| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/31/2001 | US20010002065 Integrated circuit package having interchip bonding and method therefor |
| 05/31/2001 | US20010002051 Semiconductor device |
| 05/31/2001 | DE10056832A1 Semiconductor module has printed circuit board with opening aligned with heat dissipation surface of substrate, which is fastened directly on the heat sink using screw |
| 05/30/2001 | EP1104025A1 Semiconductor device |
| 05/30/2001 | EP1104024A2 Semiconductor package and method for forming semiconductor package |
| 05/30/2001 | EP1103759A2 Full-color light source unit |
| 05/30/2001 | CN1297252A Multi-chip module device and its making method |
| 05/29/2001 | US6239987 Case for semiconductor circuit of a surge protector |
| 05/29/2001 | US6239981 Packaging substrate |
| 05/29/2001 | US6239980 Multimodule interconnect structure and process |
| 05/29/2001 | US6239612 Programmable I/O cells with multiple drivers |
| 05/29/2001 | US6239496 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same |
| 05/29/2001 | US6239495 Multichip semiconductor device and memory card |
| 05/29/2001 | US6239486 Semiconductor device having cap |
| 05/29/2001 | US6239484 Underfill of chip-under-chip semiconductor modules |
| 05/29/2001 | US6239483 Semiconductor device |
| 05/29/2001 | US6239381 Circuit board for a semiconductor device and method of making the same |
| 05/29/2001 | US6239367 Multi-chip chip scale package |
| 05/29/2001 | US6239366 Face-to-face multi-chip package |
| 05/29/2001 | US6239355 Solid-state photoelectric device |
| 05/29/2001 | US6239012 Vertically mountable semiconductor device and methods |
| 05/29/2001 | US6238949 Method and apparatus for forming a plastic chip on chip package module |
| 05/29/2001 | CA2274577C Injection molding encapsulation for an electronic device directly onto a substrate |
| 05/29/2001 | CA2202576C Electronic circuit assembly |
| 05/25/2001 | WO2001037376A1 Arrangement for electrically connecting chips in a circuit that is embodied in a three-dimensional manner |
| 05/25/2001 | WO2001037351A1 Multi color solid state led/laser |
| 05/25/2001 | WO2001037336A1 Multi-chip module for use in high-power applications |
| 05/25/2001 | WO2001037332A1 A high density hybrid integrated circuit package having a flip-con structure |
| 05/25/2001 | WO2000063950A3 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 05/23/2001 | DE19954895A1 Anordnung zur elektrischen Verbindung zwischen Chips in einer dreidimensional ausgeführten Schaltung Arrangement for electrical connection between circuit chips in a three-dimensionally performed |
| 05/23/2001 | CN1296642A RF circuit module |
| 05/22/2001 | US6236232 Multi-purpose transistor array |
| 05/22/2001 | US6236115 High density integrated circuit packaging with chip stacking and via interconnections |
| 05/22/2001 | US6236111 Hybrid circuit substrate mountable micro-electromechanical component |
| 05/22/2001 | US6236110 Power semiconductor module |
| 05/22/2001 | US6236109 Multi-chip chip scale package |
| 05/22/2001 | US6235554 Method for fabricating stackable chip scale semiconductor package |
| 05/22/2001 | US6235141 Method of mass producing and packaging integrated optical subsystems |
| 05/22/2001 | US6234645 LED lighting system for producing white light |
| 05/17/2001 | WO2001035457A1 Wafer level application of tack-free die-attach adhesive film |
| 05/17/2001 | WO2001011662A3 Vapor phase connection techniques |
| 05/17/2001 | WO2001003189A8 Multichip module and method for producing a multichip module |
| 05/17/2001 | US20010001215 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
| 05/17/2001 | DE19947044A1 Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben Surface-mountable optoelectronic component with a reflector and method of manufacturing the same |
| 05/16/2001 | EP1099953A2 Semiconductor device with testing capability |
| 05/16/2001 | EP1099601A2 Vehicle light |
| 05/16/2001 | EP1099255A1 Method for producing and separating semiconductor light-emitting diodes |
| 05/15/2001 | US6232668 Semiconductor device of chip-on-chip structure and semiconductor chip for use therein |
| 05/15/2001 | US6232667 Technique for underfilling stacked chips on a cavity MLC module |
| 05/15/2001 | US6232659 Thin multichip module |
| 05/15/2001 | US6232654 Semiconductor module |
| 05/15/2001 | US6232136 Method of transferring semiconductors |
| 05/10/2001 | WO2001033641A1 Semiconductor light-emitting device |
| 05/10/2001 | WO2001033638A1 Optical semiconductor housing and method for making same |
| 05/10/2001 | WO2001033637A1 Optical semiconductor housing and method for making same |
| 05/10/2001 | WO2001033636A1 Optical semiconductor housing and method for making same |
| 05/10/2001 | WO2001033635A1 Optical semiconductor housing and method for making same |
| 05/10/2001 | WO2001033632A1 Planar hybrid diode rectifier bridge |
| 05/10/2001 | WO2001033623A1 Semiconductor device and its manufacturing method |
| 05/10/2001 | WO2001033607A2 Laser diode device and method for producing the same |
| 05/10/2001 | DE19953132A1 Fahrzeugleuchte Vehicle light |
| 05/10/2001 | DE19952712A1 Laserdiodenvorrichtung Laser diode device |
| 05/10/2001 | CA2356323A1 Laser diode device and method for the manufacture thereof |
| 05/09/2001 | EP1098373A2 A semiconductor light source |
| 05/09/2001 | EP1098369A2 Semiconductor module and inverter device |
| 05/09/2001 | EP1098368A1 Module component and method of manufacturing the same |
| 05/09/2001 | EP1098135A2 Vehicle light |
| 05/09/2001 | EP1097479A1 Integrated electronic micromodule and method for making same |
| 05/09/2001 | EP1097467A1 Ic stack utilizing secondary leadframes |
| 05/09/2001 | CN1294758A High-frequency module and method of manufacture thereof |
| 05/09/2001 | CN1065662C Semiconductor chip package and mfg. method thereof |
| 05/09/2001 | CN1065660C Substrate for semiconductor package, fabrication method thereof, and package of semiconductor |
| 05/08/2001 | US6229321 Process for manufacturing high frequency multichip module enabling independent test of bare chip |
| 05/08/2001 | US6229217 Semiconductor device and method of manufacturing the same |
| 05/08/2001 | US6229216 Silicon interposer and multi-chip-module (MCM) with through substrate vias |
| 05/08/2001 | US6229215 Semiconductor device and manufacturing method thereof |
| 05/08/2001 | US6229180 MOS type semiconductor apparatus |
| 05/08/2001 | US6229158 Stacked die integrated circuit device |
| 05/08/2001 | US6228682 Multi-cavity substrate structure for discrete devices |
| 05/08/2001 | US6228675 Microcap wafer-level package with vias |
| 05/08/2001 | US6228548 Dividing semiconductor substrate; dielectric isolation |
| 05/08/2001 | US6227679 Led light bulb |
| 05/08/2001 | CA2219516C A voltage source converter |
| 05/03/2001 | WO2001031704A1 Semiconductor device |
| 05/03/2001 | US20010000631 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 05/03/2001 | US20010000630 Enbedded memory assembly |
| 05/03/2001 | DE19946715C1 Verfahren zur dreidimensionalen Integration mikroelektronischer Systeme A method for three-dimensional integration of microelectronic systems |
| 05/03/2001 | DE10049551A1 Connection structure for stackable semiconductor chips e.g. LSI chips, has bump electrode and contact spot electrode at top and bottom faces of chip, and connecting electrodes at front and rear of chip |
| 05/02/2001 | EP1096567A2 BGA package and method for fabricating the same |
| 05/02/2001 | CN2428867Y IGBT series direct high-pressure arm |
| 05/02/2001 | CN1293453A Electronics module |
| 05/01/2001 | US6225691 Integrated circuit packaging structure |
| 05/01/2001 | US6225689 Low profile multi-IC chip package connector |
| 05/01/2001 | US6225688 Stacked microelectronic assembly and method therefor |
| 05/01/2001 | US6225139 Manufacturing method of an led of a type of round concave cup with a flat bottom |
| 05/01/2001 | US6223429 Method of production of semiconductor device |
| 04/26/2001 | WO2001029904A1 Luminescent diode device |
| 04/26/2001 | WO2001029881A2 Method of making an optoelectronic device using multiple etch stop layers |
| 04/26/2001 | DE19950524A1 Chipkarte Smart card |
| 04/26/2001 | DE19933060A1 Leuchtdiodenanordnung LED arrangement |