Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2000
07/13/2000WO2000041242A1 Semiconductor unit
07/13/2000WO2000041241A1 Vertically integrated semiconductor system
07/13/2000WO2000041240A1 Vertically integrated circuit system
07/13/2000WO2000040408A1 Method of mass producing and packaging integrated optical subsystems
07/13/2000WO1999065282A9 Ic stack utilizing flexible circuits with bga contacts
07/12/2000EP1018290A1 A system and method for packaging integrated circuits
07/12/2000EP1018162A1 Multicolor sensor
07/12/2000CN1259770A Integrated circuit contg. low diffusion capacitance network
07/11/2000US6088233 Semiconductor device and assembly board having through-holes filled with filling core
07/11/2000US6088230 Procedure for producing a chip mounting board and chip-mounting board thus produced
07/11/2000US6087912 High frequency multi-layer module comprising a dielectric resonator
07/11/2000US6087722 Multi-chip package
07/11/2000US6087721 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
07/11/2000US6087719 Chip for multi-chip semiconductor device and method of manufacturing the same
07/11/2000US6087718 Stacking type semiconductor chip package
07/11/2000US6087682 High power semiconductor module device
07/11/2000US6087680 Led device
07/11/2000US6087199 Method for fabricating a very dense chip package
07/11/2000US6087195 Method and system for manufacturing lamp tiles
07/06/2000WO2000039853A1 Vertically integrated semiconductor arrangement
07/06/2000DE19963883A1 Power semiconductor casing for surface securing enclosing substrate top and bottom faces, with top face carrying power semiconductor chip
07/05/2000EP1017101A1 Integrated circuit comprising a capacitive network with low dispersion
07/05/2000EP1017100A1 Three-dimensional device
07/05/2000EP1016141A1 Multicolor-color sensor
07/05/2000EP1015220A1 Injection molding encapsulation for an electronic device directly onto a substrate
07/04/2000US6085018 Integrated circuit, electronic equipment and method of assembly which uses said integrated circuit
07/04/2000US6084771 Power electronic module and power electronic device including such modules
07/04/2000US6084308 Chip-on-chip integrated circuit package and method for making the same
07/04/2000US6084294 Semiconductor device comprising stacked semiconductor elements
07/04/2000US6084293 Stacked semiconductor device
07/04/2000US6084252 Semiconductor light emitting device
06/2000
06/29/2000WO2000038234A1 Scalable data processing apparatus
06/29/2000WO2000038216A2 High voltage photovoltaic power converter
06/29/2000WO2000038110A1 Data carrier with chip and fully enclosed connection means
06/29/2000WO2000038109A1 Data carrier module with integrated circuit and transmission coil
06/29/2000WO2000038108A1 Device arranged for contactless communication and provided with a data carrier with fully enclosed holding means for holding a chip and a passive component
06/28/2000EP1014451A1 Flat semiconductor device and power converter employing the same
06/28/2000EP1011810A1 Compact flexible circuit configuration
06/28/2000EP0934621A4 Bridge rectifier configuration and mounting for supplying exciter current in an ac generator
06/27/2000US6081039 Pressure assembled motor cube
06/27/2000US6081030 Semiconductor device having separated exchange means
06/27/2000US6081023 Semiconductor device
06/27/2000US6080931 Semiconductor package
06/27/2000US6080640 High density integrated circuits
06/27/2000US6080596 Method for forming vertical interconnect process for silicon segments with dielectric isolation
06/27/2000CA2166926C Packaging multi-chip modules without wire-bond interconnection
06/22/2000WO2000036650A1 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
06/22/2000WO2000036645A1 Light extractor apparatus
06/22/2000CA2351822A1 Light extractor apparatus
06/21/2000CN2384313Y Light emitting diode
06/20/2000US6078514 Semiconductor device and semiconductor system for high-speed data transfer
06/20/2000US6078501 Power semiconductor module
06/20/2000US6078101 High-power microwave-frequency hybrid integrated circuit
06/20/2000US6078066 Power semiconductor switching device
06/20/2000US6077725 High density contact pads on silicon substrate
06/20/2000US6077724 Multi-chips semiconductor package and fabrication method
06/20/2000US6077723 Method for fabricating a multi chip module with alignment member
06/15/2000WO2000035016A1 Multi-chip package with stacked chips and interconnect bumps
06/15/2000WO2000035015A1 Rf circuit module
06/15/2000WO2000035007A1 Method for vertically integrating active circuit planes and vertically integrated circuit produced using said method
06/14/2000EP1009030A2 Semiconductor device comprising a power element and a protect circuit
06/14/2000EP1009027A2 Multipoint conductive sheet
06/14/2000EP1008231A2 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same
06/14/2000EP1008186A1 Power transistor cell
06/14/2000CN2383212Y Integrated circuit packaging structure
06/14/2000CN1256792A 三维器件 3D device
06/13/2000US6075711 System and method for routing connections of integrated circuits
06/13/2000US6075287 Integrated, multi-chip, thermally conductive packaging device and methodology
06/13/2000US6075284 Stack package
06/13/2000US6075251 Optical transmitter data compression system
06/08/2000WO2000033378A1 High frequency power transistor device
06/08/2000WO2000033096A1 Probe card for probing wafers with raised contact elements
06/08/2000DE19853424A1 Light emitting diode (LED) component with combination and construction facilities for system components
06/08/2000CA2353473A1 High frequency power transistor device
06/07/2000EP1006578A2 Semiconductor power module
06/07/2000CN1255749A Power electronic device
06/06/2000US6072700 Ball grid array package
06/06/2000US6072445 Head mounted color display system
06/06/2000US6072240 Semiconductor chip package
06/06/2000US6072239 Device having resin package with projections
06/06/2000US6072234 Stack of equal layer neo-chips containing encapsulated IC chips of different sizes
06/06/2000US6072233 Stackable ball grid array package
06/06/2000US6072231 Semiconductor device
06/06/2000US6072224 Monolithic x-ray image detector and method of manufacturing
06/06/2000US6072122 Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates
06/06/2000US6071757 Condensed memory matrix
06/06/2000US6071754 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
06/02/2000WO2000031798A1 High density electronic package
06/02/2000WO2000031620A1 Fully programmable and configurable application specific integrated circuit
05/2000
05/31/2000EP1005095A1 Photovoltaic element and method for manufacture thereof
05/31/2000EP1005089A1 Power Semiconductor Device
05/31/2000EP1004141A1 A system and method for packaging integrated circuits
05/30/2000US6069682 Spherical shaped semiconductor integrated circuit
05/30/2000US6069403 Power module with lowered inductance and reduced voltage overshoots
05/30/2000US6069401 Semiconductor chip
05/30/2000US6069029 Semiconductor device chip on lead and lead on chip manufacturing
05/30/2000US6069025 Method for packaging a semiconductor device
05/30/2000US6069022 Optical FET
05/25/2000WO2000030139A1 High brightness organic light emitting device
05/24/2000EP1003213A2 Method of fabricating resin-sealed semiconductor devices
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