| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 10/06/1988 | DE3809237A1 Entkopplungskondensator fuer schaltungspackungen mit oberflaechenmontierten kontaktstiftlosen chiptraegern, oberflaechenmontierten chiptraegern mit kontaktstiften und fuer schaltungspackungen mit kontaktstiftraster Decoupling capacitor for circuit packs with oberflaechenmontierten contact pinless chiptraegern, chiptraegern oberflaechenmontierten with contactless donate and for circuit packs with per-pin grid |
| 10/05/1988 | EP0285277A1 Chip carrier with energy storage means |
| 10/05/1988 | EP0284624A1 Method of forming a multichip integrated circuit package. |
| 10/04/1988 | CA1242810A1 Surface mounted circuits including hybrid circuits, having cvd interconnects, and method of preparing the circuits |
| 09/28/1988 | EP0283515A1 Integrated circuit packaging configuration for rapid customized design and unique test capability |
| 09/28/1988 | EP0283510A1 Low-temperature monolithic chip |
| 09/27/1988 | US4774632 Hybrid integrated circuit chip package |
| 09/27/1988 | US4774558 Thermally-activated, shorting diode switch having non-operationally-alterable junction path |
| 09/27/1988 | US4773868 Apparatus for use with stackable processor modules |
| 09/21/1988 | CN88101051A Component for three-phase bridge conversion circuit |
| 09/20/1988 | US4772867 Precision resistance network, especially for thick-film hybrid circuits |
| 09/14/1988 | EP0282124A2 Method for manufacturing a modular semiconductor power device and device obtained thereby |
| 09/14/1988 | EP0282025A2 Semiconductor device with fuse function |
| 09/13/1988 | US4770640 Electrical interconnection device for integrated circuits |
| 09/07/1988 | EP0281026A2 High density optical mosaic detector and method for its fabrication |
| 08/31/1988 | EP0280235A2 3-phase bridge converting circuit module |
| 08/31/1988 | EP0279996A1 Multiple chip interconnection system and package |
| 08/31/1988 | EP0279814A1 Thermally insulative and electrically conductive interconnect and process for making same. |
| 08/30/1988 | US4768075 Power semiconductor module |
| 08/30/1988 | US4766670 Full panel electronic packaging structure and method of making same |
| 08/23/1988 | US4766481 Power semiconductor module |
| 08/17/1988 | EP0278432A1 Bridge arm with free-wheel diodes |
| 08/17/1988 | EP0278086A2 Current limited semiconductor circuit |
| 08/16/1988 | US4764846 High density electronic package comprising stacked sub-modules |
| 08/16/1988 | US4764804 Semiconductor device and process for producing the same |
| 08/16/1988 | US4764415 Electric element using oxidation-reduction substances |
| 08/10/1988 | EP0277606A2 Full panel electronic packaging structure |
| 08/10/1988 | EP0277546A1 Semiconductor device having at least one semiconductor body |
| 08/09/1988 | US4763225 Heat dissipating housing for an electronic component |
| 08/09/1988 | US4763188 Packaging system for multiple semiconductor devices |
| 08/02/1988 | US4761681 Method for fabricating a semiconductor contact and interconnect structure using orientation dependent etching and thermomigration |
| 07/19/1988 | CA1239483A1 Bond wire transmission line |
| 07/14/1988 | WO1988005251A1 High density electronic package comprising stacked sub-modules |
| 07/12/1988 | US4757357 Light-emitting diode matrix with semi-insulating zones |
| 07/06/1988 | EP0273364A2 Electronic part carrying strip and method of manufacturing the same |
| 07/05/1988 | US4755910 Housing for encapsulating an electronic circuit |
| 07/05/1988 | US4755866 Electronic circuit module |
| 06/30/1988 | DE3643288A1 Semiconductor assembly |
| 06/29/1988 | EP0272961A1 Housing cabinet for a plurality of electronic subracks for a static non-interrupted power supply |
| 06/28/1988 | US4754316 Solid state interconnection system for three dimensional integrated circuit structures |
| 06/23/1988 | DE3642240A1 Constant-current light-emitting diode (constant-current LED) |
| 06/22/1988 | CN87107389A Temperature controlled hybrid assembly |
| 06/14/1988 | US4751564 Multiple wafer scale assembly apparatus and fixture for use during the fabrication thereof |
| 06/08/1988 | EP0270069A2 Module with power semiconductor circuits elements |
| 06/08/1988 | EP0270067A2 Method of making a semiconductor device comprising at least two semiconductor chips |
| 06/08/1988 | EP0168456B1 Mounting and connection device for power semi-conductors |
| 06/07/1988 | US4750031 Moulded ring frame of polyamideimide adhered along edge to metal base plate; lightweight |
| 06/07/1988 | CA1237823A1 Laminated semiconducter assembly |
| 05/25/1988 | EP0268260A1 Flexible film chip carrier with decoupling capacitors |
| 05/25/1988 | EP0268249A2 Power MOSFET with current control |
| 05/24/1988 | US4747037 High-voltage thyristor conversion/inversion apparatus |
| 05/24/1988 | US4746371 Solar radiation |
| 05/17/1988 | CA1236908A1 Light emitting diode array and method of producing the same |
| 05/11/1988 | EP0266412A1 Surface mountable diode. |
| 05/11/1988 | DE3735818A1 Kapsel eines leuchtelements mit integrierter kuehlkoerper- und ueberlastungsstromschutzschaltung Capsule of a luminous elements with integrated heat sink and ueberlastungsstromschutzschaltung |
| 05/10/1988 | US4744007 Large scale integrated package; multi-chip |
| 05/10/1988 | US4743751 Device for the optical abutment of photosensitive detectors |
| 05/05/1988 | WO1988002553A3 Integrated circuit packaging configuration for rapid customized design and unique test capability |
| 05/04/1988 | EP0266210A2 Electronic apparatus comprising a ceramic substrate |
| 05/04/1988 | EP0265833A1 Semiconductor component having at least one power MOSFET |
| 05/03/1988 | US4742432 Matrix of light-emitting elements and method of manufacturing same |
| 05/03/1988 | US4742385 Multichip package having outer and inner power supply means |
| 04/27/1988 | EP0264780A2 Hybrid integrated circuit device capable of being inserted into socket |
| 04/27/1988 | EP0264469A1 Package density doubling device for semiconductor chips containing monolithically integrated circuits |
| 04/26/1988 | US4740868 Rail bonded multi-chip leadframe, method and package |
| 04/26/1988 | US4740700 Thermally insulative and electrically conductive interconnect and process for making same |
| 04/19/1988 | US4739447 Mounting and connection device for power semi-conductors |
| 04/19/1988 | US4739446 Header for a wafer scale assembly |
| 04/19/1988 | US4739443 Thermally conductive module |
| 04/19/1988 | US4739389 High-frequency circuit arrangement and semiconductor device for use in such an arrangement |
| 04/14/1988 | DE3628556C1 Semiconductor device |
| 04/12/1988 | US4737672 Resin layer reinforced with aromatic polyamide |
| 04/07/1988 | WO1988002553A2 Integrated circuit packaging configuration for rapid customized design and unique test capability |
| 04/07/1988 | WO1988002552A1 Multichip integrated circuit packaging configuration and method |
| 04/07/1988 | WO1988002542A1 Low-temperature monolithic chip |
| 04/06/1988 | EP0262530A1 Semiconductor components having a power MOSFET and control circuit |
| 04/05/1988 | US4736235 Ultra-high frequency diode structure whose external connections are provided by two metal beam leads |
| 04/05/1988 | US4736070 Miniaturized lighting or overload protective device and protective device used therein |
| 03/31/1988 | DE3631963A1 Method for producing a printed circuit board assembly |
| 03/30/1988 | EP0261138A1 Inverted chip carrier |
| 03/29/1988 | US4734825 Integrated circuit stackable package |
| 03/29/1988 | US4734819 Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package |
| 03/29/1988 | US4734315 Low power circuitry components |
| 03/23/1988 | EP0260471A1 Power semiconductor device |
| 03/22/1988 | US4733127 Unit of arrayed light emitting diodes |
| 03/22/1988 | EP0204767A4 Method for fabricating modules comprising stacked circuit-carrying layers. |
| 03/15/1988 | US4731700 Semiconductor connection and crossover apparatus |
| 03/15/1988 | US4731644 Semiconductor power module with ceramic substrate |
| 03/15/1988 | CA1234228A1 Semiconductor device |
| 03/10/1988 | WO1988001793A1 Thermally insulative and electrically conductive interconnect and process for making same |
| 03/09/1988 | EP0258691A2 Voltage regulator for a generator |
| 03/08/1988 | US4730232 High density microelectronic packaging module for high speed chips |
| 03/02/1988 | EP0257119A1 Integrated wiring system for VLSI |
| 03/02/1988 | EP0049286B1 Methods of producing sheets of crystalline material and devices amde therefrom |
| 03/01/1988 | US4729010 Integrated circuit package with low-thermal expansion lead pieces |
| 03/01/1988 | US4728999 Light emitting diode assembly |
| 03/01/1988 | US4728302 Mounting coupling and heat sink assembly for axial lead components |
| 02/23/1988 | US4727513 Signal in-line memory module |
| 02/23/1988 | US4727457 Surface-mounted optoelectronic device |
| 02/23/1988 | US4727410 High density integrated circuit package |