| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 10/04/2001 | US20010026008 Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device |
| 10/04/2001 | US20010025993 Semiconductor device |
| 10/04/2001 | US20010025964 Connecting device for power semiconductor modules with compensation for mechanical stresses |
| 10/04/2001 | EP1139705A1 Printed wiring board and method of producing the same |
| 10/04/2001 | EP1139421A2 Insulated power multichip package |
| 10/04/2001 | EP1139411A1 Flip-chip semiconductor assembly with backside contacts |
| 10/04/2001 | EP1139325A1 True color flat panel display using an LED dot matrix and LED dot matrix drive method and apparatus |
| 10/04/2001 | DE10045193A1 Cooling system has electrically mutually insulated semiconducting chips has individual chip cooling systems arranged in cooling body so as to be electrically isolated from each other |
| 10/03/2001 | CN1316102A Data storage processing apparatus, and method for fabricating |
| 10/02/2001 | US6297960 Heat sink with alignment and retaining features |
| 10/02/2001 | US6297666 Fully programmable and configurable application specific integrated circuit |
| 10/02/2001 | US6297598 Single-side mounted light emitting diode module |
| 10/02/2001 | US6297552 Commonly housed diverse semiconductor die |
| 10/02/2001 | US6297551 Integrated circuit packages with improved EMI characteristics |
| 10/02/2001 | US6297549 Hermetically sealed semiconductor power module and large scale module comprising the same |
| 10/02/2001 | US6297548 Stackable ceramic FBGA for high thermal applications |
| 10/02/2001 | US6297460 Multichip module and method of forming same |
| 10/02/2001 | US6297074 Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof |
| 10/02/2001 | US6297063 In-situ nano-interconnected circuit devices and method for making the same |
| 09/27/2001 | WO2001072092A1 Gate driver multi-chip module |
| 09/27/2001 | WO2001071824A1 Method and device for transferring spin-polarized charge carriers |
| 09/27/2001 | WO2001071806A1 Semiconductor device, method of manufacturing electronic device, electronic device, and portable information terminal |
| 09/27/2001 | US20010025364 Three-dimensional MCM, method for manufacturing the same, and storage medium storing data for the method |
| 09/27/2001 | US20010024389 Memory module |
| 09/27/2001 | US20010024368 Modular led assembly |
| 09/27/2001 | US20010024300 Sensor chip, image reading sensor, and electronic device |
| 09/27/2001 | US20010023994 Semiconductor device and the method for manufacturing the same |
| 09/27/2001 | US20010023992 Highly integrated system-on-chip system with non-volatile memory unit |
| 09/27/2001 | US20010023980 Stacked semiconductor device and semiconductor system |
| 09/27/2001 | US20010023702 Solar cell module and method of producing the same |
| 09/27/2001 | DE10014804A1 LED containing illumination module for use in cars, has conductor tracks for convection and radiation of heat generated to LED and carrier of insulating material |
| 09/27/2001 | DE10012734C1 Illumination kit for illumination, display or notice purposes has plug connector with contacts in row along edge of each light emitting module to mechanically/electrically connect modules |
| 09/27/2001 | CA2402850A1 Method and device for transferring spin-polarized charge carriers |
| 09/27/2001 | CA2342020A1 Sensor chip, image reading sensor, and electronic device |
| 09/26/2001 | EP1137332A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 09/26/2001 | EP1137067A2 Multi-chip ball grid array ic packages |
| 09/26/2001 | EP1137066A2 Semiconductor device and process of production of same |
| 09/26/2001 | EP1135807A1 Scalable data processing apparatus |
| 09/26/2001 | EP1135802A1 Three-dimensional packaging technology for multi-layered integrated circuits |
| 09/26/2001 | EP1135693A1 Probe card for probing wafers with raised contact elements |
| 09/26/2001 | CN1315056A Integrated electronic micromodule and method for making same |
| 09/26/2001 | CN1314982A Vehicle headlamp and a vehicle |
| 09/26/2001 | CN1314981A Vehicle headlamp and a vehicle |
| 09/26/2001 | CN1314708A 半导体装置 Semiconductor device |
| 09/25/2001 | US6295220 Memory bar and related circuits and methods |
| 09/25/2001 | US6295205 Explosion protection for semiconductor modules |
| 09/25/2001 | US6295201 Bus bar having embedded switching device |
| 09/25/2001 | US6294909 Electro-magnetic lithographic alignment method |
| 09/25/2001 | US6294839 Apparatus and methods of packaging and testing die |
| 09/25/2001 | US6294838 Multi-chip stacked package |
| 09/25/2001 | US6294837 Semiconductor interconnect having laser machined contacts |
| 09/25/2001 | US6294830 Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer |
| 09/25/2001 | US6294406 Highly integrated chip-on-chip packaging |
| 09/20/2001 | WO2001069693A1 Light-emitting semiconductor device and surface-emitting device |
| 09/20/2001 | WO2001069680A2 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 09/20/2001 | WO2001069679A1 Vertical electrical interconnections in a stack |
| 09/20/2001 | WO2001069675A1 Method for making a flexible circuit interposer having high-aspect ratio conductors |
| 09/20/2001 | WO2001050525A8 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 09/20/2001 | US20010023088 Stacked semiconductor device including improved lead frame arrangement |
| 09/20/2001 | US20010022564 Led display assembly |
| 09/20/2001 | US20010022495 LED lamps |
| 09/20/2001 | US20010022395 Cooling structure for multichip module |
| 09/20/2001 | DE10011633A1 Anordnung zur Verschaltung von Leistungshalbleiterchips in Modulen Arrangement for connection of power semiconductor chips in modules |
| 09/19/2001 | EP1134849A1 Illumination set for use in illuminating, displaying or indicating and an electrical plug connector for such a set |
| 09/19/2001 | EP1134807A2 Semiconductor device |
| 09/19/2001 | CN1071508C Rectifier for alternator, particularly for motor vehicles |
| 09/19/2001 | CN1071491C 半导体封装件 Semiconductor package |
| 09/18/2001 | US6292368 Electrical power component mounted by brazing on a support and corresponding mounting process |
| 09/18/2001 | US6292022 Interconnect structure for a programmable logic device |
| 09/18/2001 | US6291896 Functionally symmetric integrated circuit die |
| 09/18/2001 | US6291894 Method and apparatus for a semiconductor package for vertical surface mounting |
| 09/18/2001 | US6291892 Semiconductor package that includes a shallow metal basin surrounded by an insulator frame |
| 09/18/2001 | US6291880 Semiconductor device including an integrally molded lead frame |
| 09/18/2001 | US6291877 Flexible IC chip between flexible substrates |
| 09/18/2001 | US6291309 Semiconductor device and method for manufacturing the same |
| 09/18/2001 | US6291270 Revealing localized cutting line patterns in a semiconductor device |
| 09/18/2001 | US6291267 Process for underfilling chip-under-chip semiconductor modules |
| 09/18/2001 | US6291259 Stackable ball grid array semiconductor package and fabrication method thereof |
| 09/18/2001 | CA2202426C Mounting structure for a semiconductor circuit |
| 09/13/2001 | WO2001067833A1 A printed circuit board assembly with improved bypass decoupling for bga packages |
| 09/13/2001 | WO2001067511A2 Method of forming a stacked-die integrated circuit chip package on a wafer level |
| 09/13/2001 | US20010021582 Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices |
| 09/13/2001 | US20010021542 Technique for underfilling stacked chips on a cavity MLC module |
| 09/13/2001 | US20010021115 Half-bridge module |
| 09/13/2001 | US20010021105 Circuit module |
| 09/13/2001 | US20010020897 Tag IC |
| 09/13/2001 | US20010020742 Stacked semiconductor device and method for manufacturing the same |
| 09/13/2001 | US20010020741 Semiconductor memory module having double-sided stacked memory chip layout |
| 09/13/2001 | US20010020740 Low profile multi-IC chip package connector |
| 09/13/2001 | US20010020735 Semiconductor device |
| 09/13/2001 | US20010020705 Semiconductor light emitting device and display device using the same |
| 09/13/2001 | US20010020683 Two-dimensional image sensor |
| 09/13/2001 | US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | US20010020535 Circuit pack, multilayer printed wiring board, and device |
| 09/13/2001 | DE10104708A1 Electronic circuit unit has electrical and mechanical connection between IC terminal(s) and further component so latter is held by base body, lead through casing to electrical equipment |
| 09/13/2001 | DE10054962A1 Power module has insulating substrate with semiconducting power component, control substrate with control IC for controlling power component, conducting bearer plate and housing |
| 09/13/2001 | DE10009171A1 Stromrichter und sein Herstellverfahren Converter and its manufacturing method |
| 09/13/2001 | DE10008572A1 Power semiconductor module for e.g. vehicular and industrial controls, contains substrate with sleeves connected to it, to grip pins making electrical connection with circuit board |
| 09/13/2001 | CA2400805A1 Method of forming a stacked-die integrated circuit chip package on a wafer level |