Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2000
12/12/2000US6159765 Integrated circuit package having interchip bonding and method therefor
12/12/2000US6158115 Method of mounting a plurality of electronic parts on a circuit board
12/07/2000WO2000074446A1 Intelligent power module
12/07/2000WO2000074445A1 Sandwich-structured intelligent power module
12/07/2000WO2000074136A1 Method for producing three-dimensional circuits
12/07/2000WO2000074134A1 Method for the vertical integration of electric components by
12/07/2000DE19958486A1 Verfahren zur vertikalen Integration von elektrischen Bauelementen mittels Rückseitenkontakt Method for vertical integration of electrical components by means of back-contact
12/07/2000DE10022482A1 Integrated memory with two-transistor, two-capacitor storage cells
12/06/2000EP1058224A1 Electronic device with solar cell
12/06/2000EP1057258A1 Electronic component, especially a component working with acoustic surface waves
12/06/2000EP1057220A2 Tiled electronic display structure
12/06/2000EP1057219A1 Contrast enhancement for an electronic display device
12/06/2000EP1057216A1 Sealing of large area display structures
12/06/2000EP0815615A4 A package housing multiple semiconductor dies
12/06/2000CN1059290C Method for assembly integrated circuit on a shared substrate
12/05/2000US6157541 Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements
12/05/2000US6157404 Imaging system including an array of dual-band microbridge detectors
12/05/2000US6157080 Semiconductor device using a chip scale package
12/05/2000US6157050 Optical module and lead frame for optical module
12/05/2000US6157020 Bispectral electromagnetic wave detector
12/05/2000US6156165 Enclosing integrated circuit chip in a mask which exposes an area on an edge of integrated circuit chip and areas on major surfaces of the integrated circuit chip contiguous to area on edge of integrated circuit chip, applying metal
11/2000
11/30/2000WO2000072379A1 Thermal capacity for electronic component operating in long pulses
11/30/2000DE19963656A1 Fahrzeugleistungsumrichter Fahrzeugleistungsumrichter
11/30/2000DE19924935C1 Verfahren zur Herstellung von dreidimensionalen Schaltungen A process for producing three-dimensional circuits,
11/30/2000DE19923523A1 Semiconductor module with stacked chip package
11/30/2000DE19923467A1 Semiconductor module with interconnected semiconductor chips
11/30/2000DE19922361A1 LED-Modul für Signaleinrichtungen LED module for signaling devices
11/29/2000EP1056321A2 Circuit substrate
11/29/2000EP1056133A1 Rf circuit module
11/29/2000EP1055256A1 Adaptable led light panel
11/29/2000EP1055194A1 Device arranged for contactless communication and provided with a data carrier with fully enclosed holding means for holding a chip and a passive component
11/29/2000EP1055193A1 Data carrier with chip and fully enclosed connection means
11/29/2000EP1055192A1 Data carrier module with integrated circuit and transmission coil
11/28/2000US6154372 Multichip module for surface mounting on printed circuit boards
11/28/2000US6154362 Display apparatus
11/28/2000US6153929 Low profile multi-IC package connector
11/28/2000US6153928 Substrate for semiconductor package, fabrication method thereof, and stacked-type semiconductor package using the substrate
11/23/2000WO2000070687A1 Led module for signaling devices
11/23/2000WO2000070676A1 High-density electronic package, and method for making same
11/23/2000WO2000070555A1 Method for producing a contactless card
11/23/2000DE19921684A1 Illuminating element for illuminating food counters has semiconductor chips arranged on a conducting support material and controlled by conducting paths
11/22/2000CN1274173A Method of mfg. carrying band and carrying band type semiconductor device
11/21/2000US6151220 Mounting structure for electronic part
11/21/2000US6151201 Gas-insulated high-voltage semiconductor valve means
11/21/2000US6150724 Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces
11/21/2000US6150196 Method of manufacturing automobile AC generator and method of manufacturing rectifier used in automobile AC generator
11/21/2000US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive
11/16/2000WO2000069002A1 An electroluminescent or photocell device having protective packaging
11/16/2000WO2000068996A1 Surface mount ic stacking method and device
11/16/2000WO2000068992A1 Semiconductor device
11/16/2000DE19921265A1 Solarmodul zur Anbringung an Fahrzeugen und Verfahren zur Herstellung desselben Of the same solar module for mounting on vehicles and methods for making
11/16/2000DE19920505A1 Converter with temp. symmetrisation has temp. sensors in chips, evaluation device that calls up measurement values and processes them into signals for input to correction circuit
11/15/2000EP1052696A2 Electrical interconnection medium
11/15/2000EP1052695A2 Tape carrier and manufacturing method of tape carrier type semiconductor device
11/15/2000EP1051748A1 A vertical connector based packaging solution for integrated circuits
11/15/2000EP1051746A1 Integrated circuit device
11/14/2000US6147876 Multi-chip module having printed wiring board comprising circuit pattern for IC chip
11/14/2000US6147869 Adaptable planar module
11/14/2000US6147868 Electronic power components module
11/14/2000US6147411 Vertical surface mount package utilizing a back-to-back semiconductor device module
11/14/2000US6147401 Compliant multichip package
11/14/2000US6147400 Connecting multiple microelectronic elements with lead deformation
11/14/2000US6147393 Isolated multi-chip devices
11/14/2000US6147367 Packaging design for light emitting diode
11/14/2000US6146992 Vertically integrated semiconductor component and method of producing the same
11/14/2000US6146919 Package stack via bottom leaded plastic (BLP) packaging
11/09/2000WO2000067539A1 An apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry
11/09/2000WO2000067328A1 Compact detection device for a gamma camera
11/09/2000WO2000067319A1 Security method and device for a chip stack with a multidimensional structure
11/09/2000WO2000067314A1 Stackable flex circuit ic package and method of making the same
11/09/2000WO2000042896A3 X-ray detector
11/09/2000WO2000038216A3 High voltage photovoltaic power converter
11/08/2000EP1050910A2 Solar module adapted to be installed on vehicles and method of its fabrication
11/08/2000EP1050078A1 Microsystem and method for the production thereof
11/08/2000EP1050077A1 High-density computer modules with stacked parallel-plane packaging
11/08/2000CN1272692A Semiconductor module
11/07/2000US6144571 Semiconductor module, power converter using the same and manufacturing method thereof
11/07/2000US6144101 Flip chip down-bond: method and apparatus
11/07/2000US6144046 Power inverter having series connection of semiconductor devices each having an inverse parallel connection of an insulated gate bipolar transistor and a diode
11/07/2000US6143590 Multi-chip semiconductor device and method of producing the same
11/07/2000US6143582 High density electronic circuit modules
11/07/2000US6143121 Hybrid module and method of manufacturing the same
11/07/2000US6142830 Signaling improvement using extended transmission lines on high speed DIMMS
11/02/2000WO2000065670A1 Flexible organic electronic device with improved resistance to oxygen and moisture degradation
11/02/2000WO2000065665A1 Radiation source
11/02/2000WO2000065652A1 Universal package and method of forming the same
11/02/2000WO2000065648A1 Circuit suitable for vertical integration and method of producing same
11/02/2000EP1049170A1 Miniaturised gamma camera with semiconductor detectors
11/02/2000EP1048075A1 Semiconductor component with several substrate layers and at least one semiconductor chip and method for producing a semiconductor component
11/02/2000EP1047904A1 Lighting system
11/02/2000DE19955100A1 On-board semiconductor device e.g. power converter for motor controller, has control substrate carrying electronic components mounted on external housing by pushing substrate into housing and fastened by screws
11/02/2000DE19918671A1 Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung Vertically integrated circuit, and processes for their preparation
11/02/2000CA2367465A1 Flexible organic electronic device with improved resistance to oxygen and moisture degradation
11/01/2000CN1272225A Solar battery
10/2000
10/31/2000US6141245 Impedance control using fuses
10/31/2000US6140980 Head-mounted display system
10/31/2000US6140700 Semiconductor chip package and method for fabricating the same
10/31/2000US6140699 Molding for holding heat sinks in a clamped stack
10/31/2000US6140697 Semiconductor device
10/31/2000US6140696 Vertically mountable semiconductor device and methods
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