| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/20/2001 | US6204562 Wafer-level chip scale package |
| 03/20/2001 | US6204554 Surface mount semiconductor package |
| 03/20/2001 | US6204552 Semiconductor device |
| 03/20/2001 | US6204545 Semiconductor device |
| 03/20/2001 | US6203658 Processing system and method for making spherical shaped semiconductor integrated circuits |
| 03/15/2001 | WO2001019149A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 03/15/2001 | WO2001019148A1 Printed wiring board and method of producing the same |
| 03/15/2001 | WO2001018864A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 03/15/2001 | WO2001018851A1 Method for integration of integrated circuit devices |
| 03/15/2001 | DE19942915A1 Leistungshalbleitermodul The power semiconductor module |
| 03/15/2001 | DE19942770A1 Leistungshalbleiter-Modul The power semiconductor module |
| 03/14/2001 | EP1083603A2 Power semiconductor module |
| 03/14/2001 | EP1083599A2 Power semiconductor module |
| 03/14/2001 | EP1082572A1 Luminaire with leds |
| 03/14/2001 | CN1287689A Affinity based self-assembly systems and devices for photonic and electronic applications |
| 03/14/2001 | CN1287382A Semiconductor apparatus and its mounting structure |
| 03/13/2001 | US6201408 Hybrid product term and look-up table-based programmable logic device with improved speed and area efficiency |
| 03/13/2001 | US6201297 Semiconductor device |
| 03/13/2001 | US6201266 Semiconductor device and method for manufacturing the same |
| 03/13/2001 | US6201234 Optical operational amplifier |
| 03/13/2001 | US6200830 Fabrication process of a semiconductor device |
| 03/13/2001 | US6200002 Luminaire having a reflector for mixing light from a multi-color array of leds |
| 03/07/2001 | EP1081771A2 Light emitting device |
| 03/07/2001 | EP1081764A1 High-frequency module and method of manufacture thereof |
| 03/07/2001 | EP1081757A1 Multichip module packaging process for known good die burn-in |
| 03/07/2001 | CN1062990C Power source change-over device |
| 03/07/2001 | CN1062981C Indicating lamp of light-emitting diode (LED) |
| 03/06/2001 | US6198615 Voltage unit bus clip |
| 03/06/2001 | US6198164 Ultra high density integrated circuit semiconductor package and method for fabricating the same |
| 03/06/2001 | US6198136 Support chips for buffer circuits |
| 03/01/2001 | WO2001014789A1 Led obstruction lamp |
| 03/01/2001 | DE10033610A1 Semiconductor device for invertor, has contact probe which press contacts with current carrier of control electrode and collector substrate, based on which control signal is transmitted |
| 03/01/2001 | DE10017383A1 Halbleitervorrichtung Semiconductor device |
| 02/27/2001 | US6195742 Semiconductor multi-chip module |
| 02/27/2001 | US6195268 Stacking layers containing enclosed IC chips |
| 02/27/2001 | US6194960 Driver IC |
| 02/27/2001 | US6194247 Warp-resistent ultra-thin integrated circuit package fabrication method |
| 02/22/2001 | WO2001013437A1 Chip semiconductor light-emitting device |
| 02/21/2001 | EP1076915A1 Chip stack and method of making same |
| 02/20/2001 | US6191945 Cold plate arrangement for cooling processor and companion voltage regulator |
| 02/20/2001 | US6191493 Resin seal semiconductor package and manufacturing method of the same |
| 02/20/2001 | US6191474 Vertically mountable interposer assembly and method |
| 02/20/2001 | US6191370 Ball grid array semiconductor package and method of fabricating the same |
| 02/20/2001 | US6190946 Fabricating method of semiconductor package |
| 02/20/2001 | US6190944 Stacked package for semiconductor device and fabrication method thereof, and apparatus for making the stacked package |
| 02/20/2001 | US6190425 Memory bar and related circuits and methods |
| 02/20/2001 | US6190020 Light producing assembly for a flashlight |
| 02/15/2001 | WO2001011697A1 Optocoupler on a metallized pcb and method of manufacturing the same |
| 02/15/2001 | WO2001011662A2 Vapor phase connection techniques |
| 02/14/2001 | EP0695494B1 Electronic module comprising a stack of ic chips |
| 02/14/2001 | CN2419687Y Bidirectional silicon rectifier |
| 02/14/2001 | CN1283871A 半导体器件和存储器模块 Semiconductor devices and memory modules |
| 02/13/2001 | US6188575 Heat exchanging chassis and method |
| 02/13/2001 | US6188527 LED array PCB with adhesive rod lens |
| 02/13/2001 | US6188129 Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer |
| 02/13/2001 | US6188128 Monoblock structure for stacked components |
| 02/13/2001 | US6188127 Semiconductor packing stack module and method of producing the same |
| 02/13/2001 | US6188126 Vertical interconnect process for silicon segments |
| 02/13/2001 | US6188086 Light emitting diode array and optical image forming apparatus with light emitting diode array |
| 02/13/2001 | US6188021 Package stack via bottom leaded plastic (BLP) packaging |
| 02/13/2001 | US6187678 High density integrated circuit packaging with chip stacking and via interconnections |
| 02/08/2001 | WO2001009948A1 Dual wafer attachment process |
| 02/08/2001 | WO2001009941A1 Method for obtaining a high density module, based on encapsulated modular electronic components and resulting module |
| 02/08/2001 | WO2001008549A1 Reduced area imaging devices incorporated within surgical instruments |
| 02/08/2001 | DE19956247A1 Chip component, useful for a memory chip stack, has chip contact pads connected through an adhesive dielectric strip to mounting element conductor lines and solder balls connected to mounting element contact vias |
| 02/08/2001 | DE10036619A1 Semiconducting component has socket-like plug connector for accepting pin or blade-shaped connectors with slot-shaped openings accepting connectors from above and from side |
| 02/08/2001 | CA2345811A1 Reduced area imaging devices incorporated within surgical instruments |
| 02/07/2001 | EP1075021A1 Method of making a high density module made from electronic components, modules, encapsulations and module so obtained |
| 02/06/2001 | US6184587 Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components |
| 02/06/2001 | US6184585 Co-packaged MOS-gated device and control integrated circuit |
| 02/06/2001 | US6184579 Double-sided electronic device |
| 02/06/2001 | US6184133 Method of forming an assembly board with insulator filled through holes |
| 02/06/2001 | US6184060 Integrated circuits and methods for their fabrication |
| 02/06/2001 | US6183100 Light emitting diode 360° warning lamp |
| 02/01/2001 | WO2001008228A1 Bulk lens, light emitting body, lighting device and optical information system |
| 02/01/2001 | WO2001008223A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 02/01/2001 | WO2001008222A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 02/01/2001 | WO2001008092A1 Method for making smart card with reduced format |
| 02/01/2001 | WO2000022682A3 Solid-state photoelectric device |
| 02/01/2001 | DE19933471A1 Image acquisition device with integrated signal processing has photosensitive elements on first layer, circuits in second, lower layer, at least one electrical connection between layers per pixel |
| 02/01/2001 | DE19933265A1 TSOP-Speicherchipgehäuseanordnung TSOP memory chip housing assembly |
| 01/31/2001 | EP1073072A1 Method of making a module with an inductive winding and corresponding module |
| 01/31/2001 | CN1061483C Alternator for vehicle |
| 01/30/2001 | US6181008 Integrated circuit power supply |
| 01/30/2001 | US6181007 Semiconductor device |
| 01/30/2001 | US6181002 Semiconductor device having a plurality of semiconductor chips |
| 01/30/2001 | US6180944 Large area X-ray imager with vented seam and method of fabrication |
| 01/30/2001 | US6180881 Chip stack and method of making same |
| 01/30/2001 | US6180433 Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
| 01/29/2001 | CA2314621A1 Process for obtaining a module including an inductive coil and associated module |
| 01/25/2001 | WO2001006562A1 Tsop memory chip housing arrangement |
| 01/25/2001 | WO2000045420A3 Multiple chip module with integrated rf capabilities |
| 01/24/2001 | EP1071126A2 Microcap wafer-level package with vias |
| 01/24/2001 | EP1070677A2 Microcap wafer-level package |
| 01/24/2001 | EP1004141A4 A system and method for packaging integrated circuits |
| 01/24/2001 | EP0753180B1 Method of manufacturing a chip card, and chip card thus produced |
| 01/23/2001 | US6177834 Output matched LDMOS power transistor device |
| 01/23/2001 | US6177761 LED with light extractor |
| 01/23/2001 | US6177721 Chip stack-type semiconductor package and method for fabricating the same |
| 01/23/2001 | US6177296 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |