Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/2000
09/05/2000US6114240 Method for fabricating semiconductor components using focused laser beam
09/05/2000US6114221 Method and apparatus for interconnecting multiple circuit chips
08/2000
08/31/2000WO2000051182A1 High-frequency module and method of manufacture thereof
08/31/2000DE19905807A1 Verfahren zur Herstellung elektrisch leitender Verbindungen A process for producing electrically conductive connections
08/31/2000DE10008582A1 Electronic switching module with housing and conductive base plate, on which are mounted switching FETs
08/30/2000EP1032114A1 Electric module for vehicle alternator, in particular car alternator, and assembly featuring such an alternator and such a module
08/30/2000EP1032042A2 Semiconductor module, power converter using the same and manufacturing method thereof
08/30/2000EP1032041A2 Semiconductor device comprising an internal wiring pattern
08/30/2000EP0745274B1 Process for producing a three-dimensional circuit
08/30/2000CN1265262A System and method for packaging integrated circuits
08/30/2000CN1264924A Memory assembly and its making method
08/30/2000CN1264923A Semiconductor device and its mfg. method
08/29/2000US6111761 Electronic assembly
08/29/2000US6111756 Universal multichip interconnect systems
08/29/2000US6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method
08/29/2000US6110806 Process for precision alignment of chips for mounting on a substrate
08/24/2000WO2000049658A1 Functionally symmetric integrated circuit die
08/24/2000DE19907406A1 Energy saving lamp of flexible design and guaranteed service life of 13 years
08/23/2000EP1029360A2 Vertical interconnect process for silicon segments with dielectric isolation
08/23/2000EP1029356A1 Reduced area imaging devices incorporated within surgical instruments
08/23/2000EP1029346A1 Vertical interconnect process for silicon segments with thermally conductive epoxy preform
08/23/2000EP1018290A4 A system and method for packaging integrated circuits
08/23/2000CN1264175A 功率半导体模块 Power Semiconductor Modules
08/22/2000US6107827 FPGA CLE with two independent carry chains
08/22/2000US6107711 Brushless exciter for a rotating electromagnetic machine
08/22/2000US6107674 Isolated multi-chip devices
08/22/2000US6107650 Insulated gate semiconductor device and manufacturing method thereof
08/22/2000US6107618 Integrated infrared and visible image sensors
08/22/2000US6107121 Method of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic package
08/22/2000US6107109 Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate
08/17/2000WO2000048242A1 Method for producing electrically conductive connections
08/17/2000DE19905886A1 Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements Identification element and method for producing an identification element
08/16/2000EP1028520A1 Semiconductor device
08/16/2000EP1028465A2 Semiconductor module
08/16/2000EP1028463A1 Flexible package having very thin semiconductor chip, module and multi chip module (MCM) assembled by the package, and method for manufacturing the same
08/16/2000EP1028388A2 Identification element and method of manufacturing an identification element
08/16/2000CN1263359A Circuit interconnection adopting virtual mirror image packaging piece
08/15/2000US6104629 High frequency memory module
08/15/2000US6104615 Semiconductor component assembly
08/15/2000US6104089 Stacked leads-over chip multi-chip module
08/15/2000US6104088 Complementary wiring package and method for mounting a semi-conductive IC package in a high-density board
08/15/2000US6104084 Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads
08/15/2000US6102710 Controlled impedance interposer substrate and method of making
08/15/2000CA2236993C Hybrid circuit construction of push-pull power amplifier
08/10/2000WO2000046853A1 Light source with light-emitting diodes
08/10/2000DE19902462A1 Chip-on-chip semiconductor component arrangement
08/10/2000DE10004196A1 Electronic half-bridge rectifier module unit for IC engine starter/AC generator circuit, has semiconducting part with surface attached to multiple lower circuit boards, common connection coupled to each lower board, and upper circuit board
08/09/2000EP1026744A1 Video display and manufacturing method therefor
08/09/2000EP1025589A1 Three-dimensional packaging configuration for multi-chip module assembly
08/09/2000EP1025584A1 Integrated electronic circuit comprising at least an electronic power component
08/08/2000US6101100 Multi-electronic device package
08/08/2000US6100745 Combination positive temperature coefficient resistor and metal-oxide semiconductor field-effect transistor devices
08/08/2000US6100613 Compact rectifier used in automobile AC generator
08/08/2000US6100594 Semiconductor device and method of manufacturing the same
08/08/2000US6100593 Multiple chip hybrid package using bump technology
08/08/2000US6100581 Semiconductor chip packaging having printed circuitry or printed circuit registration feature
08/08/2000US6100580 Semiconductor device having all outer leads extending from one side of a resin member
08/08/2000US6100115 Semiconductor device
08/08/2000US6098278 Method for forming conductive epoxy flip-chip on chip
08/08/2000CA2091438C Semiconductor chip assemblies, methods of making same and components for same
08/03/2000WO2000045440A1 Imaging device and motion picture camera provided with imaging device
08/03/2000WO2000045420A2 Multiple chip module with integrated rf capabilities
08/03/2000DE19912233C1 Module especially suitable for rail signaling, includes light emission diode (LED) array mounted on circuit board, with transparent plastic base carrying matching array of lenses to produce parallel beam
08/03/2000DE19903245A1 Leistungshalbleitermodul The power semiconductor module
08/02/2000EP1024539A2 Solid state based illumination source utilizing dichroic reflectors
08/02/2000EP1024530A1 Semiconductor power module
08/02/2000EP1024398A1 Solid state based illumination source for a projection display
08/01/2000US6097611 Multi-chip land grid array carrier
08/01/2000US6097096 Metal attachment method and structure for attaching substrates at low temperatures
08/01/2000US6097050 Memory configuration with self-aligning non-integrated capacitor configuration
08/01/2000US6096969 Apparatus adapted to use solar battery
08/01/2000US6096576 Method of producing an electrical interface to an integrated circuit device having high density I/O count
08/01/2000US6096155 Method of dicing wafer level integrated multiple optical elements
08/01/2000US6095822 Component module holder
07/2000
07/27/2000WO2000042896A2 X-ray detector
07/26/2000EP1021834A1 Electrical interface to integrated device having high density i/o count
07/26/2000EP0698289B1 Contact structure for vertical chip connections
07/26/2000CN2389418Y Resonance interflowing circuit module
07/25/2000US6093969 Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules
07/25/2000US6093938 Stacked die integrated circuit device
07/25/2000US6093889 Semiconductor package and mounting socket thereof
07/25/2000US6093584 Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads
07/25/2000US6093029 Vertically stackable integrated circuit
07/25/2000US6092713 Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof
07/20/2000WO2000042656A1 Power semiconductor module with cover
07/20/2000WO2000022666A3 METHOD AND DEVICE FOR INTERCONNECT RADIO FREQUENCY POWER SiC FIELD EFFECT TRANSISTORS
07/19/2000EP1020935A2 Composite light-emitting device, semiconductor light-emitting unit and method for fabricating the unit
07/19/2000EP1019970A1 Optical irradiation device
07/18/2000US6091199 Heat spreader for electronic ballast
07/18/2000US6091156 Semiconductor pellet having plural chips
07/18/2000US6091145 Thin multichip module including a connector frame socket
07/18/2000US6091144 Semiconductor package
07/18/2000US6091143 Stacked leads-over chip multi-chip module
07/18/2000US6091142 Assembly for dissipating heat from a stacked semiconductor package
07/18/2000US6091138 Multi-chip packaging using bump technology
07/18/2000US6091126 Electromagnetic wave detector
07/18/2000US6091027 Via structure
07/18/2000US6090687 System and method for bonding and sealing microfabricated wafers to form a single structure having a vacuum chamber therein
07/18/2000US6090261 Method and apparatus for controlling plating over a face of a substrate
07/18/2000US6089920 Modular die sockets with flexible interconnects for packaging bare semiconductor die
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