Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2005
11/02/2005CN1692503A A light-emitting diode
11/02/2005CN1691492A Power module and electric transportation apparatus incorporating the same
11/02/2005CN1691342A 半导体器件 Semiconductor devices
11/02/2005CN1691329A Multi-level packaging for memory module
11/02/2005CN1691328A White light LED assembly and making method thereof
11/02/2005CN1691327A Semiconductor device
11/02/2005CN1691326A Method and apparatus involving capacitively coupled communication within a stack of laminated chips
11/01/2005US6961230 Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
11/01/2005US6961190 Bulk lens, light emitting body, lighting device and optical information system
11/01/2005US6960827 Semiconductor device and manufacturing method thereof
11/01/2005US6960826 Multi-chip package and manufacturing method thereof
11/01/2005US6960824 Structure and method for fabrication of a leadless chip carrier
11/01/2005US6960717 Adjustable solar panel
10/2005
10/27/2005WO2005101939A1 Mounting plate for electronic components
10/27/2005WO2005101934A1 Composite electronic component and method for producing the same
10/27/2005WO2005101926A2 Apparatus, system, and method for high flux, compact compton x-ray source
10/27/2005WO2005101925A2 Apparatus, system, and method for optical pulse gain enhancement for high-finesse external cavity
10/27/2005WO2005101535A2 High density led array
10/27/2005WO2005101511A1 Photovoltaic module with an electric device
10/27/2005WO2005101504A1 Power module
10/27/2005WO2005101503A2 Device, in particular intelligent power module with planar connection
10/27/2005WO2005101502A1 An integrated circuit, a method and an assembly for manufacturing the integrated circuit, and a mobile phone having the integrated circuit
10/27/2005WO2005101492A2 Stacked die bga or lga component assembly
10/27/2005WO2005101491A2 Micropede stacked die component assembly
10/27/2005WO2005101476A1 Semiconductor element and semiconductor element manufacturing method
10/27/2005WO2005101475A1 Semiconductor element and semiconductor system
10/27/2005WO2005100016A2 Light-emitting panel and optically effective foil
10/27/2005WO2005065064A3 Power potential-free module having a high insulation voltage
10/27/2005WO2005059993A3 Packaging substrates for integrated circuits and soldering methods
10/27/2005WO2005008730A3 Low cost, high performance flip chip package structure
10/27/2005US20050239234 Method of making assemblies having stacked semiconductor chips
10/27/2005US20050239227 Light emitting diode component
10/27/2005US20050237747 Card-type LED illumination source
10/27/2005US20050237722 Power module comprising at least two substrates and method for producing the same
10/27/2005US20050236709 Multiple chip semiconductor package and method of fabricating same
10/27/2005US20050236706 Semiconductor device and hybrid integrated circuit device
10/27/2005US20050236705 Wire bonding system and method of use
10/27/2005US20050236698 Semiconductor device in which semiconductor chip is mounted on lead frame
10/27/2005US20050236696 Fan out type wafer level package structure and method of the same
10/27/2005US20050236628 Light-emitting apparatus and illuminating apparatus
10/27/2005US20050236623 Semiconductor device
10/27/2005DE19920444B4 Verfahren zum Herstellen eines Halbleiterbausteins sowie Halbleiterbaustein A method of manufacturing a semiconductor device and semiconductor module
10/27/2005DE10393437T5 Halbleiterbauelementbaugruppe A semiconductor device assembly
10/26/2005EP1589589A1 Light emitting diode lamp and manufacturing method thereof
10/26/2005EP1588424A2 Integrated photovoltaic roofing system
10/26/2005EP1588319A1 Module for a hybrid card
10/26/2005CN1689158A Concentrating solar energy receiver
10/26/2005CN1688954A Scalable computer system having surface-mounted capacitive couplers for intercommunication
10/25/2005US6958868 Motion-free tracking solar concentrator
10/25/2005US6958544 Semiconductor device and method of manufacturing the same
10/25/2005US6958537 Multiple chip semiconductor package
10/25/2005US6958534 Power semiconductor module
10/25/2005US6958533 High density 3-D integrated circuit package
10/25/2005US6958532 Semiconductor storage device
10/25/2005US6958488 Organic EL light emitting device and electronic apparatus
10/25/2005US6958259 Method of stacking semiconductor element in a semiconductor device
10/25/2005US6957906 LED light source mimicking a filamented lamp
10/20/2005WO2005099310A2 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
10/20/2005WO2005099110A2 Radio front-end module with passive circuit elements monolithically integrated in a semiconductor substrate and with an integrated circuit connected to said substrate
10/20/2005WO2005098971A1 A light emitting diode device, a light emitting diode dispersing heat device and an illuminating apparatus in which including aforesaid device
10/20/2005WO2005098949A2 Spacer die structure and method for attaching
10/20/2005WO2005098941A2 Integrated circuit stacking system and method
10/20/2005WO2005022591A3 Reversible leadless package and methods of making and using same
10/20/2005US20050233567 Method of manufacturing multi-stack package
10/20/2005US20050233518 Electronic circuit device having silicon substrate
10/20/2005US20050233504 Device transfer method and display apparatus
10/20/2005US20050233497 Method of forming a multi-die semiconductor package
10/20/2005US20050233125 Laminated glass and structural glass with integrated lighting, sensors and electronics
10/20/2005US20050232844 Reversible oxidation of carbon nanotubes
10/20/2005US20050231990 Semiconductor device
10/20/2005US20050231983 Method and apparatus for using light emitting diodes
10/20/2005US20050231925 Semiconductor device and method for manufacturing the same
10/20/2005US20050231922 Functional printed circuit board module with an embedded chip
10/20/2005US20050231304 Integrated passive devices fabricated utilizing multi-layer, organic laminates
10/20/2005US20050230845 Portable telephone
10/20/2005US20050230843 Flip-chip type semiconductor devices and conductive elements thereof
10/20/2005US20050230842 Multi-chip flip package with substrate for inter-die coupling
10/20/2005US20050230835 Semiconductor device
10/20/2005US20050230829 Semiconductor device
10/20/2005US20050230826 Semiconductor device and multilayer substrate therefor
10/20/2005US20050230820 Power semiconductor arrangement
10/20/2005US20050230812 Electronic component comprising a multilayer substrate and corresponding method of production
10/20/2005US20050230807 Power semiconductor module
10/20/2005US20050230806 Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
10/20/2005US20050230805 Semiconductor device, method for producing the same, circuit board, and electronic apparatus
10/20/2005US20050230804 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
10/20/2005US20050230802 Stacked die BGA or LGA component assembly
10/20/2005US20050230801 Semiconductor device
10/20/2005US20050230800 Thermally enhanced stacked die package and fabrication method
10/20/2005US20050230799 Multi-chip module with embedded package and method for manufacturing the same
10/20/2005US20050230797 Chip packaging structure
10/20/2005US20050230796 Semiconductor integrated circuit
10/20/2005US20050230795 LSI package provided with interface module, and transmission line header employed in the package
10/20/2005US20050230692 Light emitting device and fabrication method thereof and light emitting system using the same
10/20/2005DE202005011804U1 Illuminating diode used in electronics comprises a support with chips for producing a uniform light mixture through its electrical connection
10/20/2005DE10297823T5 Verfahren zum Kapseln intergrierter Schaltungen und über das Verfahren hergestellte integrierte Schaltungsbausteine Method for encapsulating intergrated circuits and integrated circuit chips produced on the procedure
10/20/2005CA2560701A1 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
10/19/2005EP1587151A2 Semiconductor light emitting device and fabrication method thereof
10/19/2005EP1587141A2 Method and apparatus involving capacitively coupled communication within a stack of laminated chips
10/19/2005EP1586120A2 Fast switching power insulated gate semiconductor device
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