| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/23/1988 | US4727047 Separable from a reusable substrate |
| 02/16/1988 | US4724611 Method for producing semiconductor module |
| 02/10/1988 | EP0255644A1 Process for the production of a pressure sensor |
| 02/09/1988 | US4724474 Power bridge rectifier assembly |
| 02/02/1988 | CA1232355A1 Single in-line memory module |
| 01/27/1988 | EP0253886A1 Interconnects for wafer-scale-integrated assembly |
| 01/26/1988 | US4721986 Bidirectional output semiconductor field effect transistor and method for its maufacture |
| 01/14/1988 | WO1988000396A1 Multiple-plate hybrid device |
| 01/14/1988 | WO1988000395A1 Diode stack with high dielectric strength |
| 01/12/1988 | CA1231466A1 Semiconductor power switch comprising a thyristor |
| 01/07/1988 | DE3621929A1 Stapelfoermige diodenanordnung mit hoher spannungsfestigkeit Stapelfoermige diode arrangement with high dielectric strength |
| 01/07/1988 | DE3621796A1 Method for improving the crosstalk attenuation in an opto-electronic sensor arrangement |
| 01/05/1988 | US4717790 For automobiles, embedding solar cells in laminate |
| 01/05/1988 | US4717690 Overglaze inks |
| 12/22/1987 | US4714952 Capacitor built-in integrated circuit packaged unit and process of fabrication thereof |
| 12/08/1987 | US4712161 Hybrid and multi-layer circuitry |
| 12/01/1987 | US4710850 Tower design for high-voltage systems |
| 12/01/1987 | US4710795 Semiconductor power module |
| 12/01/1987 | US4710680 Driver device mounting for a flat matrix display panel |
| 11/26/1987 | DE3617611A1 Thermally conductive and electrically insulating interlayer for the build-up and fixing of semiconductor elements, and arrangement using such interlayers |
| 11/24/1987 | US4709301 For integrated circuit chip wires, polysiloxanes |
| 11/24/1987 | US4709300 Jumper for a semiconductor assembly |
| 11/24/1987 | US4709253 Surface mountable diode |
| 11/19/1987 | EP0246034A2 Method of testing electronic assemblies while they are being produced |
| 11/19/1987 | EP0245747A2 Control device for a plurality of parallel-connected power field effect transistors |
| 11/17/1987 | CA1229411A1 Stacked double density memory module using industry standard memory chips |
| 11/17/1987 | CA1229364A1 Rotating rectifier assembly |
| 11/12/1987 | DE3713833A1 Hybridschaltung Hybrid circuit |
| 11/11/1987 | EP0244767A2 Hermetic semiconductor enclosure and process of manufacture |
| 11/10/1987 | US4706166 High-density electronic modules--process and product |
| 11/10/1987 | US4705917 Microelectronic package |
| 11/10/1987 | CA1229155A1 High density lsi package for logic circuits |
| 11/05/1987 | WO1987006767A1 Surface mountable diode |
| 11/04/1987 | EP0243637A2 Semi-conductor power module |
| 11/03/1987 | US4704525 Construction for positioning photosensor devices |
| 11/03/1987 | US4704320 Semiconductors, gap between ceramic base and conductor layer relieves stress |
| 11/03/1987 | US4704319 Apparatus and method for fabricating modules comprising stacked circuit-carrying layers |
| 11/03/1987 | CA1228893A1 Semiconductor valve |
| 10/28/1987 | EP0243089A2 Light emitter |
| 10/27/1987 | US4703483 Chip on chip type integrated circuit device |
| 10/27/1987 | US4703170 Infrared focal plane module |
| 10/27/1987 | US4703131 Lightweight-for spacecraft |
| 10/21/1987 | EP0242303A2 Anisotropic elastomeric interconnecting system |
| 10/20/1987 | US4701828 For alternators |
| 10/20/1987 | US4701424 Silicon, gold eutetics; diffusion barriers |
| 10/20/1987 | US4700879 Method for manufacturing semiconductor power modules with an insulated contruction |
| 10/15/1987 | DE3711255A1 Array of LED units |
| 10/15/1987 | DE3622025C1 Infrared luminaire |
| 10/14/1987 | EP0240667A2 Processor |
| 10/13/1987 | US4700076 Solid-state X-ray receptor and method of making same |
| 10/08/1987 | WO1987006062A1 Inverted chip carrier |
| 10/08/1987 | WO1987006060A1 Method for joining two or more wafers and the resulting structure |
| 10/06/1987 | CA1227831A1 Direct current tight coupling |
| 09/30/1987 | EP0238651A1 Magnetically sealed multichip integrated circuit package. |
| 09/29/1987 | US4696851 Hybrid and multi-layer circuitry |
| 09/23/1987 | EP0238089A2 Three-dimensional integrated circuit and manufacturing method therefor |
| 09/23/1987 | EP0238066A2 A method for effecting adhesion of silicon or silicon dioxide plates |
| 09/23/1987 | EP0237894A2 Electronic apparatus provided with several main modules stacked upon one another |
| 09/23/1987 | EP0237808A2 Multilayered interposer board for powering high current chip modules |
| 09/23/1987 | EP0237739A2 Semiconductor power module and method of producing the module |
| 09/22/1987 | US4695872 High density micropackage for IC chips |
| 09/22/1987 | US4695870 Inverted chip carrier |
| 09/16/1987 | EP0236493A1 Microelectronic package. |
| 09/15/1987 | US4694323 Apparatus for vapor-cooling a semiconductor |
| 09/15/1987 | US4694322 Press-packed semiconductor device |
| 09/15/1987 | US4693770 Method of bonding semiconductor devices together |
| 09/15/1987 | CA1226929A1 Multiple wavelength light emitting devices |
| 09/10/1987 | DE3607142A1 Light-emitting diode arrangement |
| 09/09/1987 | EP0235503A2 hermetic high frequency surface mount microelectronic package |
| 09/08/1987 | US4692839 Multiple chip interconnection system and package |
| 09/08/1987 | CA1226619A1 Preset element used to keep in place and to bind semiconductors and heat sinks mounted in alternate positions in a column |
| 09/07/1987 | EP0155965A4 Wafer. |
| 09/02/1987 | EP0234368A1 Tower construction for a high-voltage installation |
| 08/25/1987 | US4689658 Modular semiconductor device |
| 08/25/1987 | US4688864 Electronic circuit constituted by stackable modules |
| 08/19/1987 | EP0232767A2 Overglaze paste |
| 08/18/1987 | US4688151 Multilayered interposer board for powering high current chip modules |
| 08/12/1987 | EP0231970A2 Thick-film wiring on a ceramic substrate plate |
| 08/11/1987 | US4686492 Impedance match connection using multiple layers of bond wires |
| 08/11/1987 | US4685998 Conductive bonds top of dielectric layer; microcomputer chip |
| 08/04/1987 | US4685030 Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits |
| 07/30/1987 | WO1987004566A1 Interconnects for wafer-scale-integrated assembly |
| 07/29/1987 | EP0230336A1 Optoelectronic device for surface mounting |
| 07/28/1987 | US4683489 Common housing for two semi-conductor bodies |
| 07/28/1987 | CA1224841A1 Rotating rectifier assembly |
| 07/21/1987 | US4682207 On a printed circuit board |
| 07/15/1987 | EP0228953A1 Encapsulation housing for an electronic circuit |
| 07/08/1987 | EP0227926A1 Physical parameter balancing of circuit islands in integrated circuit wafers |
| 06/24/1987 | EP0225919A1 Cooled stack of electrically isolated semiconductors |
| 06/23/1987 | US4675785 Heat distributing diode mounting assembly |
| 06/23/1987 | US4675720 Enclosed thyristor valve |
| 06/23/1987 | US4675719 Thyristor device |
| 06/23/1987 | US4675575 Light-emitting diode assemblies and systems therefore |
| 06/16/1987 | US4672737 Detector array module fabrication process |
| 06/09/1987 | US4672422 Semiconductor rectifier unit |
| 06/09/1987 | US4672421 Semiconductor packaging and method |
| 06/09/1987 | US4672258 Semiconductor light source device in image output device |
| 06/02/1987 | US4670833 Semiconductor module for a high-speed switching arrangement |
| 06/02/1987 | US4670678 Rotating rectifying device for the excitation of a synchronous machine |
| 06/01/1987 | EP0179802A4 Integrated circuits with contact pads in a standard array. |