| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/12/2001 | EP1132964A2 Wiring arrangement of power semiconductors in modules |
| 09/12/2001 | EP1131784A1 Self-adhesive electronic circuit |
| 09/12/2001 | CN2447620Y Luminescent diode cup lamp |
| 09/12/2001 | CN1312673A Electronic element with protective box and production method thereof |
| 09/12/2001 | CN1071064C Power semiconductor module |
| 09/11/2001 | US6288924 Semiconductor device and process for manufacturing the same |
| 09/11/2001 | US6288909 Conductive via feed through for double-sided modules |
| 09/11/2001 | US6288907 High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief |
| 09/11/2001 | US6288561 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 09/11/2001 | US6288445 Semiconductor device |
| 09/11/2001 | US6288443 Chip module and manufacture of same |
| 09/11/2001 | US6287949 Multi-chip semiconductor chip module |
| 09/11/2001 | US6287940 Forming thermosensitive and heat resistant microstructures on separate substrates, then joining them with bonding material |
| 09/11/2001 | US6287892 Shock-resistant semiconductor device and method for producing same |
| 09/11/2001 | US6287164 Method and system for manufacturing a molded body |
| 09/07/2001 | WO2001065605A1 Semiconductor device |
| 09/07/2001 | WO2001065602A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 09/06/2001 | US20010019371 Method of transferring semiconductors |
| 09/06/2001 | US20010019172 Lead frame, circuit board with lead frame, and method for producing the lead frame |
| 09/06/2001 | US20010019170 Multichip module having a stacked chip arrangement |
| 09/06/2001 | DE10062109A1 Electric system module for electronic products, has power pins and signal pins arranged on three edges of case |
| 09/05/2001 | EP1130660A1 Chip semiconductor light-emitting device |
| 09/05/2001 | EP1130647A2 Procedure for the wafer scale integration of gallium arsenide based optoelectronic devices with silicon based integrated circuits |
| 09/05/2001 | EP1130642A1 High frequency module |
| 09/05/2001 | EP1129496A2 Solid-state photoelectric device |
| 09/05/2001 | EP1129491A1 Large area x-ray imager with vented seam and method of fabrication |
| 09/05/2001 | CN1311898A Scaleable integrated data processing device |
| 09/05/2001 | CN1311528A Semiconductor device and its mfg. method, circuit plate and electronic device |
| 09/04/2001 | US6285561 Data carrier module device having integrated circuit and transmission coil connection contacts covered by a common protective cap |
| 09/04/2001 | US6285559 Multichip module |
| 09/04/2001 | US6285558 Microprocessor subsystem module for PCB bottom-side BGA installation |
| 09/04/2001 | US6285553 Mounting structure for an LSI |
| 09/04/2001 | US6285552 Rectifier of an alternating current generator for vehicle |
| 09/04/2001 | US6285084 Semiconductor device |
| 09/04/2001 | US6285076 Press-connection semiconductor device and press-connection semiconductor assembly |
| 08/30/2001 | WO2001063671A1 Power converter and method for producing the same |
| 08/30/2001 | WO2001063669A1 Microwave electric elements using porous silicon dioxide layer and forming method of same |
| 08/30/2001 | WO2001063664A2 Power conditioning substrate stiffener |
| 08/30/2001 | WO2001063646A2 Multi-layered multi-chip module |
| 08/30/2001 | US20010017407 Method and apparatus for a semiconductor package for vertical surface mounting |
| 08/30/2001 | US20010017406 Stacked structure of stackable semiconductor packages and method of stacking same |
| 08/30/2001 | DE10008203A1 Manufacturing electronic semiconducting components involves attaching semiconducting body to conductive substrate, making electrical connections, encapsulating body, dividing substrate |
| 08/29/2001 | EP1128435A2 Microwave electric elements using porous silicon dioxide layer and forming method of same |
| 08/29/2001 | EP1128434A2 Multi-layered multi-chip module for high frequencies |
| 08/29/2001 | CN1310790A Luminaire with LEDS |
| 08/29/2001 | CN1310580A Electronic element and its producing method |
| 08/29/2001 | CN1310474A Large power semiconductor assembly capable of relieving mechanical stress |
| 08/29/2001 | CN1310307A Making process of lamp strip or lamp string |
| 08/28/2001 | US6282100 Low cost ball grid array package |
| 08/28/2001 | US6282098 Electronic circuit module, electronic circuit module connecting structure and connecting member, and method for connecting the same |
| 08/28/2001 | US6282092 Electronic circuit device and method of fabricating the same |
| 08/28/2001 | US6281756 Transistor with internal matching circuit |
| 08/28/2001 | US6281590 Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module |
| 08/28/2001 | US6281579 Insert-molded leadframe to optimize interface between powertrain and driver board |
| 08/28/2001 | US6281578 Multi-chip module package structure |
| 08/28/2001 | US6281577 Chips arranged in plurality of planes and electrically connected to one another |
| 08/28/2001 | US6281576 Method of fabricating structure for chip micro-joining |
| 08/28/2001 | US6281569 Pressure-contact semiconductor device |
| 08/28/2001 | US6281561 Multicolor-color sensor |
| 08/28/2001 | US6281426 Multi-junction, monolithic solar cell using low-band-gap materials lattice matched to GaAs or Ge |
| 08/28/2001 | US6281042 Structure and method for a high performance electronic packaging assembly |
| 08/28/2001 | US6281026 Semiconductor device and method for manufacturing the same |
| 08/28/2001 | US6279227 Method of forming a resilient contact structure |
| 08/23/2001 | WO2001061763A1 Sealing film for solar cell and method for manufacturing solar cell |
| 08/23/2001 | WO2001061754A1 Semiconductor device fabrication method and semiconductor device fabrication device |
| 08/23/2001 | US20010015890 Electronic component module and piezoelectric oscillator device |
| 08/23/2001 | US20010015652 Probe card assembly and kit, and methods of making same |
| 08/23/2001 | US20010015496 Semiconductor device and method for the fabrication thereof |
| 08/23/2001 | US20010015488 Method of constructing stacked packages |
| 08/23/2001 | US20010015487 Stackable chip package with flex carrier |
| 08/23/2001 | US20010015485 Higher-density memory card |
| 08/23/2001 | US20010015444 Opto-electric mounting apparatus |
| 08/23/2001 | DE10006505A1 Leistungshalbleiter-Modul aus einer Vielzahl von parallel zueinander geschalteten IGBT-Chips Power semiconductor module consisting of a plurality of parallel-connected IGBT chips |
| 08/23/2001 | DE10006445A1 Leadframe Interposer Leadframe interposer |
| 08/23/2001 | DE10005754A1 Power semiconductor circuit with oscillation suppression, and auxiliary emitter connection formed on copper island isolated from surrounding copper coating |
| 08/22/2001 | EP1126526A2 Light emitting device and optical device using the same |
| 08/22/2001 | EP0596075B1 Non-conductive end layer for integrated stack of ic chips |
| 08/21/2001 | US6278871 Integrated circuit including a low-dispersion capacitive network |
| 08/21/2001 | US6278616 Modifying memory device organization in high density packages |
| 08/21/2001 | US6278291 Programmable logic array devices with interconnect lines of various lengths |
| 08/21/2001 | US6278199 Electronic single switch module |
| 08/21/2001 | US6278190 Semiconductor device |
| 08/21/2001 | US6278181 Stacked multi-chip modules using C4 interconnect technology having improved thermal management |
| 08/21/2001 | US6278179 Power electronic device |
| 08/21/2001 | US6278138 Silicon-based functional matrix substrate and optical integrated oxide device |
| 08/21/2001 | US6277704 Microelectronic device fabricating method, method of forming a pair of conductive device components of different base widths from a common deposited conductive layer |
| 08/16/2001 | WO2001060119A2 Lighting body |
| 08/16/2001 | WO2001059841A1 Three-dimensional interconnection method and electronic device obtained by same |
| 08/16/2001 | WO2001059840A1 Leadframe interposer |
| 08/16/2001 | US20010014490 Method of manufacturing semiconductor integrated circuit device |
| 08/16/2001 | US20010014489 Back-to-back semiconductor device module, assemblies including the same and methods |
| 08/16/2001 | US20010014488 Multi chip semiconductor package and method of construction |
| 08/16/2001 | US20010014487 Hybrid S.C. devices and method of manufacture thereof |
| 08/16/2001 | US20010013650 Circuit interconnect providing reduced crosstalk and simultaneous switching noise |
| 08/16/2001 | US20010013646 Semiconductor device, method for manufacturing same and portable device |
| 08/16/2001 | US20010013643 Semiconductor integrated circuit device |
| 08/16/2001 | US20010013573 Photosensor-amplifier device |
| 08/16/2001 | US20010013512 Electric heater for a motor vehicle |
| 08/16/2001 | US20010013422 Electronic interconnection medium having offset electrical mesh plane |
| 08/16/2001 | DE10004410A1 Semiconductor device for discrete device with contacts on lower side - has second metallisation provided on second main side of chip, lying flush with surface, for carrying signals |