Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2000
10/31/2000US6140152 Power module with lowered inductance and reduced voltage overshoots
10/31/2000US6140149 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/31/2000US6139304 Mold for injection molding encapsulation over small device on substrate
10/26/2000WO2000063977A1 Lighting system
10/26/2000WO2000063970A1 Module component and method of manufacturing the same
10/26/2000WO2000063968A1 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
10/26/2000WO2000063950A2 Sub-package bypass capacitor mounting for an array packaged integrated circuit
10/24/2000US6137705 Drive control and protection circuit for a car power inverter
10/24/2000US6137693 High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
10/24/2000US6137224 Electronic device encapsulated directly on a substrate
10/24/2000US6137169 Heat reduction system for transistor assemblies
10/24/2000US6137167 Multichip module with built in repeaters and method
10/24/2000US6137164 Thin stacked integrated circuit device
10/24/2000US6137163 Semiconductor substrate and stackable semiconductor package and fabrication method thereof
10/24/2000US6137162 Chip stack package
10/19/2000WO2000062315A1 Methods to implement sealing and electrical connections to single cell and multi-cell regenerative photoelectrochemical devices
10/18/2000EP1045453A2 LED array PCB with adhesive rod lens
10/18/2000EP1045443A2 Semiconductor device and manufacturing method thereof
10/18/2000EP1044472A1 Multi-chip module having interconnect dies
10/18/2000CN1270702A Semiconductor module and power converter comprising IT
10/18/2000CN1270417A Semiconductor device and manufacture thereof
10/18/2000CN1270111A Flexible LED multiple module for lamp shell of vehicle
10/18/2000CN1057659C Multilayered metallic printed board and molded module
10/17/2000USRE36916 Apparatus for stacking semiconductor chips
10/17/2000US6134118 Conductive epoxy flip-chip package and method
10/17/2000US6133640 Three-dimensional structure memory
10/17/2000US6133637 Semiconductor device having a plurality of semiconductor chips
10/17/2000US6133632 Commonly housed diverse semiconductor die
10/17/2000US6133630 Condensed memory matrix
10/17/2000US6133627 Semiconductor chip package with center contacts
10/17/2000US6133626 Three dimensional packaging configuration for multi-chip module assembly
10/17/2000US6132072 Led assembly
10/17/2000US6131255 Repairable wafer scale integration system
10/12/2000WO2000060277A1 Signalling light with light-emitting diode
10/12/2000DE19914741A1 Power semiconductor module has several external elements control connections connected with the internal wall of housing and also electrically connected with frame
10/12/2000DE10009733A1 Semiconductor device including several semiconductor chips has second semiconductor chip and multilayered printed circuit board connected electrically and sealed by resin to fill out gap between them
10/12/2000DE10006585A1 Housing for light emitting diodes comprises LED arranged in a bowl shaped recess with input and output connections with support having printed circuit with pre etched circuit patterns
10/11/2000EP1043591A2 Power semiconductor module
10/11/2000EP0598914B1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board
10/10/2000US6130823 Stackable ball grid array module and method
10/10/2000US6130475 Clock distribution system for synchronous circuit assemblies
10/10/2000US6130114 Semiconductor device
10/05/2000WO2000059036A1 Semiconductor module and method of mounting
10/05/2000WO2000058664A1 Luminaire with leds
10/05/2000DE19914815A1 Halbleitermodul Semiconductor module
10/05/2000DE10013255A1 Electronic component, e.g. an automobile electronic ignition module, comprises a filled resin housing encapsulating a hybrid integrated circuit substrate and a tin-antimony soldered power semiconductor on a heat sink
10/05/2000DE10013189A1 Substrate for a power semiconductor module in an electric vehicle has a buffer layer of intermediate thermal expansion coefficient interposed between an insulating substrate and a heat sink
10/04/2000EP1041633A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device
10/04/2000EP1041631A2 Capacitor-built-in-type printed wiring substrate, printed wiring substrate, and capacitor
10/04/2000EP1041626A2 Semiconductor Module
10/04/2000EP1041624A1 Method of transferring ultra-thin substrates and application of the method to the manufacture of a multilayer thin film device
10/04/2000EP1041401A2 Solid-state radiation detectors
10/04/2000CN1268925A Three-D structure memory
10/03/2000US6128201 Three dimensional mounting assembly for integrated circuits
10/03/2000US6128063 Liquid crystal display apparatus having multi-layer substrate
10/03/2000US6127846 Programmable logic array devices with interconnect lines of various lengths
10/03/2000US6127726 Cavity down plastic ball grid array multi-chip module
10/03/2000US6127725 Thin film electronics on insulator on metal
10/03/2000US6127714 Method for producing semiconductor device and photodetector device
10/03/2000US6127621 Power sphere
09/2000
09/28/2000WO2000057490A1 Lamp
09/28/2000WO2000057474A1 Multi-chip module
09/28/2000DE10011537A1 Opto-electronic integrated circuit device effects light signal transmission between every optical output connection unit and every corresponding optical input connection unit of first and second opto-electronic ICs
09/27/2000EP1039543A2 Circuit chip connector and method of connecting a circuit chip
09/27/2000CN1268245A A system and method for packaging integrated circuits
09/26/2000US6125039 Hybrid module
09/26/2000US6124731 Configurable logic element with ability to evaluate wide logic functions
09/26/2000US6124633 Vertical interconnect process for silicon segments with thermally conductive epoxy preform
09/26/2000US6124629 Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
09/26/2000US6124149 Method of making stackable semiconductor chips to build a stacked chip module
09/26/2000US6122823 Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
09/26/2000CA2097668C Movement actuator/sensor systems
09/21/2000WO2000055917A1 Power semiconductor module
09/21/2000DE19912441A1 Multi-Chip-Modul Multi-chip module
09/20/2000EP1036849A2 Metal matrix composite material, process for its production and use
09/20/2000EP1036416A1 Electronic hybrid component and method for the production thereof
09/20/2000EP1036415A2 Wafer level integration of multiple optical elements
09/19/2000US6122187 Stacked integrated circuits
09/19/2000US6122171 Heat sink chip package and method of making
09/19/2000US6122170 Power module board and power module using the board
09/19/2000US6121950 Control system for display panels
09/19/2000US6121699 AC generator for motor vehicles
09/19/2000US6121682 Multi-chip package
09/19/2000US6121681 Semiconductor device
09/19/2000US6121676 Stacked microelectronic assembly and method therefor
09/19/2000US6121070 Flip chip down-bond: method and apparatus
09/19/2000US6119333 Mini-module with upwardly directed leads
09/14/2000WO2000054337A1 Apparatus and method for an integrated circuit having high q reactive components
09/14/2000WO2000054336A1 Stitched circuits larger than the maximum reticle size in sub-micron process
09/14/2000WO1998036461A9 Optoelectronic semiconductor diodes and devices comprising same
09/14/2000CA2362159A1 Apparatus and method for an integrated circuit having high q reactive components
09/13/2000EP1035586A1 Semiconductor module and power converter comprising it
09/13/2000EP1035573A1 Electrical power component soldered on a support and corresponding mounting method
09/12/2000US6118660 Circuit module with improved heat transfer
09/12/2000US6118184 Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow
09/12/2000US6117704 Stackable layers containing encapsulated chips
09/08/2000WO1999065062A9 Ic stack utilizing secondary leadframes
09/06/2000EP1033525A2 Flexible LED-Multimodule, in particular for a vehicle lamp housing
09/06/2000EP1032969A1 Electronic package assembly
09/06/2000EP0870294B1 True color flat panel display LED matrix module with driving circuitry
1 ... 346 347 348 349 350 351 352 353 354 355 356 357 358 359 360 361 362 363 364 365 366 ... 409