Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2005
10/19/2005EP1586117A1 Method for producing microsystems
10/19/2005CN2735547Y Electric crystal capable of stably erecting wafer
10/19/2005CN1685509A Electronic package with back side cavity mounted capacitors and method of fabrication therefor
10/19/2005CN1685508A Electronic module having canopy-type carriers
10/19/2005CN1685499A Press pack power semiconductor module
10/19/2005CN1685471A Methods and systems for processing a substrate using a dynamic liquid meniscus
10/19/2005CN1685280A Illumination device for backlighting an image reproduction device
10/19/2005CN1685177A Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
10/19/2005CN1684281A Light emitting device and fabrication method thereof and light emitting system using the same
10/19/2005CN1684280A Integrated AC type LED lamp filament
10/19/2005CN1684240A Semiconductor device, method for producing the same, circuit board, and electronic apparatus
10/19/2005CN1224102C Stacked semiconductor device
10/19/2005CN1224097C Semiconductor device and manufacture method thereof, circuit board and electronic device
10/19/2005CN1223975C Colour mixture full coloured LED display module
10/18/2005US6956743 Electronic component, in particular regulator for generators in motor vehicles
10/18/2005US6956741 Semiconductor package with heat sink
10/18/2005US6956322 Semiconductor light emitting device with stacked light emitting elements
10/18/2005US6956297 Electronic circuit unit that is easy to manufacture and method of manufacturing the same
10/18/2005US6956284 Integrated circuit stacking system and method
10/18/2005US6956244 Opto-electronic device integration
10/18/2005US6956193 Highly sensitive imaging camera for space applications including detection of ultrahigh energy cosmic rays
10/18/2005US6956174 Tip structures
10/18/2005US6955976 Method for dicing wafer stacks to provide access to interior structures
10/18/2005US6955945 Memory expansion and chip scale stacking system and method
10/13/2005WO2005096397A1 Laminate type thin-film solar cell and production method therefor
10/13/2005WO2005096374A1 Electronic product comprising an electrical component and a cast mass for electrical insulation of the component and method for production of the product
10/13/2005WO2005094240A2 Reconfigurable processor module with stacked die elements
10/13/2005WO2005020290A3 Pv wind performance enhancing methods and apparatus
10/13/2005WO2004053934A3 Led package die having a small footprint
10/13/2005US20050227412 Flexible multi-chip module and method of making the same
10/13/2005US20050226383 Apparatus, system, and method for high flux, compact compton x-ray source
10/13/2005US20050224993 Adhesive of folded package
10/13/2005US20050224962 Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
10/13/2005US20050224959 Die with discrete spacers and die spacing method
10/13/2005US20050224949 Semiconductor device and method of fabricating the same
10/13/2005US20050224947 Three-dimensional multichip stack electronic package structure
10/13/2005US20050224945 Power semiconductor device package
10/13/2005US20050224944 Stacked semiconductor device
10/13/2005US20050224943 Semiconducting device with stacked dice
10/13/2005US20050224942 Semiconductor device with a plurality of ground planes
10/13/2005US20050224934 Circuit device
10/13/2005US20050224926 Integrated circuit device having flexible leadframe
10/13/2005US20050224921 Method for bonding wafers to produce stacked integrated circuits
10/13/2005US20050224919 Spacer die structure and method for attaching
10/13/2005US20050224909 Power semiconductor switching-device and semiconductor power module using the device
10/13/2005US20050224830 Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
10/13/2005US20050224822 Light-emitting diode array having an adhesive layer
10/13/2005US20050224815 Optical semiconductor component
10/13/2005US20050224813 Light-emitting device and manufacturing process of the light-emitting device
10/13/2005US20050224109 Enhanced function photovoltaic modules
10/13/2005DE10393219T5 Überspannungsschutzmodul und Stromrichtervorrichtung Overvoltage protection module and power converter apparatus
10/13/2005DE102004014354A1 Opto-electronic component with radiation characteristic matched to desired complex imaging containing light emitting chip and component body with light outlet surface(s), which includes partial outlet surface(s), not in single plain, etc
10/13/2005DE102004012979A1 Kopplungssubstrat für Halbleiterbauteile und Verfahren zur Herstellung desselben Coupling of the same substrate for semiconductor devices and methods for making
10/12/2005EP1583925A2 Concentrating solar energy receiver
10/12/2005CN2733593Y Electric interference isolated transistor structure
10/12/2005CN1682381A 白色发光装置 White light emitting device
10/12/2005CN1682365A Support plate for a semiconductor component
10/12/2005CN1682199A Nonvolatile RAM and memory circuit thereof
10/12/2005CN1681121A Crystal coated sealing structure of light-emitting diodes
10/12/2005CN1681108A Electronic circuit device having silicon substrate
10/12/2005CN1681078A Semiconductor device, and method and apparatus for manufacturing semiconductor device
10/12/2005CN1223097C Thick film millimeter wave transceiver module
10/12/2005CN1222995C Mixed IC device
10/12/2005CN1222991C Wiring method and element arragning method using the same, and method of producing image display devices
10/11/2005US6954013 Controller and rectifier for an electrical machine, and electrical machine
10/11/2005US6953998 Unmolded package for a semiconductor device
10/11/2005US6953994 Wireless coupling of staked dies within system in package
10/11/2005US6953991 Semiconductor device
10/11/2005US6953987 Composite integrated circuit device having restricted heat conduction
10/11/2005US6953748 Method of manufacturing semiconductor device
10/11/2005US6953709 Semiconductor device and its manufacturing method
10/06/2005WO2005094144A1 Circuit device and method for manufacturing same
10/06/2005WO2005093862A2 Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
10/06/2005WO2005093834A1 Chip stacking semiconductor device
10/06/2005WO2005092070A2 Vertically stacked semiconductor device
10/06/2005WO2005091854A2 Ventilated photovoltaic module frame
10/06/2005WO2005045903B1 Method for making a flat-top pad
10/06/2005US20050221581 Wafer stacking using copper structures of substantially uniform height
10/06/2005US20050221538 Resin encapsulated semiconductor device and the production method
10/06/2005US20050221533 Method of making chip package with grease heat sink
10/06/2005US20050221531 Carrier substrates and conductive elements thereof
10/06/2005US20050219827 Electrical circuit device
10/06/2005US20050219781 Electronic card with protection against aerial discharge
10/06/2005US20050218518 Semiconductor device assemblies and packages including multiple semiconductor device components
10/06/2005US20050218509 Semiconductor substrate with interconnections and embedded circuit elements
10/06/2005US20050218502 Capacitor-mounted wiring board and method of manufacturing the same
10/06/2005US20050218500 Split-gate power module for suppressing oscillation therein
10/06/2005US20050218497 Through electrode, spacer provided with the through electrode, and method of manufacturing the same
10/06/2005US20050218495 Microelectronic assembly having encapsulated wire bonding leads
10/06/2005US20050218492 Optical semiconductor device and a method for manufacturing the same
10/06/2005US20050218489 Semiconductor device
10/06/2005US20050218468 Micro-reflectors on a substrate for high-density LED array
10/06/2005US20050218432 Semiconductor apparatus having a large-size bus connection
10/06/2005US20050218426 Power semiconductor module
10/06/2005US20050218194 Wire bonding apparatus
10/06/2005US20050217787 Tape automated bonding with strip carrier frame assembly
10/06/2005US20050217716 Photovoltaic power generation system
10/06/2005DE19802347B4 Stapelbares Halbleitersubstrat und stapelbare Halbleiterbaugruppe sowie Herstellungsverfahren derselben und Herstellungsverfahren eines stapelbaren Halbleiterbaugruppenmoduls A stackable semiconductor substrate and stackable semiconductor package as well as manufacturing methods thereof, and preparation process of a stackable semiconductor assembly module
10/06/2005DE102005010156A1 Integrierte Schaltung mit Umlenkungsschicht und Anordnung aus gestapelten Einzelschaltkreisen Integrated circuit with deflection layer and arrangement of stacked single circuits
10/06/2005DE102005008339A1 Leuchtdiode (LED) und Herstellungsverfahren dafür Light emitting diode (LED) and production method thereof
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