures for integrated circuit interfaces |
| 08/31/2000 | WO2000051141A1 Bus bar assembly |
| 08/31/2000 | WO2000051099A1 Display panel |
| 08/31/2000 | WO2000051075A1 Ic card and terminal plate for ic card |
| 08/31/2000 | WO2000050946A1 Printed circuit board for electrical and optical signals and method for producing the same |
| 08/31/2000 | WO2000050809A1 Compact, flexible, led array |
| 08/31/2000 | WO2000050263A1 Control apparatus for an automobile |
| 08/31/2000 | WO2000050230A1 Board with nickel-plated thru-holes and/or blind vias |
| 08/31/2000 | WO2000026942A3 Method for producing filled vias in electronic components |
| 08/31/2000 | DE19962422A1 Multilayer printed circuit board manufacturing method involves electro plating metal layer and etching it after which ink layer and sheet portion between slots are removed |
| 08/31/2000 | DE19908366A1 Method for marking and testing thermally produced connections, particularly soldered connections by means of optical surface test involves using UV fluorescing markings applied to object surface |
| 08/31/2000 | DE19906209A1 Cutting out individual circuit units from panel, using high speed milling of e.g. 1000 m per min |
| 08/31/2000 | DE10003011A1 Negative-type light-sensitive resin composition for manufacture of circuit boards, semiconductor chip carriers and semiconductor devices, contains cis-diene substituted polyamic acid or polyimide and oxygen sensitizer |
| 08/30/2000 | EP1032249A1 Electronic circuit board and soldering method therefor |
| 08/30/2000 | EP1032079A1 Conductive elastomer interconnect |
| 08/30/2000 | EP1032042A2 Semiconductor module, power converter using the same and manufacturing method thereof |
| 08/30/2000 | EP1032038A2 Conductive and resitive material with electrical stability for use in electronics devices |
| 08/30/2000 | EP1031938A2 Integrated surface-mount pointing device |
| 08/30/2000 | EP1013015A4 Reconfigurable node for a communications network |
| 08/30/2000 | EP0602252B1 Ceramic green sheet |
| 08/30/2000 | CN1265262A System and method for packaging integrated circuits |
| 08/30/2000 | CN1264930A High frequency circuit appts. antenna shared device and communication appts. |
| 08/30/2000 | CN1264924A Memory assembly and its making method |
| 08/30/2000 | CN1264905A Method for prodn. of laminated ceramic electronic components |
| 08/29/2000 | US6112034 Flexible printed circuit board |
| 08/29/2000 | US6111759 Display with an array of electromagnetically operable elements |
| 08/29/2000 | US6111757 SIMM/DIMM memory module |
| 08/29/2000 | US6111753 Voltage regulator module |
| 08/29/2000 | US6111629 Display device |
| 08/29/2000 | US6111628 Liquid crystal display device including plural bump electrodes |
| 08/29/2000 | US6111620 Active matrix substrate |
| 08/29/2000 | US6111544 Chip antenna, antenna device, and mobile communication apparatus |
| 08/29/2000 | US6111479 Laminate printed circuit board with a magnetic layer |
| 08/29/2000 | US6111378 Window wiper motor system for an automotive vehicle |
| 08/29/2000 | US6111321 Ball limiting metalization process for interconnection |
| 08/29/2000 | US6111205 Via pad geometry supporting uniform transmission line structures |
| 08/29/2000 | US6111204 Bond pads for fine-pitch applications on air bridge circuit boards |
| 08/29/2000 | US6111005 For bonding high density, microcircuit electronic components to substrates |
| 08/29/2000 | US6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method |
| 08/29/2000 | US6110755 Method for manufacturing semiconductor device |
| 08/29/2000 | US6110650 Method of making a circuitized substrate |
| 08/29/2000 | US6110596 Silicon nitride ceramic circuit substrate and semiconductor device using the same |
| 08/29/2000 | US6110576 Article comprising molded circuit |
| 08/29/2000 | US6110569 Conductive paste and non-reciprocal device using the same |
| 08/29/2000 | US6110568 Thin film circuit substrate and process for the manufacture thereof |
| 08/29/2000 | US6110563 Method and arrangement for electromagnetically shielding an electronic means |
| 08/29/2000 | US6110399 Electroconductive solder particles dispersed in ferrofluid; magnetic field fixes pattern |
| 08/29/2000 | US6109939 Memory card and receptacle for same |
| 08/29/2000 | US6109934 Connector for connecting an electronic device to a communications card |
| 08/29/2000 | US6109929 High speed stackable memory system and device |
| 08/29/2000 | US6109840 Method and device for aligning a workpiece on a machine tool table |
| 08/29/2000 | US6109323 Device to withdraw, superimpose and anchor foils for green-tape circuits |
| 08/24/2000 | WO2000049841A1 Electrical connection method and connection site |
| 08/24/2000 | WO2000049655A1 Semiconductor device, circuit board, method of manufacturing circuit board, and electronic device |
| 08/24/2000 | WO2000049070A1 Prepreg, metal-clad laminate, and printed circuit board obtained from these |
| 08/24/2000 | WO2000049061A1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 08/24/2000 | WO1999039554A3 Embedded energy storage device |
| 08/24/2000 | WO1998041072A3 A power supply unit for a plug-in unit of a communications apparatus and a communications equipment using a plurality of such plug-in units |
| 08/24/2000 | DE19909247A1 Theft copying protection for e.g. CDs, diskettes, software, hardware and computer games areas involves combining circuit board with plug positions and chip with defined data to form unit |
| 08/24/2000 | DE19904363A1 Interference suppression circuit for integrated circuit |
| 08/24/2000 | DE19904327A1 Placing components on circuit boards involves generating marker in image of part of circuit board for alignment of component being moved in image with respect to marker |
| 08/24/2000 | DE10007263A1 Arrangement for attaching conducting track planes to mounting plate, has relief structured plate surface with openings for conducting strips, and recesses for fixing straps on conducting strips |
| 08/23/2000 | EP1030543A1 Non-woven fabric material and prepreg, and circuit board using the same |
| 08/23/2000 | EP1030381A1 Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
| 08/23/2000 | EP1030366A2 Printed wiring board for semiconductor plastic package |
| 08/23/2000 | EP1030365A1 Package substrate |
| 08/23/2000 | EP1029829A1 Photosensitive insulating paste and thick film multi-layer circuit substrate |
| 08/23/2000 | EP1029431A1 Via pad geometry supporting uniform transmission line structures |
| 08/23/2000 | EP1029428A1 Electronic interconnection method and apparatus for minimizing propagation delays |
| 08/23/2000 | EP1028907A1 Pneumatic product vending system and loader |
| 08/23/2000 | EP1018290A4 A system and method for packaging integrated circuits |
| 08/23/2000 | CN2393304Y Connection printed circuit board |
| 08/23/2000 | CN1264480A Method for making contactless smart card |
| 08/23/2000 | CN1264447A Aramid papers of improved solvent resistance and dimensionally stable laminates made therefrom |
| 08/23/2000 | CN1264271A Method for manufacturing double-side flexible printed circuit board |
| 08/23/2000 | CN1264270A Flexible wiring base and making method thereof |
| 08/23/2000 | CN1264131A Photosensitive insulation paste and thick film multilayer circuit substrate |
| 08/23/2000 | CN1264130A Photosensitive insulation paste and thick film multilayer circuit substrate |
| 08/23/2000 | CN1264108A Method for manufacture suspension device for magnetic head |
| 08/23/2000 | CN1263910A Polyamide composition |
| 08/22/2000 | US6108228 Quad in-line memory module |
| 08/22/2000 | US6108212 Surface-mount device package having an integral passive component |
| 08/22/2000 | US6108211 Electrical contact system |
| 08/22/2000 | US6108205 Means and method for mounting electronics |
| 08/22/2000 | US6108197 Flexible wearable computer |
| 08/22/2000 | US6108192 Dielectric ceramic composition and ceramic electronic parts using the same |
| 08/22/2000 | US6107907 High current ferrite electromagnetic interference supressor and associated method |
| 08/22/2000 | US6107877 Predistortion generator coupled with an RF amplifier |
| 08/22/2000 | US6107578 Printed circuit board having overlapping conductors for crosstalk compensation |
| 08/22/2000 | US6107577 Flat surface-mounted multi-purpose wire |
| 08/22/2000 | US6107109 Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate |
| 08/22/2000 | US6106923 Venting hole designs for multilayer conductor-dielectric structures |
| 08/22/2000 | US6106891 Applying a curable fill to an aperture, peeling a layer of polymer, applying heat and pressure |
| 08/17/2000 | WO2000048267A1 A method and a device for manufacturing a roll of items |
| 08/17/2000 | WO2000048243A1 Flexible printed-circuit substrate, film carrier, semiconductor device on tape, semiconductor device, method of semiconductor manufacture, circuit susbstrate, and electronic device |
| 08/17/2000 | WO2000048012A1 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board |
| 08/17/2000 | WO2000047676A1 Novolak cyanate blends |