| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 04/25/2001 | EP1094697A2 Electronic module |
| 04/25/2001 | EP1094522A1 Imaging device and motion picture camera provided with imaging device |
| 04/25/2001 | EP1094517A2 Semiconductor device and method for producing the same |
| 04/25/2001 | EP1094511A2 Low profile integrated circuit packages |
| 04/25/2001 | EP1094418A2 Chip card |
| 04/24/2001 | US6223273 Electronic circuit package |
| 04/24/2001 | US6222739 High-density computer module with stacked parallel-plane packaging |
| 04/24/2001 | US6222737 Universal package and method of forming the same |
| 04/24/2001 | US6222265 Method of constructing stacked packages |
| 04/24/2001 | US6222259 Stack package and method of fabricating the same |
| 04/24/2001 | US6222246 Flip-chip having an on-chip decoupling capacitor |
| 04/24/2001 | US6220915 Method for manufacturing lamp tiles |
| 04/19/2001 | WO2001028003A1 Face-to-face chips |
| 04/19/2001 | WO2001027997A2 Power semiconductor module |
| 04/19/2001 | WO2000077827A3 Low-inductance semiconductor component |
| 04/19/2001 | DE10006638A1 Semiconductor component formed for combination with substrate or support, with array substrate containing first surface with preset conductive tracks |
| 04/18/2001 | EP1093165A1 Integrated circuit assembly |
| 04/18/2001 | EP1092338A1 Assembly of an electronic component with spring packaging |
| 04/18/2001 | CN1292151A Vertically integrated circuit system |
| 04/18/2001 | CN1064780C Bottom lead semiconductor chip stack package |
| 04/17/2001 | US6219240 Three-dimensional electronic module and a method of its fabrication and repair |
| 04/17/2001 | US6219074 Light-emitting device and recording device using the same |
| 04/17/2001 | US6218729 Apparatus and method for an integrated circuit having high Q reactive components |
| 04/17/2001 | US6218202 Semiconductor device testing and burn-in methodology |
| 04/17/2001 | US6217343 Multipoint conductive sheet |
| 04/12/2001 | WO2001026155A1 Semiconductor device, method and device for producing the same, circuit board, and electronic equipment |
| 04/12/2001 | DE19950026A1 Leistungshalbleitermodul The power semiconductor module |
| 04/12/2001 | DE19946431A1 Stacking arrangement for two semiconductor memory chips |
| 04/12/2001 | DE19945470A1 Verfahren zum Herstellen einer mikrofunktionalen Verbundvorrichtung A method of manufacturing a micro-composite functional device |
| 04/12/2001 | DE10031951A1 Multiple chip semiconducting module has adhesive layers with openings coinciding with contact points, conducting bodies for connecting between first and second chip contact points |
| 04/11/2001 | EP1091404A1 Multifunction lead frame and integrated circuit package incorporating the same |
| 04/11/2001 | EP1090389A1 Data storage and processing apparatus, and method for fabricating the same |
| 04/11/2001 | EP0890297A4 Solder bonded electronic module |
| 04/11/2001 | EP0660967B1 Method for producing integrated circuit devices |
| 04/11/2001 | CN1291374A Electronic component, especially a component working with acoustic surface wave |
| 04/11/2001 | CN1291354A Contrast enhancement for electronic display device |
| 04/11/2001 | CN1291353A Tiled electronic display structure |
| 04/11/2001 | CN1291351A Sealing of large area display device |
| 04/10/2001 | WO2001073843A1 Semiconductor device |
| 04/10/2001 | US6215687 Semiconductor device and process for manufacturing the same |
| 04/10/2001 | US6215670 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 04/10/2001 | US6215193 Multichip modules and manufacturing method therefor |
| 04/10/2001 | US6215182 Semiconductor device and method for producing the same |
| 04/10/2001 | US6215171 IC module |
| 04/10/2001 | US6214648 Semiconductor chip package and method for fabricating the same |
| 04/10/2001 | US6214641 Method of fabricating a multi-chip module |
| 04/10/2001 | US6213747 Package stack via bottom leaded plastic (BLP) packaging |
| 04/10/2001 | US6212767 Assembling a stacked die package |
| 04/10/2001 | CA2301714C Reduced area imaging devices incorporated within surgical instruments |
| 04/06/2001 | CA2321537A1 Multifunction lead frame and integrated circuit package incorporating the same |
| 04/05/2001 | WO2001024583A1 Light emitting diode (led) lamp |
| 04/05/2001 | WO2001024281A1 Optoelectronic component that comprises a reflector and method for producing said component |
| 04/05/2001 | WO2001024256A1 Method for the tri-dimensional integration of micro-electronic systems |
| 04/05/2001 | US20010000157 Semiconductor device and method of making the same |
| 04/05/2001 | DE10031952A1 Mehrchip-Halbleitermodul und Herstellungsverfahren dafür A multi-chip semiconductor module, and manufacturing method thereof |
| 04/04/2001 | EP1089375A2 High frequency circuit module and communication device |
| 04/04/2001 | EP1089336A2 Integrated circuit packages with improved EMI characteristics |
| 04/04/2001 | EP1089333A2 Rectifying circuit for an alternator of a motor vehicle |
| 04/04/2001 | EP1088470A1 Ic stack utilizing flexible circuits with bga contacts |
| 04/04/2001 | EP1088386A1 Half bridge module |
| 04/04/2001 | EP1088350A1 Lighting system |
| 04/04/2001 | EP1088343A1 Scaleable integrated data processing device |
| 04/04/2001 | CN1064194C Monolithic integrated circuit device having microwave power amplifer |
| 04/03/2001 | US6212648 Memory module having random access memories with defective addresses |
| 04/03/2001 | US6212087 Electronic half bridge module |
| 04/03/2001 | US6211904 Surgical devices incorporating reduced area imaging devices |
| 04/03/2001 | US6211564 Integrated circuit package having stepped terminals |
| 04/03/2001 | US6210993 High density semiconductor package and method of fabrication |
| 04/03/2001 | US6210175 Socket rails for stacking integrated circuit components |
| 03/29/2001 | WO2001022492A1 Method for producing a microfunctional composite device |
| 03/29/2001 | DE19946259A1 Gleichrichteranordnung Rectifier arrangement |
| 03/29/2001 | DE10047963A1 Making multilayer thin film component, assembles component units, each carrying component layers on supportive substrates |
| 03/28/2001 | CN2425428Y LED light-emitting device with built-in constant-current source |
| 03/28/2001 | CN1289397A 照明系统 Lighting system |
| 03/27/2001 | US6208579 Stackable microelectronic components with self-addressing scheme |
| 03/27/2001 | US6208546 Memory module |
| 03/27/2001 | US6208545 Three dimensional structure memory |
| 03/27/2001 | US6208526 Mounting multiple substrate frame and leadless surface mountable assembly using same |
| 03/27/2001 | US6208525 Process for mounting electronic device and semiconductor device |
| 03/27/2001 | US6208521 Film carrier and laminate type mounting structure using same |
| 03/27/2001 | US6208493 Method and system for protecting integrated circuits against a variety of transients |
| 03/27/2001 | US6208078 Display device and display device assembly |
| 03/27/2001 | US6208018 Piggyback multiple dice assembly |
| 03/27/2001 | US6207890 Photovoltaic element and method for manufacture thereof |
| 03/27/2001 | US6207474 Method of forming a stack of packaged memory die and resulting apparatus |
| 03/27/2001 | US6206705 Three-dimensional modular electronic interconnection system |
| 03/27/2001 | US6206269 Soldering of a semiconductor chip to a substrate |
| 03/27/2001 | US6205654 Method of manufacturing a surface mount package |
| 03/22/2001 | WO2001020955A1 A printed circuit board assembly |
| 03/22/2001 | WO2001020688A1 A method of manufacturing a light emitting diode unit body |
| 03/22/2001 | WO2001020670A1 Connection arrangement for enabling the use of identical chips in 3-dimensional stacks of chips requiring addresses specific to each chip |
| 03/22/2001 | US20010000053 Chip stack-type semiconductor package and method for fabricating the same |
| 03/21/2001 | EP1085594A2 High frequency circuit apparatus |
| 03/21/2001 | EP1085573A1 Method of decreasing the mutual inductance between bond wires in a high frequency amplifying circuit |
| 03/21/2001 | EP1085561A1 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 03/21/2001 | CN1288255A Semiconductor device chip scale surface assembling and packaging, and mfg. method therefor |
| 03/20/2001 | US6205031 Electronic control apparatus |
| 03/20/2001 | US6205024 Heat sink for rectifier |
| 03/20/2001 | US6204690 FPGA architecture with offset interconnect lines |
| 03/20/2001 | US6204581 Commutator heat dissipating device for alternators |