| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/18/2001 | WO2001004967A1 Displaying light source device |
| 01/18/2001 | DE19962763A1 Verfahren zum Vereinzeln eines Wafers Method for separating a wafer |
| 01/18/2001 | DE10011005A1 Multichip module and method for producing a multichip module |
| 01/17/2001 | EP1069686A2 Programmable logic device with unified cell structure including signal interface bumps |
| 01/17/2001 | EP1069645A2 Semiconductor device with an antenna and fabrication method therefor |
| 01/17/2001 | EP1069552A1 Process for assembling a microactuator and a transducer in a hard disk R/W unit |
| 01/17/2001 | EP1069371A2 Light emitting diode device |
| 01/17/2001 | EP1068638A1 Wafer-pair having deposited layer sealed chambers |
| 01/17/2001 | CN2415460Y White illuminating light source of light emitting diode |
| 01/17/2001 | CN1280455A Method for producing electronic device and electronic device and resin filling method |
| 01/16/2001 | US6175345 Electroluminescence device, electroluminescence apparatus, and production methods thereof |
| 01/16/2001 | US6175161 System and method for packaging integrated circuits |
| 01/16/2001 | US6175160 Flip-chip having an on-chip cache memory |
| 01/16/2001 | US6175157 Semiconductor device package for suppressing warping in semiconductor chips |
| 01/11/2001 | WO2001003189A1 Multichip module and method for producing a multichip module |
| 01/11/2001 | WO2001003180A1 Method of subdividing a wafer |
| 01/11/2001 | DE19932051A1 Fahrzeugleuchte Vehicle light |
| 01/11/2001 | DE19931689A1 Planar LED assembly on thermally-conductive board, increases cooling, component packing density and life, whilst permitting active device integration to form display- or illumination panel in or on e.g. vehicle |
| 01/11/2001 | DE19930308A1 Multichip module for complex electronic systems comprises a silicon support substrate with a multi-layered wiring on its components side |
| 01/10/2001 | EP1067603A2 Chip carrier |
| 01/10/2001 | EP1067401A2 Method and apparatus for reading and recording image information |
| 01/10/2001 | EP1067332A2 Vehicle lamp |
| 01/10/2001 | CN1279508A Semiconductor wafer module and its making method |
| 01/09/2001 | US6172878 Multi-element module and production process thereof |
| 01/09/2001 | US6172874 System for stacking of integrated circuit packages |
| 01/09/2001 | US6172425 Encapsulation of transmitter and receiver modules |
| 01/09/2001 | US6172423 Layer-type ball grid array semiconductor package and fabrication method thereof |
| 01/09/2001 | US6172418 Semiconductor device and method for fabricating the same |
| 01/09/2001 | US6172417 Integrated semiconductor devices |
| 01/09/2001 | US6171877 Optical transmitter package assembly and methods of manufacture |
| 01/09/2001 | US6170963 Light source |
| 01/08/2001 | CA2313442A1 Optoelectric component group |
| 01/04/2001 | WO2001001418A1 Semiconductor memory chip module |
| 01/04/2001 | WO2001001180A1 Optomodule |
| 01/04/2001 | WO2001001038A1 Vehicle headlamp and a vehicle |
| 01/04/2001 | WO2001001037A1 Vehicle headlamp and a vehicle |
| 01/04/2001 | DE19928733A1 Halbleiterspeicher-Chipmodul A semiconductor memory chip module |
| 01/04/2001 | DE19909399C1 Flexibles LED-Mehrfachmodul, insb. für ein Leuchtengehäuse eines Kraftfahrzeuges Flexible multiple LED module, esp. For a lamp housing of a motor vehicle |
| 01/04/2001 | CA2377956A1 Optomodule |
| 01/03/2001 | WO2001015223A1 Semiconductor device and method of manufacture thereof |
| 01/03/2001 | EP1065916A2 Resin sealed electronic device |
| 01/03/2001 | EP1065718A1 Semiconductor chip module and method for manufacturing the same |
| 01/03/2001 | EP1064680A1 Wiring method for producing a vertical, integrated circuit structure and vertical, integrated circuit structure |
| 01/03/2001 | EP1063913A1 X-ray detector |
| 01/02/2001 | US6169325 Semiconductor device |
| 01/02/2001 | US6168973 Semiconductor stacked device for implantable medical apparatus and method for making same |
| 01/02/2001 | US6168970 Ultra high density integrated circuit packages |
| 01/02/2001 | US6168969 Surface mount IC using silicon vias in an area array format or same size as die array |
| 12/28/2000 | WO2000079845A1 An arrangement for mounting chips in multilayer printed circuit boards |
| 12/28/2000 | DE19927285A1 Niederinduktives Halbleiterbauelement Niederinduktives semiconductor device |
| 12/27/2000 | EP1063700A2 Substrate for high voltage modules |
| 12/27/2000 | EP1062539A1 Improved photovaltaic generator circuit |
| 12/27/2000 | CN1278365A Electrical interface to integrated device having high density I/O count |
| 12/26/2000 | US6166937 Inverter device with cooling arrangement therefor |
| 12/26/2000 | US6166911 Semiconductor integrated circuit card assembly |
| 12/26/2000 | US6166903 Electronic power module, and electronic power system comprising a plurality of said modules |
| 12/26/2000 | US6166593 Input/output devices for complex integrated circuits, and assembly method thereof |
| 12/26/2000 | US6166464 Power module |
| 12/26/2000 | US6166444 Cascade-type chip module |
| 12/26/2000 | US6166443 Semiconductor device with reduced thickness |
| 12/26/2000 | US6166438 Ultrathin electronics using stacked layers and interconnect vias |
| 12/26/2000 | US6166328 Package stack via bottom leaded plastic (BLP) packaging |
| 12/26/2000 | US6166319 Photovoltaic element having first pin junction i-type layer of microcrystal silicon carbide and second pin junction i-type layer of microcrystal silicon; first junction closer to light incidence side; efficiency, low photodeterioration |
| 12/26/2000 | US6165817 Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections |
| 12/26/2000 | US6165815 Method of fabrication of stacked semiconductor devices |
| 12/26/2000 | CA2014255C Chip package capacitor cover |
| 12/21/2000 | WO2000077827A2 Low-inductance semiconductor component |
| 12/21/2000 | DE19926746A1 Multiple arrangement of circuit boards fitted with LEDs has connecting elements with electrical wiring conductor(s) via which circuits on adjacent boards are electrically connected |
| 12/20/2000 | EP1061588A2 Photo-conductive relay and method of making same |
| 12/20/2000 | EP1061579A2 Stack type multi chip package |
| 12/20/2000 | EP1061578A1 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them |
| 12/20/2000 | EP1060513A1 Semiconductor component with several semiconductor chips |
| 12/20/2000 | EP1060512A1 Vertically integrated circuit system |
| 12/20/2000 | CN2411576Y Ball-grid array permutation base plate with detecting bad quality identification table |
| 12/20/2000 | CN1277737A Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 12/19/2000 | US6163459 Semiconductor mounting system and semiconductor chip |
| 12/19/2000 | US6163456 Hybrid module and methods for manufacturing and mounting thereof |
| 12/19/2000 | US6163076 Stacked structure of semiconductor package |
| 12/19/2000 | US6163070 Semiconductor package utilizing a flexible wiring substrate |
| 12/19/2000 | US6163036 Light emitting element module with a parallelogram-shaped chip and a staggered chip array |
| 12/19/2000 | US6162663 Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
| 12/14/2000 | WO2000076005A1 Photon recycling semiconductor multi-wavelength light-emitting diodes |
| 12/14/2000 | WO2000075991A1 Power feed and heat dissipating device for power semiconductor devices |
| 12/14/2000 | WO2000075985A1 Method for making an integrated circuit portable device with electric conduction paths |
| 12/14/2000 | CA2372440A1 Power feed and heat dissipating device for power semiconductor devices |
| 12/13/2000 | EP1059678A2 Hybrid integrated circuit device |
| 12/13/2000 | EP1059668A2 Hybrid integrated circuit device |
| 12/13/2000 | EP1059667A2 Hybrid integrated circuit device |
| 12/13/2000 | CN2410594Y Solar water heater |
| 12/13/2000 | CN1276917A Optical irradation device |
| 12/13/2000 | CN1276916A Wafer level integration of multiple optical elements |
| 12/13/2000 | CN1276627A IGBT serially connected high-voltage bridge arms |
| 12/12/2000 | US6160967 Camera having flexible printed circuit board |
| 12/12/2000 | US6160718 Multi-chip package with stacked chips and interconnect bumps |
| 12/12/2000 | US6160420 Programmable interconnect architecture |
| 12/12/2000 | US6160326 Power semiconductor packaging |
| 12/12/2000 | US6160312 Enbedded memory assembly |
| 12/12/2000 | US6160218 Chip housing |
| 12/12/2000 | US6159770 Method and apparatus for fabricating semiconductor device |
| 12/12/2000 | US6159767 Single chip modules, repairable multichip modules, and methods of fabrication thereof |