| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/14/2001 | US6275255 Reduced area imaging devices |
| 08/14/2001 | US6275158 Device arranged for contactless communication and provided with a data carrier with fully enclosed connection means for electrically connecting a chip and a passive component |
| 08/14/2001 | US6274980 Single-color stacked organic light emitting device |
| 08/14/2001 | US6274929 Stacked double sided integrated circuit package |
| 08/14/2001 | US6274823 Interconnection substrates with resilient contact structures on both sides |
| 08/14/2001 | US6273589 Solid state illumination source utilizing dichroic reflectors |
| 08/09/2001 | WO2001057937A1 Concentrically leaded power semiconductor device package |
| 08/09/2001 | WO2001057924A1 Semiconductor component with contacts provided on the lower side thereof, and method for producing the same |
| 08/09/2001 | WO2001056458A1 Surgical devices incorporating reduced area imaging devices |
| 08/09/2001 | US20010012646 Semiconductor chip module and method for manufacturing the same |
| 08/09/2001 | US20010012645 Semiconductor devices and the manufacturing method |
| 08/09/2001 | US20010012643 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same |
| 08/09/2001 | US20010012638 Vertically mountable semiconductor device and methods |
| 08/09/2001 | US20010012526 Package stack via bottom leaded plastic (BLP) packaging |
| 08/09/2001 | US20010012200 LED package |
| 08/09/2001 | US20010012047 Optical apparatus and method of manufacturing optical apparatus |
| 08/09/2001 | US20010011757 Pressure-contact type semiconductor device |
| 08/09/2001 | US20010011552 Solar cell module |
| 08/09/2001 | CA2368245A1 Surgical devices incorporating reduced area imaging devices |
| 08/08/2001 | EP1122786A2 High performance multi-chip IC package |
| 08/08/2001 | EP1122778A2 Circuit device and manufacturing method of circuit device |
| 08/08/2001 | EP1122777A2 Semiconductor device and semiconductor modul using the same |
| 08/08/2001 | EP1121840A1 Soldering of a semiconductor chip to a substrate |
| 08/08/2001 | EP1121603A1 Method and system for manufacturing lamp tiles |
| 08/08/2001 | CN1307793A Assembly of an electronic component with spring packaging |
| 08/07/2001 | US6272015 Power semiconductor module with insulation shell support for plural separate substrates |
| 08/07/2001 | US6271607 Sub-assemblies with electronic components, for motor vehicle alternators |
| 08/07/2001 | US6271601 Wire bonding method and apparatus and semiconductor device |
| 08/07/2001 | US6271598 Conductive epoxy flip-chip on chip |
| 08/07/2001 | US6271587 Connection arrangement for enbaling the use of identical chips in 3-dimensional stacks of chips requiring address specific to each chip |
| 08/07/2001 | US6271060 Process of fabricating a chip scale surface mount package for semiconductor device |
| 08/07/2001 | US6271056 Stacked semiconductor package and method of fabrication |
| 08/07/2001 | US6270236 L.E.D Lighting unit with transparent carrier panel |
| 08/02/2001 | WO2001056079A2 A method for transferring and stacking of semiconductor devices |
| 08/02/2001 | WO2001056067A1 Micro electro-mechanical component and system architecture |
| 08/02/2001 | US20010010625 Method and apparatus for increasing memory capacity |
| 08/02/2001 | US20010010398 Multi-cavity substrate structure for discrete devices |
| 08/02/2001 | US20010010397 Semiconductor device and a method of manufacturing the same |
| 08/02/2001 | US20010010396 Semiconductor device and semiconductor module using the same |
| 08/02/2001 | US20010010379 MOS type semiconductor apparatus |
| 08/02/2001 | DE10002852A1 Abschirmeinrichtung und elektrisches Bauteil mit einer Abschirmeinrichtung Shielding and electrical component with a shielding |
| 08/01/2001 | EP1120834A2 Insulated gate semiconductor device and manufacturing method thereof |
| 08/01/2001 | EP1120831A2 Electronic component with an electromagnetic shielding device |
| 07/31/2001 | US6268649 Stackable ball grid array package |
| 07/31/2001 | US6268642 Wafer level package |
| 07/31/2001 | US6268238 Three dimensional package and architecture for high performance computer |
| 07/31/2001 | US6268016 Electroless deposition of metals |
| 07/26/2001 | WO2001054189A1 Method of joining components |
| 07/26/2001 | US20010010064 Semiconductor multi-chip module |
| 07/26/2001 | US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging |
| 07/26/2001 | US20010009504 One system module |
| 07/26/2001 | US20010009379 Programmable I/O cells with multiple drivers |
| 07/26/2001 | US20010009342 Electronic component and method of production thereof |
| 07/26/2001 | US20010009301 Semiconductor devices having different package sizes made by using common parts |
| 07/26/2001 | DE10101086A1 Power semiconductor module for LV applications has insulating molded housing providing peripheral frame enclosing conductor frame with terminal surfaces and projecting termination lines |
| 07/25/2001 | EP1119049A2 Laminate type semiconductor apparatus |
| 07/25/2001 | EP1119037A2 Semiconductor device and method of manufacturing thereof |
| 07/25/2001 | EP1117324A1 Reduced area imaging devices incorporated within surgical instruments |
| 07/24/2001 | US6266265 Memory module using a vacant pin terminal for balancing parasitic capacitive loads |
| 07/24/2001 | US6266246 Multi-chip module having interconnect dies |
| 07/24/2001 | US6265783 Resin overmolded type semiconductor device |
| 07/24/2001 | US6265773 Vertically mountable and alignable semiconductor device, assembly, and methods |
| 07/24/2001 | US6265772 Stacked semiconductor device |
| 07/24/2001 | US6265771 Dual chip with heat sink |
| 07/24/2001 | US6265760 Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the same |
| 07/24/2001 | US6265660 Package stack via bottom leaded plastic (BLP) packaging |
| 07/24/2001 | US6265653 High voltage photovoltaic power converter |
| 07/24/2001 | US6265246 Microcap wafer-level package |
| 07/19/2001 | WO2001052330A1 An led in the shape of cup with a curved surface and planar bottom |
| 07/19/2001 | WO2001052184A2 Chipcard arrangement |
| 07/19/2001 | US20010008794 Semiconductor device and manufacturing method therefor |
| 07/19/2001 | US20010008482 Integrated device and method for routing a signal through the device |
| 07/19/2001 | US20010008310 Method for forming bumps, semiconductor device, and solder paste |
| 07/19/2001 | US20010008306 Laminate type semiconductor apparatus |
| 07/19/2001 | US20010008302 Semiconductor device |
| 07/19/2001 | DE10031678A1 Power semiconductor module has intermediate connection terminal and connection piece for providing releasable connection between control semiconductor element and power semiconductor |
| 07/18/2001 | EP1117137A2 Photoelectric conversion device |
| 07/18/2001 | EP1117135A2 Led package |
| 07/18/2001 | CN1304186A Circular arc flat-bottom cupped light emitting diode manufacturing method |
| 07/18/2001 | CN1304125A Unit and device for plane display |
| 07/18/2001 | CN1068546C Semiconductor device |
| 07/17/2001 | US6262902 Power conversion component with integral output current shunt and its manufacturing method |
| 07/17/2001 | US6262895 Stackable chip package with flex carrier |
| 07/17/2001 | US6262513 Electronic component and method of production thereof |
| 07/17/2001 | US6262488 Semiconductor memory module having double-sided memory chip layout |
| 07/17/2001 | US6262483 Semiconductor chip module and method for manufacturing the same |
| 07/17/2001 | US6262476 Composite member composed of at least two integrated circuits and method for the manufacture of a composite member composed of at least two integrated circuits |
| 07/17/2001 | US6262474 Semiconductor device |
| 07/17/2001 | US6262362 Radiation shielding of three dimensional multi-chip modules |
| 07/17/2001 | US6261865 Multi chip semiconductor package and method of construction |
| 07/17/2001 | US6261508 Method for making a shielding composition |
| 07/12/2001 | WO2001050525A2 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 07/12/2001 | US20010007428 Interconnect structure for a programmable logic device |
| 07/12/2001 | US20010007360 Light emitting diode module |
| 07/11/2001 | EP1115274A1 Electrical power module and method for its manufacture |
| 07/11/2001 | EP1115155A2 Optical information processing apparatus |
| 07/11/2001 | EP1115154A1 Power semiconductor module and motor drive system |
| 07/11/2001 | EP1115086A2 Non-contact type IC card and process for manufacturing same |
| 07/11/2001 | EP1113945A1 Systems and components for enhancing rear vision from a vehicle |
| 07/10/2001 | US6259157 Hybrid integrated circuit device, and method of manufacturing thereof |