| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 07/10/2001 | US6258626 Method of making stacked chip package |
| 07/10/2001 | US6258623 Low profile multi-IC chip package connector |
| 07/10/2001 | US6257215 Resin-sealed electronic apparatus for use in internal combustion engines |
| 07/05/2001 | US20010006829 Low profile multi-IC chip package connector |
| 07/05/2001 | US20010006828 Coupling semiconductor dies to shelves |
| 07/05/2001 | US20010006258 Stacked semiconductor package and fabricating method thereof |
| 07/05/2001 | US20010006257 Method of fabricating a three-dimensional system-on-chip and its structure |
| 07/05/2001 | US20010006252 Stacked microelectronic assembly and method therefor |
| 07/05/2001 | US20010006219 Optical information processing apparatus |
| 07/05/2001 | US20010006118 Non-contact type IC card and process for manufacturing same |
| 07/05/2001 | US20010005935 Assembling a stacked die package |
| 07/04/2001 | EP1113428A2 Package structure for a hybrid optical module and method of producing the same |
| 07/04/2001 | CN1302457A Lighting system |
| 07/04/2001 | CN1302176A Single system module for electric/electronic equiopment |
| 07/03/2001 | US6256206 Electronic circuit for an active implantable medical device and method of manufacture |
| 07/03/2001 | US6256203 Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
| 07/03/2001 | US6255899 Method and apparatus for increasing interchip communications rates |
| 07/03/2001 | US6255736 Three-dimensional MCM, method for manufacturing the same, and storage medium storing data for the method |
| 07/03/2001 | US6255729 Multi chip package (MCP) applicable to failure analysis mode |
| 07/03/2001 | US6255726 Vertical interconnect process for silicon segments with dielectric isolation |
| 07/03/2001 | US6255672 Semiconductor device |
| 07/03/2001 | US6255600 Electronic interconnection medium having offset electrical mesh plane |
| 07/03/2001 | US6255135 Quad flat pack integrated circuit package |
| 07/03/2001 | US6255002 To a capsule in an rf-power transistor. |
| 07/03/2001 | US6254423 Power diode terminal holder mounting arrangement |
| 07/03/2001 | CA2204432C Arrays of optoelectronic devices and method of making same |
| 06/28/2001 | WO2001047039A1 Method of making a iii-nitride light-emitting device with increased light generating capability |
| 06/28/2001 | WO2001047037A1 Light output enhancement using light emitting diodes |
| 06/28/2001 | WO2001046716A2 Electro-optical transceiver system with controlled lateral leakage and method of making it |
| 06/28/2001 | US20010005602 Multi-chip bonding method and apparatus |
| 06/28/2001 | US20010005601 Semiconductor Package Having Semiconductor Chip Within Central Aperture Of Substrate |
| 06/28/2001 | US20010005600 Method of manufacturing semiconductor device including semiconductor elements mounted on base plate |
| 06/28/2001 | US20010005313 Unit interconnection substrate, interconnection substrate, mount structure of electronic parts, electronic device, method for mounting electronic parts, and method for manufacturing electronic device |
| 06/28/2001 | US20010005059 Three-dimensional semiconductor integrated circuit apparatus and manufacturing method therefor |
| 06/28/2001 | US20010005046 Direct contact through hole type wafer structure |
| 06/28/2001 | US20010005044 Microelectronic assemblies having exposed conductive terminals and methods therefor |
| 06/28/2001 | US20010005042 Method of manufacturing a surface mount package |
| 06/28/2001 | US20010004802 Assembling a stacked die package |
| 06/28/2001 | DE10048377A1 Semiconductor power module used as a power transistor comprises a conductor frame, a power switching circuit, an insulator, and a seal |
| 06/28/2001 | CA2829416A1 Solution processed devices |
| 06/27/2001 | EP1111970A2 Circuit board for use at high voltage |
| 06/27/2001 | EP1111677A2 Cooling structure for multichip module |
| 06/27/2001 | EP1111676A2 Unit interconnection substrate for electronic parts |
| 06/27/2001 | EP1111674A2 Circuit component built-in module, radio device having the same, and method for producing the same |
| 06/27/2001 | EP1111672A2 Semiconductor chip assemblies, methods of making same and components for same |
| 06/27/2001 | EP1110739A2 Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources |
| 06/27/2001 | EP1110242A1 Thermal capacity for electronic component operating in long pulses |
| 06/26/2001 | US6252775 Electronic apparatus having printed circuit board module accommodated in case thereof |
| 06/26/2001 | US6252350 Surface mounted LED lamp |
| 06/26/2001 | US6252305 Multichip module having a stacked chip arrangement |
| 06/26/2001 | US6252300 Direct contact through hole type wafer structure |
| 06/26/2001 | US6252299 Stacked semiconductor device including improved lead frame arrangement |
| 06/26/2001 | US6252264 Integrated circuit chip with features that facilitate a multi-chip module having a number of the chips |
| 06/26/2001 | US6252175 Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate |
| 06/26/2001 | US6251705 Low profile integrated circuit packages |
| 06/26/2001 | US6251695 Multichip module packaging process for known good die burn-in |
| 06/26/2001 | US6250775 Light-emitting diode display systems and methods with enhanced light intensity |
| 06/21/2001 | WO2001045476A1 A module including one or more chips |
| 06/21/2001 | WO2001045181A1 Led lamp having female type leads formed on pcb |
| 06/21/2001 | WO2001045169A1 Power transistor module, power amplifier and methods in the fabrication thereof |
| 06/21/2001 | WO2001045140A2 Encapsulation for organic led device |
| 06/21/2001 | US20010004130 Semiconductor device and production method thereof |
| 06/20/2001 | EP1108181A1 Vehicle headlamp and a vehicle |
| 06/19/2001 | US6249052 Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration |
| 06/19/2001 | US6249024 Power module with repositioned positive and reduced inductance and capacitance |
| 06/19/2001 | US6248948 Solar cell module and method of producing the same |
| 06/14/2001 | WO2001043193A2 Dual-die integrated circuit package |
| 06/14/2001 | WO2001043188A1 Electronic part module, method of producing the same, etc. |
| 06/14/2001 | WO2001043109A2 Light-emitting diode display systems and methods with enhanced light intensity |
| 06/14/2001 | US20010003656 Electronic device assembly and a method of connecting electronic devices constituting the same |
| 06/14/2001 | US20010003375 Dual-die integrated circuit package |
| 06/14/2001 | CA2392975A1 Dual-die integrated circuit package |
| 06/13/2001 | EP1107312A2 Multiple line grids incorporating therein circuit elements |
| 06/13/2001 | EP1107210A2 LED signal emitter comprising a plurality of LED zones |
| 06/13/2001 | EP1105922A1 Combination positive temperature coefficient resistor and metal-oxide semiconductor field-effect transistor devices |
| 06/12/2001 | US6246429 Light emitting diode substrate and its manufacturing method |
| 06/12/2001 | US6246247 Probe card assembly and kit, and methods of using same |
| 06/12/2001 | US6246114 Semiconductor device and resin film |
| 06/12/2001 | US6246010 High density electronic package |
| 06/12/2001 | US6245630 Spherical shaped semiconductor integrated circuit |
| 06/07/2001 | WO2001041519A1 Electronic power module and method for making same |
| 06/07/2001 | WO2001041225A2 Enhanced light extraction in leds through the use of internal and external optical elements |
| 06/07/2001 | WO2001041219A1 Micro-led arrays with enhanced light extraction |
| 06/07/2001 | WO2001041215A1 Hybrid white light source comprising led and phosphor-led |
| 06/07/2001 | WO2001041207A1 Packaging of integrated circuits and vertical integration |
| 06/07/2001 | US20010003049 Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
| 06/07/2001 | US20010002727 Semiconductor device and module of the same |
| 06/07/2001 | US20010002726 Semiconductor device and method for making the same |
| 06/07/2001 | US20010002624 Tip structures. |
| 06/07/2001 | DE10042269A1 Semiconductor package for DIMM (dual in-line memory module), has length larger than body width and smaller than total package width |
| 06/06/2001 | EP1104584A1 Conductor frame, printed circuit board with a conductor frame and a method for producing a conductor frame |
| 06/06/2001 | CN1066865C AC generator and its equiped connector |
| 06/05/2001 | US6243283 Impedance control using fuses |
| 06/05/2001 | US6242803 Semiconductor devices with integral contact structures |
| 06/05/2001 | US6242798 Stacked bottom lead package in semiconductor devices |
| 06/05/2001 | US6242285 Stacked package of semiconductor package units via direct connection between leads and stacking method therefor |
| 06/05/2001 | US6242280 Method of interconnecting an electronic device |
| 06/05/2001 | US6240634 Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board |
| 05/31/2001 | US20010002163 Process for mounting electronic device and semiconductor device |
| 05/31/2001 | US20010002162 Process for mounting electronic device and semiconductor device |