| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/23/1990 | CA1264836A1 Detector buffer board |
| 01/23/1990 | CA1264546A1 Method and an installation for the manufacture of a display comprising light-emitting diodes |
| 01/16/1990 | US4894751 Printed circuit board for electronics |
| 01/16/1990 | US4894706 Three-dimensional packaging of semiconductor device chips |
| 01/16/1990 | US4893901 Electro-optical assembly |
| 01/16/1990 | US4893403 Chip alignment method |
| 01/11/1990 | WO1990000117A1 Ic memory card |
| 01/10/1990 | EP0350015A2 Power MOSFET with a temperature sensor |
| 01/10/1990 | EP0350011A2 Hermetic hybrid film circuit assembly with unpackaged active components and process for its fabrication |
| 01/10/1990 | CN1006440B Hybrid and multi-layer circuit |
| 01/09/1990 | US4893223 Illumination devices for inspection systems |
| 01/09/1990 | US4893174 High density integration of semiconductor circuit |
| 01/03/1990 | EP0348972A2 A semiconductor device and a process for manufacturing thereof |
| 01/03/1990 | CN1038552A Rotating rectifier assembly |
| 01/02/1990 | US4891688 Very high-acceleration tolerant circuit card packaging structure |
| 01/02/1990 | US4891074 Mixing band gap adjustment elements |
| 01/02/1990 | US4890383 Method for producing displays and modular components |
| 12/28/1989 | DE3918767A1 Gleichrichterbruecke fuer wechselstromerzeuger von kraftfahrzeugen Rectifier for AC generators of motor vehicles |
| 12/14/1989 | EP0313597A4 Hot melt ink supply system. |
| 12/14/1989 | DE3916980A1 Mit kunststoff umhuellte, integrierte multichip-hybridschaltung With plastic sheathed, integrated multi-chip hybrid circuit |
| 12/13/1989 | EP0345972A1 Quantum-well radiation detector |
| 12/06/1989 | EP0345067A2 Rotating rectifier assembly |
| 12/06/1989 | EP0344702A2 Electric circuit apparatus |
| 12/06/1989 | EP0344259A1 Method and means of fabricating a semiconductor device package |
| 12/05/1989 | US4885629 Semiconductor apparatus |
| 12/05/1989 | CA1263701A1 Power interface circuit with control chip powered from power chip |
| 11/30/1989 | WO1989011734A1 Manufacture of diodes |
| 11/29/1989 | EP0343379A2 Thin film package for mixed bonding of a chip |
| 11/29/1989 | EP0238651B1 Magnetically sealed multichip integrated circuit package |
| 11/28/1989 | US4884237 Stacked double density memory module using industry standard memory chips |
| 11/28/1989 | US4884126 Semiconductor device having parallel-connected, self turn-off type semiconductor elements |
| 11/28/1989 | US4884125 Hybrid integrated circuit device capable of being inserted into socket |
| 11/14/1989 | US4881117 Semiconductor power device formed of a multiplicity of identical parallel-connected elements |
| 11/08/1989 | EP0340527A2 Improved semiconductor device packaging structures |
| 11/08/1989 | EP0340492A2 Conformal sealing and interplanar encapsulation of electronic device structures |
| 11/08/1989 | EP0340466A2 Semiconductor device comprising leads |
| 11/08/1989 | EP0340241A1 High density electronic package comprising stacked sub-modules. |
| 11/01/1989 | CN1005673B Component for three-phase bridge conversion circuit |
| 10/31/1989 | US4878106 Semiconductor circuit packages for use in high power applications and method of making the same |
| 10/31/1989 | US4877752 3-D packaging of focal plane assemblies |
| 10/25/1989 | EP0338706A2 A carrier assembly and a process for producing a carrier assembly for a semi-conductor package |
| 10/19/1989 | DE3811313A1 Housing for hybrid circuits |
| 10/17/1989 | US4875139 Building block LSI |
| 10/10/1989 | US4873615 Semiconductor chip carrier system |
| 09/28/1989 | DE3808619A1 Anordnung zum loesbaren befestigen von module auf einem modultraeger Arrangement for releasably securing of modules on a modultraeger |
| 09/27/1989 | EP0334747A1 Device for interconnecting and protecting a bare chip of a high frequency component |
| 09/27/1989 | EP0334111A1 Method for the integrated series connection of thick film solar cells, and use of the method in the production of a tandem solar cell |
| 09/27/1989 | EP0333803A1 Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds |
| 09/26/1989 | US4870224 Integrated circuit package for surface mount technology |
| 09/21/1989 | WO1989008927A1 Assembly process for producing led rows |
| 09/21/1989 | WO1989008893A1 Arrangement for detachable fastening modules to a module support |
| 09/19/1989 | US4868712 Three dimensional integrated circuit package |
| 09/12/1989 | US4866508 Integrated circuit packaging configuration for rapid customized design and unique test capability |
| 09/12/1989 | US4865245 Etching |
| 09/08/1989 | WO1989008374A1 Substrate for mounting optical parts and electric circuitry parts and method of producing the same |
| 09/06/1989 | EP0331338A2 Subassemblies for optoelectronic hybrid integrated circuits |
| 09/05/1989 | US4864385 Power semiconductors connected antiparallel via heatsinks |
| 08/30/1989 | EP0330372A2 Hybrid ic with heat sink |
| 08/30/1989 | EP0329722A1 Rectifier device |
| 08/29/1989 | US4862344 3-phase bridge converting circuit module |
| 08/29/1989 | US4862322 Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween |
| 08/29/1989 | US4862249 Packaging system for stacking integrated circuits |
| 08/29/1989 | US4862239 Power semiconductor component |
| 08/24/1989 | WO1989007779A1 Method of fastening cylindrical optical parts and electric parts |
| 08/23/1989 | EP0328815A2 Method for packaging a microwave tube modulator |
| 08/16/1989 | EP0168491B1 Rotating rectifier assembly |
| 08/15/1989 | US4858072 Interconnection system for integrated circuit chips |
| 08/15/1989 | US4858064 Thick-film high frequency signal circuit apparatus with feedthrough capacitor |
| 08/15/1989 | US4857801 Dense LED matrix for high resolution full color video |
| 08/10/1989 | WO1989007382A1 Three-dimensional circuit component assembly and method corresponding thereto |
| 08/08/1989 | US4855867 Full panel electronic packaging structure |
| 08/08/1989 | US4855809 Orthogonal chip mount system module and method |
| 08/03/1989 | DE3835454A1 Rectifier unit |
| 08/01/1989 | US4853762 Semi-conductor modules |
| 07/27/1989 | WO1989006895A1 Very high-acceleration tolerant circuit card packaging structure |
| 07/27/1989 | DE3903346A1 Arrangement having two parallel-connected transistors |
| 07/26/1989 | EP0325068A1 Modular hybrid microelectronic structure with high integration density |
| 07/25/1989 | US4851824 Light emitting diode display panel |
| 07/19/1989 | EP0324555A2 Substrate for hybrid IC, hybrid IC using the substrate and its application |
| 07/18/1989 | US4849803 Molded resin semiconductor device |
| 07/18/1989 | US4847986 Method of making square toroid transformer for hybrid integrated circuit |
| 07/13/1989 | DE3743774A1 Stackable semiconductor components |
| 07/11/1989 | US4847732 Wafer and method of making same |
| 07/11/1989 | US4847669 Tandem photoelectric conversion device |
| 07/11/1989 | CA1257402A1 Multiple chip interconnection system and package |
| 07/06/1989 | DE3743773A1 Three-dimensionally arranged IMPATT diodes |
| 07/04/1989 | US4845545 Low profile semiconductor package |
| 07/04/1989 | US4845542 Interconnect for layered integrated circuit assembly |
| 07/04/1989 | US4845405 Monolithic LED display |
| 06/28/1989 | EP0321899A1 Method and cooling device for an integrated-circuit housing |
| 06/27/1989 | US4843280 A modular surface mount component for an electrical device or led's |
| 06/27/1989 | US4843188 Integrated circuit chip mounting and packaging assembly |
| 06/27/1989 | CA1256589A1 Hermetic high frequency surface mount microelectronic package |
| 06/20/1989 | US4841355 Three-dimensional microelectronic package for semiconductor chips |
| 06/20/1989 | US4841258 Method for packaging a microwave tube modulator |
| 06/20/1989 | US4841182 Rectifier in alternating generators for automotive vehicles |
| 06/20/1989 | US4841170 Temperature controlled hybrid assembly |
| 06/15/1989 | WO1989005524A1 Planar led illuminant |
| 06/14/1989 | EP0319907A2 Light emitting diode array chip and method of fabricating the same |
| 06/13/1989 | US4839775 Thick-film circuit arrangement having a ceramic substrate plate |