Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/1989
06/13/1989US4838951 Solar module mounting arrangement using angle brackets
06/13/1989CA1255763A1 Semiconductor module for a high-speed switching arrangement
06/06/1989US4837182 Growth mask on substrate; forming, removal sheet
05/1989
05/30/1989US4835427 Three-phase alternator diode heat sink structure
05/24/1989EP0317084A2 Double wafer moated signal processor
05/24/1989EP0317083A2 Single wafer moated signal processor
05/23/1989US4833568 Three-dimensional circuit component assembly and method corresponding thereto
05/23/1989US4833522 Semiconductor module
05/18/1989WO1989004552A1 Method and means of fabricating a semiconductor device package
05/17/1989EP0315905A2 Electroluminescent device
05/17/1989EP0315792A2 Interconnection system for integrated circuit chips
05/16/1989US4830979 Method of manufacturing hermetically sealed compression bonded circuit assemblies
05/10/1989EP0315320A2 Thick-film high frequency signal circuit apparatus with feedthrough capacitor
05/05/1989WO1989004113A1 High-density electronic modules, process and product
05/03/1989EP0314437A1 Semiconductor wafer array
05/03/1989EP0313597A1 Hot melt ink supply system.
05/03/1989DE3736144A1 Method for fabricating a resistor for use as bias resistor for semiconductor light-emitting diodes
05/02/1989US4826787 Method for adhesion of silicon or silicon dioxide plate
05/02/1989CA1253628A1 Hybrid and multi-layer circuitry
04/1989
04/26/1989EP0312528A1 Multiple-plate hybrid device.
04/25/1989US4825284 Semiconductor resin package structure
04/25/1989US4825279 Semiconductor device
04/25/1989US4825272 Semiconductor power switch with thyristor
04/19/1989EP0311674A1 Cavity-up-cavity-down multichip integrated circuit package.
04/19/1989EP0197117B1 Multiple wavelength light emitting devices
04/18/1989US4823234 Semiconductor device and its manufacture
04/06/1989WO1989003122A1 Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds
04/05/1989EP0309631A1 Method and apparatus for detecting position/variance of input light
04/04/1989US4819056 Hybrid thick film circuit device
04/04/1989US4819042 Isolated package for multiple semiconductor power components
04/04/1989US4818728 Method of making a hybrid semiconductor device
04/04/1989CA1252229A1 Multijunction semiconductor device
03/1989
03/29/1989EP0308749A2 Electrooptical unit
03/29/1989EP0308748A2 Electrooptical unit
03/29/1989EP0308676A2 Non-tensile coating for electrical and electronic components, especially for hybrid circuits
03/29/1989EP0308465A1 Detector buffer board.
03/28/1989US4816984 Bridge arm with transistors and recovery diodes
03/28/1989US4816983 Enclosed D.C. converting station
03/28/1989US4816980 Converter system for coupling two high voltage three-phase networks
03/28/1989US4816420 Method of producing tandem solar cell devices from sheets of crystalline material
03/21/1989US4814786 Hot melt ink supply system
03/21/1989US4814667 Light emitting diode array having uniform illuminance distribution
03/21/1989CA1251522A1 Enclosed thyristor valve
03/15/1989EP0306890A1 A semiconductor module having active devices disposed in substrate cavities
03/09/1989WO1989002161A1 Rectifier bearing device
03/07/1989US4811072 Semiconductor device
02/1989
02/28/1989US4809133 Low temperature monolithic chip
02/22/1989EP0304263A2 Semiconductor chip assembly
02/22/1989EP0303974A2 An RF-shielded hybrid circuit
02/22/1989EP0303808A2 Electrical connection
02/22/1989EP0303741A1 Quickly formable light emitting diode display and its forming method
02/21/1989US4807105 Circuit arrangement for producing high DC voltage from medium-frequency AC voltage
02/21/1989US4807021 Semiconductor device having stacking structure
02/21/1989US4807019 Cavity-up-cavity-down multichip integrated circuit package
02/21/1989US4807000 High density small element optical mosaic detector
02/15/1989EP0303272A2 Printed circuits for electronics
02/15/1989CN1031167A Circuit arrangement having plurality of electrical elements to be cooled
02/08/1989EP0302237A1 Circuit arrangement with several cooled electrical elements
02/07/1989US4803180 Method for manufacturing pressure contact semiconductor devices
01/1989
01/31/1989US4802099 Physical parameter balancing of circuit islands in integrated circuit wafers
01/31/1989US4802062 Integrated wiring system for VLSI
01/26/1989DE3823336A1 Package connecting a large number of chips to one another
01/26/1989DE3723209A1 Semiconductor arrangement
01/24/1989US4799309 Method of making a rectifier and control module for an alternator
01/18/1989EP0299822A1 Method of manufacturing a high-power electronic device, and device thus obtained
01/18/1989EP0299275A1 Power converter assembly for coupling two kinds of high-voltage three-phase networks together
01/10/1989US4797723 Stacked semiconductor device
01/04/1989EP0297802A2 Isolated light-triggered thyristor module
12/1988
12/29/1988DE3719338A1 Leuchtdioden-anzeigevorrichtung Light-emitting diode display device
12/27/1988US4794092 Integrated circuit chips from doped silicon wafer; doped area isolated from conductive edges
12/20/1988US4792844 Pressure contact semiconductor device
12/20/1988US4792786 Surface-mounted single package data acquistition system
12/20/1988US4792773 Ultra high frequency circuit with low parasite capacities
12/20/1988US4792672 For use in an infrared detection system
12/13/1988CA1246757A1 Magnetically sealed multichip integrated circuit package
12/07/1988EP0294190A2 A resin sealed semiconductor device and a method for making the same
11/1988
11/30/1988EP0293216A2 Manufacture of infra-red detectors
11/30/1988EP0292848A2 Semiconductor power module and method of manufacturing it
11/29/1988US4788626 Power semiconductor module
11/29/1988CA1245776A1 Bonding-activating operation to manufacture semiconductor devices
11/29/1988CA1245613A1 Matrix of light-emitting elements and method of manufacturing same
11/23/1988EP0292059A2 Modular resin-encapsulated multi-chip circuit package and its manufacturing method
11/22/1988US4786826 Power interface circuit with control chip powered from power chip
11/17/1988WO1988009058A1 Electrical switching and control apparatus
11/15/1988US4784970 Forming grooves in wafer, filling with dielectric, joining wafers, thinning doping, and electroconductive overcoating
11/15/1988CA1244968A1 Method of joining semiconductor substrates
11/08/1988US4783695 Multichip integrated circuit packaging configuration and method
11/03/1988WO1988008615A1 Cavity-up-cavity-down multichip integrated circuit package
11/03/1988WO1988008514A1 Hot melt ink supply system
11/02/1988EP0173690B1 Thermally-activated, shorting diode switch having non-operationally-alternable junction path
10/1988
10/26/1988EP0288186A2 Packaging of semiconductor integrated circuits
10/25/1988US4780795 Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
10/20/1988WO1988008203A1 Packaging system for stacking integrated circuits
10/19/1988EP0287274A2 Semiconductor hybrid device
10/18/1988US4778950 Alternate conductive metals sheets separated by dielectric sheet
10/11/1988US4777465 Square toroid transformer for hybrid integrated circuit
10/11/1988US4777387 Solid state relay circuit
10/11/1988US4776895 Multiband emitter matched to multilayer photovoltaic collector
10/11/1988US4776893 GaAs on GaSb mechanically stacked photovoltaic cells, package assembly, and modules
10/06/1988WO1988007764A1 Detector buffer board
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